temperature limit 中文意思是什麼

temperature limit 解釋
溫度極限
  • temperature : n. 1. 溫度，氣溫。2. 體溫。3. 〈口語〉發燒，高燒。
  • limit : n. 1. 界限，界線；邊界。2. 極限，限度；限制。3. 〈pl. 〉范圍，范域。4. 限價；限額；賭注限額；獵物限額。vt. 1. 限制，限定。2. 減少。adj. -able
  1. The model of the itr between a1n and cu is built by using the acoustic mismatch model, amm and diffuse mismatch model, dmm. because there is a limit of roughness and temperature in amm and dmm, the data of the theory model that is directly built by amm and dmm is far from the experimental data. accordingly, with dmm and traditionary methods, the mathematics model is posed by contrast and analyses of the experiment data

    由於聲失配理論和散聲失配理論對溫度和粗糙度有很嚴格的要求，所以直接建模所得的理論數據與實驗數據有很大的差距，本文採用聲失配理論與傳統研究方法相結合，通過與實驗數據的分析擬合，提出了修正的數學模型，預測誤差有了大幅度的提高。
  2. The lower limit of temperature at which this occurs is known as the softening point or critical temperature.

    呈現這一性質的溫度下限稱為軟化點或臨界溫度。
  3. Therrnogravimetric analysis at heating rates 5, 10, 15 and 20 c / min was used to study the decomposition kinetics of the pdms / pma ipn in ni and in air by using tg and dtg, and the upper limit of the temperature was 700 c. it was found that ipn began to decomposite at 350 c. the process of the thermal degradation was multiple steps, the curve of the rate of thermal decomposition had two peaks, one of which lied between 400 c ~ 420 c and the other lied between 500 c ~ 540 c, the result corresponded to the components of ipn

    在熱分解動力學研究中，通過在兩種氣氛中，分別以5 、 10 、 15和20 min四種升溫速率條件下，採用tg - dtg聯動測試， ipn材料在350開始熱分解。熱分解速率存在兩個峰值，一個分解峰值在400 420之間，另一個在500 540之間，這與ipn結構中包含兩組分相對應，同時發現當緩慢升溫時，特別是在空氣氣氛中，兩個分解峰減弱，熱分解趨向於一個連續過程。
  4. The endurance limit is reduced for temperatures above room temperature.

    溫度高於室溫，持久極限則降低。
  5. How to set the upper limit and lower limit temperature

    怎樣設置溫度上限下限和化霜周期？
  6. In recent years, the colossal magneto - resistance effect in rare - earth manganite perovskites of the type lni. xaxmno3 ( where ln is rear - earth irons la2 +, nd2 +, p2 + ; a is alkaline earth iron ca2 +, sr2 +, ba2 + ) has attract considerable attention in scientific studies due to its potential application. however, the poor temperature dependence of mr and the low - temperature mr effect and the ideal mr only in high field severely limit their practical utility. in this work, we prepared manganite perovskite lai - xsrxmno3 and soft - magnetic ferrite materials fe2o3 and ( ni, zn ) fe2o4 by using sol - gel method separately

    近些年來，人們發現在鈣鈦礦錳氧化物ln _ （ 1 - x ） axmno _ 3 （ ln為la ， nd ， pr等稀土金屬元素； a為ca ， sr ， ba等堿土金屬元素）中具有磁電阻（ magnetoresistance ）效應，由於它在磁記錄，磁傳感器方面具有廣泛的應用前景，同時也向傳統的磁記錄材料提出了挑戰，因而引起了物理學界的廣泛關注。
  7. Comparison of calculation methods of limit of superheat temperature of liquid helium

    液氦極限過熱度計算方法比較
  8. It shows that the injection quantity and the difference of temperature distribute as a parabola which is at the same load, and the minimum of the parabola corresponds to the optimum quantity of injection ( g ). under the condition that the quantity of injected mass, the air speed and the heat quantity is respectively g, v and q, the research demonstrates that the pentium iv chip ' s temperature variation can be controlled under 40c and work normally when the wind speed overpass 1. 5m / s and the power dissipation of the chip is 60w. otherwise this paper calculates the flooding limit of thermosiphon with several different methods

