wafer end 中文意思是什麼
wafer end
解釋
晶圓測試完畢信號-
Chuck mark - a mark found on either surface of a wafer, caused by either a robotic end effector, a chuck, or a wand
卡盤痕跡-在表意任片圓晶面發現的由機械手、卡盤或托盤造成的痕跡。 -
The technical breakthroughs in growth of nd : cngg had been made. in particular, continuous laser operation was achieved from nd : cngg pumped by ld. when the crystal wafer was end - pumped by one bar of ld with 807nm wavelength, the cw laser output power of 123. 1 mw was obtained with slope efficiency of 22. 3 %
本論文用自動化熔體提拉技術成功生長出< 111 >方向的直徑25mm以上,長度80mm以上的平界面無核心nd : cngg單晶,確定了晶體結構和物相,測量了晶體的光譜性能,晶體消光比達到34db ,晶體生長技術有新的突破,實現了連續激光運轉,用單支807nm半導體激光二極體端面泵浦該晶體片子,在國內首次獲得123 . 1mw的1 . 062 m連續激光輸出,斜效率達22 . 3 % 。 -
Shortly followed, we successfully designed and assembled our complete " end to end " wafer production line including crystal growth, wire slicing, lapping, etching and polishing processes
緊接著即建構好銜接完整的晶圓加工生產線(由長晶、線切、研磨、拋光到超凈包裝) 。
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