子元件 的英文怎麼說

中文拼音 [ziyuánjiàn]
子元件 英文
sub element
  • : 子Ⅰ名詞1 (兒子) son 2 (人的通稱) person 3 (古代特指有學問的男人) ancient title of respect f...
  • : Ⅰ量詞(用於個體事物) piece; article; item Ⅱ名詞1. (指可以一一計算的事物) 2. (文件) letter; correspondence; paper; document
  1. Bistable optoelectronic element

    雙穩態光電子元件
  2. The analysis of delamination and fracture in ic packages

    濕熱導致電子元件封裝脫層斷裂的分析
  3. Or a supplier in des moines needed confirmation that a small electronic part would be delivered as promised to a valued customer in jackson, mississippi, within twenty - four hours

    或者德梅因一個已做出承諾的供應商需要確認一個小型電子元件在24小時內能送到密西西比州傑克遜的一位重要客戶手中。
  4. Tuzhuang equipment, environmental protection equipment, electronic components, electrostatic generator production, distribution

    塗裝設備、環保設備、電子元件、靜電發生器生產、經銷。
  5. It was during the early 1950's that the need for ever smaller electronic components became really insistent.

    到了五十年代初期,真正迫切需要更小的電子元件了。
  6. Electronic coponent marking ink

    子元件標記油墨
  7. Electronic components. connecting devices. circular multipole connectors

    子元件.連接裝置.圓形多極連接器
  8. Kn. electronic components. rf coaxial connectors with screw coupling type kn. general requirements

    子元件.帶螺口式耦合器的射頻同軸連接器
  9. Oeneral specifications of automatic taping machine for electronic components

    子元件自動編帶機通用規范
  10. It shows that the injection quantity and the difference of temperature distribute as a parabola which is at the same load, and the minimum of the parabola corresponds to the optimum quantity of injection ( g ). under the condition that the quantity of injected mass, the air speed and the heat quantity is respectively g, v and q, the research demonstrates that the pentium iv chip ' s temperature variation can be controlled under 40c and work normally when the wind speed overpass 1. 5m / s and the power dissipation of the chip is 60w. otherwise this paper calculates the flooding limit of thermosiphon with several different methods

    對其充灌量、散熱量、電子元件( cpu模擬晶)表面與環境溫度之差及通風、流速的影響進行了系統的測試,發現充液量與溫差的關系在負荷不變時呈拋物線分佈,其極小值點對應的充液量是最佳充液量g 。在充液量為g時,對風速v 、散熱量q進行的研究表明,當風速超過1 . 5m / s后,奔騰晶在60w發熱條下晶溫度小於40 ,能滿足長期正常工作。
  11. The research object of this thesis is a chip - array that is fixed on one of printed circuit boards ( pcb ), which are located in a forced air field ( forced convection ) in an electronic case ; and from the essential equations of airflow we can deduce the mathematical model of the turbulent flow ; then we can establish the finite element algorithm and apply the fe software to work out the equations of turbulent flow, finally we can use the software to display and analyse the field of flow and temperature

    本文以處于強迫空氣對流流場中的某pcb板及其板上的電子元件陣列作為研究對象,推導了紊流流場的數學模型,並建立了相應的有限求解格式,應用有限法分析軟體對該系統的紊流流場和溫度場進行了模擬分析:解算出pcb板上各電子元件的溫度分佈;並提出了用於求解系統風道特性曲線的cfd方法。
  12. Kbn. electronic components. miniature coaxial connectors with bayonet coupling kbn series. general requirements

    子元件.帶卡口式耦合器的微型同軸連接器
  13. Electronic components. connecting devices. multicontact board mounted connectors for pb with 2, 54 mm spacing. type he 12

    子元件.連接裝置.間距為2 . 54 mm的多觸點板上安裝式連接器. he 12型
  14. Electronic components. connecting devices. board mounted printed circuits connectors with contact and termination spacing of 1, 27 mm. type he 8. general requirements

    子元件.連接裝置.觸點和接線端間距為1 . 27 mm的板上安裝式印刷電路的連接器. he 8型.一般要求
  15. Electronic components under quality assessment. connecting devices. multicontact board mounted connectors for printed boards with 2, 24 mm spacing. type he 11. general requirements

    進行質量評估的電子元件.連接裝置.間距為2 . 24 mm的印刷電路板用多觸點板上安裝式連接器. he 11型.一般要求
  16. Electronic components. connecting devices. multicontact edge socket and board mounted connectors for double clad printed boards with 2, 54 mm spacing. type he 9. general requirements

    子元件.連接裝置.間距為2 . 54 mm的雙面印刷電路板用多觸點棱形插座和板上安裝式連接器. he 9型.一般要求
  17. Electronic components. connecting devices. multicontact edge socket and board mounted connectors for single clad printed boards with 2, 54 mm spacing. type he 7. general requirements

    子元件.連接裝置.間距為2 . 54 mm的單面印刷電路板用多觸點棱形插座和板上安裝式連接器. he 7型.一般要求
  18. Electronic components. chip carrier

    子元件.晶載體
  19. Uses the hi - fi electronic component, like high power circle transformer, acoustic special - purpose electric capacitor and so on

    採用hi - fi級電子元件,如大功率環形變壓器,音響專用電容等。
  20. The mian productions are : fibre optic cable 、 electronic device, etc

    主要產品有:光纖電纜、電子元件等。
分享友人