test methods of printed boards 中文意思是什麼
test methods of printed boards
解釋
標準:印製板測試方法-
Test methods of platness for printed boards
印製板翹曲度測試方法 -
Test methods of plating and coating thickness by beta backscattering for printed boards
印製板鍍塗覆層厚度測試方法反向散射法 -
Test methods of plating adhesion by adhesive type for printed boards
印製板鍍層附著力試驗方法膠帶法 -
Test methods of prepreg for multilayer printed wiring boards
多層印製電路板用半固化片的試驗方法 -
. coatings for loaded printed wire boards conformal coatings - methods of test
承載印製電路板用塗料 -
Test methods of pull strength for printed boards
印製板拉脫強度測試方法 -
Printed wiring boards - methods of test
印製電路板.第2部分:測試方法 -
Test methods of copper - clad laminates for printed wiring boards
印製電路包銅層壓板的試驗方法 -
Test methods of copper - clad laminates for flexible printed wiring boards
柔性印製電路板用包銅層壓板的試驗方法 -
Test methods of peel strength for printed boards
印製板抗剝強度測試方法 -
Test methods of printed boards
印製板測試方法 -
Test methods of thermal shock for printed boards
印製板耐熱沖擊試驗方法
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