wheel feed 中文意思是什麼
wheel feed
解釋
立盤式排肥器-
Main purpose of carbo rubber control regulating wheel, which not only drives work piece to run, but also can control in feed crossing speed during machine operation
無心調整輪主要用途除了與主輪帶動工件運轉外，並可在機臺作業時做進刀及橫送速度之控制，已達工件精度之要求。 -
Main purpose of carbo rubber control regulating wheel, which not only drives work piece to run, but also can control in feed crossing speed during machine operation. that achieved the precision requirement of work piece
無心調整輪主要用途除了與主輪帶動工件運轉外，並可在機臺作業時做進刀及橫送速度之控制，已達工件精度之要求。 -
Influences of feed rate on machining precision during grinding metal ceramics blade by diamond grinding wheel
進給速度對磨削金屬陶瓷刀片精度的影響 -
Resinoid bonded wheel using on those machines which running with the more in feed or bigger grinding pressure
特別進刀量大且研磨壓力大時用樹脂法b -
Fluted - wheel feed of sower
播種機.外槽輪排種器 -
Brush feed wheel
刷式排種輪 -
Grinding feature is to use work piece for a slow - speed operation, and wheel spindle selects a high - speed revolution and offers a minor amount of in - feed to cooperate with mechanical spinde for forward and backward movement for finishing grinding jobs
研磨特性是利用工作物做慢速運轉，而砂輪心軸采高速回轉並給予微量進刀配合機械心軸前後運動完成研磨作業。 -
Work piece will not burnt if in - feed of wheel up to 0. 02mm
進刀量可大至2條不燒焦。 -
It is especially suited hard to grind workpiece hardness hrc50 to hrc62. work piece will not burnt if in - feed of wheel up to 0. 03mm
特別適合難研削工件硬度hrc50至hrc62 ，進刀量可大至3條不燒焦。 -
Bonded abrasive products. deep cut and creep feed grinding wheel
普通磨具.深切緩進給磨砂輪 -
This paper introduces an innovative design of m1050 centerless grinding machine which provides automation for feed mechanism, regulation & compensation of wheel & guide wheel and parts inspection in addition, the design principle is also described with a detailed illustration on structure design of the automatics above - mentioned
摘要介紹了m1050無心磨床自動進給、砂輪、導輪自動修正與補償裝置的改造設計及自動測試裝置的設計，闡述了設計原理，詳細介紹了裝置的結構設計。 -
Wheel diameter is based mainly from 254mm to 510mm, suitable for a diameter process of general - precision core shaft. main work piece can be grinded right left crossing movement fixed direct - feed and fixed beveled angle
砂輪直徑以254 510為主，適用一般精密芯軸外徑加工，主要加工物可做左右橫送式移動研磨固定式直送研磨及固定式斜角度研磨。 -
The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement
研究結果表明，增大砂輪軸向進給速度和減小工件轉速，採用粗粒度砂輪有利於提高磨削矽片的材料去除率，砂輪軸向進給速度對材料去除率的影響最為顯著；適當增大砂輪轉速，減小砂輪軸向進給速度，採用細粒度砂輪可以減小磨削表面粗糙度；在其它條件一定的情況下，砂輪速度超過一定值會導致材料去除率減小，主軸電機電流急劇增大，表面粗糙度變差；採用比# 2000粒度更細的砂輪磨削時，材料去除率減小，矽片表面粗糙度沒有明顯改善。 -
By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated
摘要利用基於自旋轉磨削原理的矽片超精密磨床，通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。 -
Rush feed turns the filter wheel to remove solids that saves manual washing
目篩網轉輪，轉輪圓周設有集水槽，收集進流水使濾網轉動達到清除固體物之目的。 -
4 suitable wheel speed, crossing speed and in - feed
4穩定的回轉速度及推進速度
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