wafer level 中文意思是什麼
wafer level
解釋
圓片級-
The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.
按照順序從每一塊掩膜版上將圖形一層一層地轉移到矽片的表面,就制得了成品集成電路。 -
A novel package for microelectronics : wafer level package
圓片級封裝 -
Lead - free solder bumping technology for wafer level package
圓片級封裝的無鉛焊料凸點製作技術研究 -
Formation of electroplated solder bumps in wafer level packaging
焊料凸點製作工藝 -
Ultrathin wafer level chip size package technology
超薄型圓片級晶元尺寸封裝技術 -
Novel alignment technologies for wafer level packaging
圓片級封裝的新穎對準技術 -
Wlcsp wafer - level chip scale packaging technology
晶圓片級晶元規模封裝技術 -
Wafer - level packaging technology and application
圓片級封裝技術及其應用 -
The development of wafer - level packaging
圓片級封裝技術展望 -
Development and application of modern wafer - level packaging technology
現代圓片級封裝技術的發展與應用 -
The principle advantages of vcsels over conventional edge - emitting lasers lie in ultralow threshold current, small far - field divergent angle, high modulation frequency, potential for wafer level testing and the ease for single longitudinal mode operation and two - dimension integration. as a result they show considerable promise for applications such as optical fiber communication, parallel optical interconnects, optical information processing and neural networks, etc. a direct coupling theoretical model in quasi - three - dimension for the gain - wave guide vertical - cavity surface - emitting lasers has been created in this paper
它與傳統的邊發射激光器相比具有更優越的特性,例如,具有極低的閾值、較小的遠場發散角、調制頻率高、易實現單縱模工作和二維集成,無須解理封裝即可進行在片測試等,所以,它被廣泛應用於光纖通訊、并行光互聯、光信息處理、光神經網路等領域。 -
Wafer level csp
晶圓級封裝 -
Therefore, the traditional testing of packaging format has been not enough, and it moves up to the wafer level
因此,傳統使用封裝形式的測試已不敷需求,漸漸往上游回溯至晶圓層級,被晶圓形式所取代。
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