thin boards 中文意思是什麼

thin boards 解釋
厚度2毫米以下
  • thin : adj (thinner; thinnest)1 薄的 (opp thick); 瘦的 (opp fat stout); 細小的;【印刷】細體的。2 ...
  • boards : 板墻
  1. Bismaleimide specifications - specification no. 19 - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范.製造多層印製板用的規定可燃性能的薄比斯瑪勒米德
  2. Specifications. specification no. 19. thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范:多層印製電路板構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物玻璃纖維編織包銅疊層板材
  3. Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印製電路用基體材料.用於多層印製板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板
  4. Thin epoxide woven glass fabric copper clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

    限定燃燒性的薄覆銅箔環氧玻璃布層壓板
  5. Thin polyimide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    多層印製電路用限定燃燒性的薄覆銅箔聚酰亞胺玻璃布層壓板
  6. Base materials for printed circuits. part 2 : specifications - specification number 17 : thin polyimide oven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印刷電路用基材.第2部分:規范. 17號規范:多層印刷電路板製作用規定易燃性的聚酰亞胺機織玻璃纖維織物包銅層壓板
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