wafer fabrication 中文意思是什麼

wafer fabrication 解釋
晶片製造
  • wafer : n 1 薄脆餅；薄餅一樣的東西；【物、無】圓片；薄片；晶片；【醫學】糯米紙〈包藥用的干糊片〉。2 （封...
  • fabrication : 成形加工
  1. September 8, 2007, intel broke ground on its first 300mm wafer fabrication facility in asia

    2007年9月8日，英特爾在亞洲的第一座300毫米晶圓工廠大連晶元廠破土奠基。
  2. Among various fabrication techniques of thin film, the sol - gel process has gained much interest for the preparation of pzt thin film, due to ihe advantages of good homogeneity, easy control of composition, low in - ill i reaving temperature, easy formation of large area thin films pb ( zrxti : - k ) 0 :, ( pzt ) films were prepared on the ito coated glass plates and low resistor silicon wafer in sol - gel dip - coating process associated wi di heat treatment : at different temperatures and characterized by x - ray diffraction ( xrd ) and transmission electron microscopy ( tem ). lt is shown that the pzt ferroelectric thin films with ( 110 ) preferred orientation and well - crystallized perovskite structure can be obtained after annealing at 680 ? for 30 minutes on ito substrate and at 800 " c for lornin on silicon substrate

    Pzt的制備方法有很多，其中溶膠?凝膠（ sol - gel ）方法可以和集成電路（ ic ）光刻工藝相互兼容，處理溫度低，有大面積塗敷性能，能精確地控制組分，無需復雜的真空設備，成本低廉，所以對于集成鐵電薄膜電容的應用這種方法有很廣闊的前景。本文利用sol - gel技術在摻錫的in _ 2o _ 3透明導電薄膜（ ito ）襯底和低阻硅襯底上成功地制備了pzt鐵電薄膜。運用了x射線衍射， sawyer - tower電路和lcr電橋分別對薄膜的晶化溫度，結構和電學性能進行了測試。
  3. The processes include the deposition of the waveguide film, the design and fabrication of the mask pattern, the lithography, the metal coating with a magnetic sputtering, the lift - off process for the metal mask, the dry deep etching by icp, the slicing of the wafer, the polishing of the cutting edge, the fiber - to - waveguide alignment and at last, the performance testing. some edg chip samples are fabricated

    對設計好的集成波導器件，本論文設計並試驗了器件的製作的全部工藝，包括波導薄膜的沉積，掩模的設計製作，光刻，濺射金屬薄膜，剝離法製作金屬掩模，干法深刻蝕，矽片切割，端面磨拋，波導對準和性能測試。
  4. Scheduling rule for batch processing machines of semiconductor wafer fabrication facilities

    半導體生產線批加工設備調度規則
  5. Promote the manufacture of high value - added products, e. g. wafer fabrication, flip chip technology

    -增加了高附加值產品的生產，如無線電晶片、晶元等
  6. According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system ( swfs ), a dynamic bottleneck real - time dispatching ( dbrd ) strategy was proposed

    摘要針對半導體晶圓製造系統中瓶頸設備動態漂移的特性，提出一種動態瓶頸實時派工策略。
  7. At the same time, in order to maintain good fabrication quality, shorten the process time and meet the required due date, it is absolutely necessary to have good rework strategies for wafer rework so as to make up the wafer defects in the photolithography area

    為了顧及生產中在制品水平量、產品生?流程時間、產品交期等目標，必須要有良好的再加工策略處理晶圓的再加工。
  8. Tech projects of shenzhen, is a joint venture enterprise invested by shenzhen seg group, shenzhen investment holdings co., and seg ( hongkong ) co. ltd. the wafer fabrication production line has already put into use in 1997

    及賽格（香港）有限公司投資興建的專業半導體功率器件晶元及產品的生產企業，是深圳市的"高新技術企業" 、 "先進技術企業" 。
  9. Abstract : the progress of the aqueous solution cleaning technology for silicon wafer in very large scale integrated circuit fabrication is reviewed. the future of the aqueous solution cleaning technology is discussed as well

    文摘:本文綜述了超大規模集成電路製造過程中矽片溶液清洗技術的研究歷史及現狀，並對技術的未來發展進行了展望。
  10. The emphases is put on the operator staffing problem in semiconductor wafer fabrication and the decisions in two situations long - term and short - term using simulation method not traditional static model were brought forward

    摘要對半導體製造中員工人數的配置問題進行了研究，提出了操作工人數的長期決策和短期決策兩種情況，並用模擬模擬的方法對操作工數量需求進行動態研究，而非傳統的靜態模型。
  11. March 26th, 2007 intel announced plans to build a 300 - millimeter ( mm ) wafer fabrication facility ( fab ) in the coastal city of dalian, in northeast china ' s liaoning province

    2007年3月26日，英特爾宣布在大連投資25億美元，建立一座90納米技術的300毫米晶圓廠。
  12. Smic is a pure - play ic foundry that provides wafer fabrication of 8 - inch and 12 - inch wafers at 0. 35 - micron to 0. 11 - micron technologies

    中芯國際是一家純商業性晶元代工企業，提供0 . 35微米至0 . 11微米技術工藝的8英寸和12英寸晶元代工服務。
  13. Silicon grating is a period construction fabricated on the silicon wafer by micro fabrication techniques as ultraviolet lithography and anisotropic etching

    硅光柵是利用紫外光刻、各向異性腐蝕等硅微加工技術在矽片上製作的周期結構。
  14. While expensive eda tools are required for ic design, other types of equipment are also needed for other parts of the cycle, such as wafer fabrication, packaging, wafer bumping, testing, etc. currently, most hong kong ic design companies have to rely on overseas companies to perform these tasks

    集成電路設計工作須要利用昂貴的電子設計自動化工具，但周期內其他環節如晶圓加工、封裝、晶圓凸塊製造、測試等，卻需要其他類型的儀器。目前香港大部分集成電路設計公司均要依賴海外公司進行有關工作。
  15. A method to make blazed silicon gratings is designed. the fabrication of ( 100 ) and ( 111 ) silicon wafer grating is performed by bulk silicon techniques. the surfaces of silicon gratings have been tested by afm

    設計了一種製作閃耀硅光柵的方法，利用體硅加工技術分別進行了（ 100 ）面矽片和（ 111 ）面矽片光柵的製作，對光柵的表面進行了測試。
  16. A new agent - based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling

    摘要基於智能體技術，提出了晶元製造生產線動態調度新方法，實現了投料調度、工件調度與設備維護調度的集成。
  17. Wafer fabrication module

    圓片製造用組件
  18. Wafer fabrication line

    薄片製造線
  19. Esd is an issue not only for finished products but also during their manufacture, from wafer fabrication to packaging to the assembly of complete systems

    Esd的問題不僅對于成品來說很重要，在製造過程中（從晶圓製程、封裝到組裝整個系統）也是很重要的課題。
  20. We develop and market color filter liquid - crystal - on - silicon ( cf - lcos ) microdisplays for near - to - eye and projection display applications. imd has a network of strategic partners in wafer fabrication and cell assembly for volume production

    主要活動是把微型顯示技術的研究成果產品化，並與世界級的晶圓和液晶工廠策略聯盟，量產微型顯示器。
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