wafer level 中文意思是什麼

wafer level 解釋
圓片級
  • wafer : n 1 薄脆餅;薄餅一樣的東西;【物、無】圓片;薄片;晶片;【醫學】糯米紙〈包藥用的干糊片〉。2 (封...
  • level : n 1 水平儀,水準儀;水準測量。2 水平線,水平面;水平狀態;平面,平地。3 水平,水準;水位;標準;...
  1. The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.

    按照順序從每一塊掩膜版上將圖形一層一層地轉移到矽片的表面,就制得了成品集成電路。
  2. A novel package for microelectronics : wafer level package

    圓片級封裝
  3. Lead - free solder bumping technology for wafer level package

    圓片級封裝的無鉛焊料凸點製作技術研究
  4. Formation of electroplated solder bumps in wafer level packaging

    焊料凸點製作工藝
  5. Ultrathin wafer level chip size package technology

    超薄型圓片級晶元尺寸封裝技術
  6. Novel alignment technologies for wafer level packaging

    圓片級封裝的新穎對準技術
  7. Wlcsp wafer - level chip scale packaging technology

    晶圓片級晶元規模封裝技術
  8. Wafer - level packaging technology and application

    圓片級封裝技術及其應用
  9. The development of wafer - level packaging

    圓片級封裝技術展望
  10. Development and application of modern wafer - level packaging technology

    現代圓片級封裝技術的發展與應用
  11. The principle advantages of vcsels over conventional edge - emitting lasers lie in ultralow threshold current, small far - field divergent angle, high modulation frequency, potential for wafer level testing and the ease for single longitudinal mode operation and two - dimension integration. as a result they show considerable promise for applications such as optical fiber communication, parallel optical interconnects, optical information processing and neural networks, etc. a direct coupling theoretical model in quasi - three - dimension for the gain - wave guide vertical - cavity surface - emitting lasers has been created in this paper

    它與傳統的邊發射激光器相比具有更優越的特性,例如,具有極低的閾值、較小的遠場發散角、調制頻率高、易實現單縱模工作和二維集成,無須解理封裝即可進行在片測試等,所以,它被廣泛應用於光纖通訊、并行光互聯、光信息處理、光神經網路等領域。
  12. Wafer level csp

    晶圓級封裝
  13. Therefore, the traditional testing of packaging format has been not enough, and it moves up to the wafer level

    因此,傳統使用封裝形式的測試已不敷需求,漸漸往上游回溯至晶圓層級,被晶圓形式所取代。
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