    對其充灌量、散熱量、電子元件（ cpu模擬晶元）表面與環境溫度之差及通風、流速的影響進行了系統的測試，發現充液量與溫差的關系在負荷不變時呈拋物線分佈，其極小值點對應的充液量是最佳充液量g 。在充液量為g時，對風速v 、散熱量q進行的研究表明，當風速超過1 . 5m / s后，奔騰晶元在60w發熱條件下晶元溫度小於40 ，能滿足長期正常工作。
  9. Safety of machinery - temperatures of touchable surfaces - ergonomics data to establish temperature limit v for hot surfaces

    確定熱表面溫度限值的工效學數據
  10. Safety of machinery - temperatures of touchable surfaces - ergonomics data to establish temperature limit values for hot surfaces

    機械安全可接觸表面溫度確定熱表面溫度限值的工效學數據
  11. Ergonomics of the thermal environment - temperatures of touchable hot surfaces - guidance for establishing surface temperature limit values in product standards with the aid of en 563

    熱環境人類工效學.可接觸表面的溫度.藉助en 563規定產品標準中表面溫度限值指南
  12. The ingaas / gaas strained quantum well lasers are able to work with extremely low threshold current density, high characteristic temperature and high cod limit, which make ld lasers achieve higher output power and longer ufe. therefore, ingaas / gaas strained quartum wellstructures can be used for the fabrication of high power semiconductor lasers

    Ingaas / gaas應變量子阱激光器具有級低的閾值電流密度、較高的特性溫度和較高的光學災變損傷閾值，這使得激光器具有更高的輸出功率和更長的壽命。因此ingaas / gaas應變量子阱結構可以用於大功率半導體激光器的制備。
  13. The upper temperature limit in this country is about 27 centigrade

    這個國家的最高溫度大約為攝氏27 。
  14. Integrated circuits require less power and lower voltages than the equivalent macroscopic circuits, consequently they operate at lower temperatures, and individual components may be closed together without exceeding the operating temperature limit

    參考譯文：集成電路比等效的分離元件電路功率小，工作電壓低，因而可以在較低的溫度下工作，電路中包含的單個元件可以緊靠在一起而不超過工作溫度極限。
  15. Now if we suppose that the rated temperature limit of any chip were identical, confining the highest temperature in the rated limit is the most important, for this purpose i apply the principle of annealing algorithm to the optimization of place distribution design. under the unvaried condition of thermal dispersion, we can get the least temperature of the maximum value in some kind of chip array

    為了使得電子元件最大溫度負荷在特定散熱狀態下達到最低（低於額定的最高溫度值） ，我們將模擬退火演算法的優化設計思想應用到電子元件陣列的布局優化中，使得在不改變外部散熱條件的情況下，僅僅通過電子元件位置分佈的改變就取得降低其最高工作溫度的效果。
  16. The operating temperature limit of teflon - coated probes is 200 c, regardless of pipe diameter

    無論探頭的直徑是多少，應用特氟綸保護的測溫探頭最高只能耐溫200 c
  17. Increasing scale of integration and consumption of power has led to the significant increase in power densities encountered in modern electronic equipment. if we do not pay attention to the thermal management of electronic equipment, the large amount of heat generated by the electronic device would not be under the control. especially in some atrocious surroundings, some devices " working temperature would exceed the rated temperature limit and lead to deteriorate the system stabilization or even make the hole system disabled

    現代電子設備的集成度不斷提高、功耗不斷加大，使得熱流密度急劇上升，如果我們在設計階段不注重電子設備的散熱設計，那麼元件所產生的熱流將得不到有效控制，特別是在工作環境比較惡劣或電子設備比較復雜的情況下某些元件的工作溫度就有可能上升到導致整個電子系統的工作不穩定乃至失效。
  18. Biodinetic temperature limit

    生物活動溫度臨界
  19. Determination for temperature limit of brittleness for vulcanized rubbers

    硫化橡膠脆性溫度限值的測定
  20. Temperature limit controller

    溫度限制控制器
分享友人
分享到 Line

分享到臉書