tape bonding 中文意思是什麼
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Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding.
133節的內容既涉及熱壓連接工藝本身，也涉及了自動連接的傳送帶技術。 -
Dalian kerui economics trade co., ltd. sell tapes for bonding in industry, reclosable fasteners, adhesives, polish and grind material, anti - electrostatic and insulation tape america 3m company, heat shrinkable tubing, wire and cable, electrical thermal wire and system america raychem company, masterbatch hanna - wilson, silicone products ge toshiba company and electrostatic electronic hydrotreater, water tank self - cleaning sterilizer beijing enfi company
公司經銷美國3m各種工業用單雙面膠帶尼搭扣粘接劑拋光研磨材料防靜電材料絕緣膠帶美國瑞侃公司單雙層熱縮管鉸鏈薄壁耐高溫導線電伴熱線及系統漢納威爾遜色母料ge東芝有機硅產品和各種靜電水處理器水箱自潔消毒器。 -
Figure 7 shows the sequence for tape bonding the chip and assembling the package.
圖7所示為帶狀引線連接晶元和管殼裝配的工藝程序。 -
Bonding structure and plastic : maxxon all the joints size lap, to adopt additional protection bao - belt take overlap joints used in combination of both methods and closure tape strengthen the protection, and it is designed specifically for marine use, this design yachts given stern plate on the floor of the high durability
粘合結構和膠： maxxon的接縫是全部尺寸搭接，為了額外的保護採用保強帶在搭接縫內採用重迭方法並結合內外封膠帶做加強保護，並且它的設計是專為航海使用的，這種設計賦予遊艇艉板的地板部分極高的耐用性。 -
Tape automated bonding
膠帶自動接合 -
Tab mechanical standardization of semiconductor devices - part 5 : recommendations applying to tape automated bonding of integrated circuits
半導體器件的機械標準化第5部分:用於集成電路載帶自動焊 -
Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding
13 3節的內容既涉及熱壓連接工藝本身，也涉及了自動連接的傳送帶技術。 -
Andorin optoelec technology inc. established in 1999. as lcd module manufactory our capcapabilities are cob ( chip - on - board ), and tab ( tape automated bonding ). we provide extensive and complete solutions based on customer needs
安的利光電科技有限公司成立於1999年，主要產品是液晶顯示模組，包括cob及tab產品系列。我們可根據客戶要求提供方案，以滿足客戶的需要。 -
Mechanical standardization of semiconductor devices - recommendations applying to tape automated bonding of integrated circuits
半導體器件機械標準化.第5部分:集成電路膠帶自動粘合推薦標準 -
Mechanical standardization of semiconductor devices - part 5 : recommendations applying to integrated circuit packages using tape automated bonding
半導體器件的機械標準化.第5部分:使用自動粘結裝置用於集成電路包裝的推薦規程
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