wafer test 中文意思是什麼

wafer test 解釋
晶片試驗
  • wafer : n 1 薄脆餅；薄餅一樣的東西；【物、無】圓片；薄片；晶片；【醫學】糯米紙〈包藥用的干糊片〉。2 （封...
  • test : n 1 檢驗，檢查；考查；測驗；考試；考驗。2 檢驗用品；試金石；【化學】試藥；（判斷的）標準。3 【化...
  1. One of the most important advancements recently for electroglas has been in gaining greater control over the z direction of the wafer prober, which affects the accuracy and impact force of touchdowns on wafers and enables their customers to effectively test even the most recent types of delicate devices

    其中伊智公司最近最重要的一個進步就是：實現了對于晶圓探針臺z方向的更大程度的控制，這直接影響到探針接觸晶圓的精確性和沖擊力，為客戶提供了高效率的測試；即使是最新型的精細器件。
  2. Measurement challenges for on - wafer rf - soc test

    晶圓上測試射頻系統級晶元的挑戰
  3. Test method for sub - surface damege of gallium arsenide polished wafer by x - ray double crystal diffraction

    砷化鎵拋光片亞損傷層的x射線雙晶衍射試驗方法
  4. The scratching test was carried out with a single diamond tool to study the removal mechanism of litao3 wafer by load. the ae signals were measured, and the scratched surfaces of litao3 wafers in different conditions were observed by metallography microscope

    通過單顆粒金剛石壓入鉭酸鋰晶片光滑表面的劃痕實驗，研究鉭酸鋰晶片的機械力學性能和斷裂破壞情況，尋找合理的拋光壓力。
  5. Wafer test probe test

    晶圓測試探針測試
  6. Internal and outsource wafer sort / final test support, abnormal yield analysis

    中測、成測生產線支持，成品率異常分析。
  7. Mechanical test wafer - a silicon wafer used for testing purposes

    機械測試晶圓片-用於測試的晶圓片。
  8. At present, the problem in testing sheet resistance for micro - areas is that probes must be set up at the suitable locations by handwork. in order to know the wafer ' s impurity distributing, we need test many times, so will waste a lot of time. if the wafer ' s diameter would be 300mm, this problem will be more serious. in this paper, image analysis is introduced, through pre - processing and edge picking - up, the probe tips are recognized. then probe tips will be aligned respectively in two perpendicular directions through driving stepper motors. thus the distribution of sheet resistance for whole wafer is got by automatic testing and it offers information for detecting the impurity distribution and the diffusion uniformity

    這樣，完成200mm （ 8時）圓片雜質的擴散分佈需要對許多圖形進行測試，需要花費很長的時間，當測試300mm矽片時問題就更為突出。本文將圖象與視覺測量系統引入四探針測試系統中，對採集到的原始探針圖像進行預處理、邊緣提取等操作，以便實現探針針尖的識別，然後由電機控制實現探針的自動定位。這樣測試系統可以自動獲得全片的薄層電阻分佈，為超大規模集成電路檢測雜質分佈和擴散的均勻性提供信息。
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