封準球 的英文怎麼說

中文拼音 [fēngzhǔnqiú]
封準球 英文
alignment with the ball
  • : Ⅰ名詞1 (標準) standard; guideline; criterion; norm 2 (目標) aim; target Ⅱ動詞1 (依據; 依照)...
  • : 名詞1 (以半圓的直徑為軸 使半圓旋轉一周而成的立體; 由中心到表面各點距離都相等的立體) sphere; glo...
  1. Using vb6 programming software, the different marked volume of corresponding absolute altitude for the horizontal vessel which have arbitrary ellipse head and spherical vessel can be calculated more rapidly and accurately, and the method was not restricted by vessel specifications

    摘要介紹了利用vb6編程軟體,快速確地計算出具有任意橢圓形頭的臥式容器及罐不同標高液位所對應體積的方法,該方法不受容器規格限制。
  2. The competitive tactics of < < commerce weekly > > depend on its unique " cover story ". its analysis and predicts of the global economy phenomenon, just as the advance of the concept " new economy ", frequently becomes the standard in the world when people discuss the financial events and economy phenomenon

    《商業周刊》的競爭策略在於它的「面故事」獨一無二,對全經濟現象的分析和預測如「新經濟」概念的提出,往往成為人們談論經濟事件和經濟現象的世界標
  3. 3. because traditional coupling system composed with cylinder lens and focus lens has the disadvantages of difficult to encapsulation and modulate, a new practical method brings forward : the output light from laser diode is collimated using a section of optical fiber with the diameter of 600 m instead of cylinder lens, and a sphere ? end lens

    3 .針對由柱透鏡和聚焦透鏡組成的組合透鏡耦合系統中存在的裝和調試困難等問題,提出了:用一段直徑為600 m的裸石英光纖代替柱透鏡,對半導體激光器輸出光束進行直整形;用透鏡光纖對直后的光束進行聚焦,直接實現和光纖耦合,來代替聚焦透鏡和光纖耦合的環節。
  4. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array

    半導體器件機械標化.表面安裝半導體器件裝外形圖繪制的一般規則.小螺距柵陣列的設計指南
  5. The results, for a first time out, were solid enough, as wang induced his trademark ground balls from the first inning on and gave new york 6 1 / 3 strong innings before reaching a predetermined pitch count

    在星期二對魔鬼魚的第一場先發,投得是有以往的水,從第1局開始就不斷展現滾地王子的號不斷的製造滾地出局,他主投了6又1 / 3局好,也達到教練團所設定的投數才下場。
  6. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for 1, 50 mm, 1, 27 mm and 1, 00 mm pitch ball and column terminal packages

    半導體裝置的機械標化.表面安裝的半導體裝置裝外形圖繪制的一般規則. 1 . 5mm 1 . 27mm和1 . 00mm樹脂和引線端子裝的設計指南
  7. Mechanical standardization of semiconductor devices - part 6 - 2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for 1, 50 mm, 1, 27 mm and 1, 00 mm pitch ball and column terminal packages

    半導體器件的機械標化.第6 - 2部分:繪製表面安裝半導體器件裝外形圖的一般規則. 1 . 5mm 1 . 27mm和1 . 00mm樹脂和引線端子裝的設計指南
  8. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體器件的機械標化.繪製表面安裝半導體器件裝外形圖的一般規則.焊網格陣列裝尺寸的測量方法
  9. Bga mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體裝置的機械標化.第6 - 4部分:表面安裝半導體裝置裝外形圖繪制的一般規則.狀網格陣列
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