封裝電路 的英文怎麼說

中文拼音 [fēngzhuāngdiànlù]
封裝電路 英文
encapsulated circuit
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. Low - voltage ac power circuit breakers used in enclosures

    封裝的低壓交流電源斷路器
  2. This paper presents a method that chopping wave is done by switch devices which consist of three - level resistance regulating module and intelligence power module ipm, and which realizes constant - current discharge of storage battery. to achieve the intelligence control of the drive protection and the discharge process of ipm, the paper designs circuit formed by igbt threshold drive pulse pwm signals. ipm fault - blocking protection circuit and microcomputer 80c196. the devices can accurately control the 0 ~ 150a discharge current and the discharge time of the storage battery and calculate the releasing power

    實現蓄電池恆流放電過程智能控制是蓄電池放電裝置發展的必然趨，本文提出了一種通過三極電阻調節模塊和由智能功率模塊ipm為開關器件進行斬波從而實現蓄電池恆流放電的方法。為達到對ipm的驅動保護和放電過程的智能控制，文中設計了igbt門極驅動脈沖pwm信號形成電路和ipm故障封鎖保護電路及由單片機80c196為核心的微機控制器。本裝置能夠對蓄電池進行0 150a放電電流及放電時間的精確控制及釋放容量的計算。
  3. Roadway lighting equipment - enclosed setback luminaires and directional floodlights for high - intensity - discharge lamps

    道路照明設備.高強度放電燈用封裝後置光源和直接泛光照明燈
  4. Test method for hermeticity of hybrid microcircuit packages prior to lidding

    混合微電路組件在封裝前的密封性的試驗方法
  5. By taking the miniature ceramic rod which is easily to machine high accuracy as sensitive structure, and by printing and polarizing six belt - shaped electrodes above it to constitute three pairs of electrodes, this paper designed package and the phase - sensitive detection circuit in the system so that it effectively reduced the sensitive structure size and improved its processing precision to realize the angular rate gyro microminiaturization

    首先採用易於加工成高精度的微型陶瓷棒作為敏感體，在其上印刷成六個帶狀電極並予以極化構成三副電極對，然後設計了封裝及相敏檢波電路，從而有效地減小了敏感結構的尺寸，提高了其加工精度，實現了角速率陀螺微型化。
  6. Thirdly, the paper discusses the driver of the peripheral equipment, how to port the uc / os - n and uclinux, h. 323 protocol and the application of the system in the digital speech classroom. also some software and hardware measure are adopted to enhance the system stability. at last, the shortcoming and the something to be improved are given. dsp can be used to realize real - time speech coding algorithm, and after porting ( ac / os - n, arm can manage the keyboard, the lcd and the ethernet peripheral etc. then the embedded network system with specific purpose can be used in others fields, such as pda, set of top, web tv, ect

    在實際設計實現中，為提高系統軟、硬體整體穩定性和可靠性，使用了以下幾種方法： （ 1 ）低電壓復位、抗電源抖動能力、增加時鐘監測電路、抗電磁干擾能力、散熱等技術； （ 2 ）多層pcb設計，線路板結構緊湊，電源部分採用數字5v 、 3 . 3v 、 3v 、 1 . 8v和模擬5v多電源供電； （ 3 ）選用表面貼和bga封裝的器件； （ 4 ）按照軟體工程的要求進行系統分析，規劃系統框圖、流程分析、模塊劃分，減小了不同模塊的相關性，從而最大限度避免了錯誤的發生。
  7. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  8. A novel low mechanical hysteretic ceramic capacitive pressure transducer has been made, by using of ceramic sealing technology ; integrate circuit ( ic ) technology and thick film plane fixing circuit technology. this transducer is made of a deformable ceramic diaphragm and a ceramic base plate, between which has an air cavum. a coaxial gold electrode was fired onto the diaphragm and the base plate

    本文利用新型陶瓷技術、集成電路技術和厚膜平面安裝電路技術，採用零力學滯后的陶瓷和陶瓷密封材料進行設計製造了一種非充液乾式的電容式壓力傳感器，該壓力傳感器由較厚的陶瓷基體和較薄的陶瓷膜片構成，中間形成一空氣介質腔，在基座和膜片之間內置同軸的雙電極，組成兩個電容，當膜片承受壓力時發生位移，使電容量產生變化，經後置處理電路直接轉換為可輸出的直流電壓信號。
  9. The unstability for steam content in the sealed devices is described, it mainly results from water vapor decomposed by bonding material of conductive adhesive under high temperature

    摘要簡述了集成電路陶瓷封裝內部水汽含量的不穩定性，主要是由粘接材料導電膠在高溫下分解釋放出的水汽所造成的。
  10. Major producers of electrical and electronic ceramics, engineering ceramics, ceramic thick - film integrated circuits, ceramics molybdenum, manganese, tungsten metal manganese, ceramic packages such as ceramics pieces

    主要生產電子電器陶瓷、工程陶瓷、陶瓷厚膜集成電路、陶瓷鉬錳、鎢錳金屬化、陶瓷封裝外殼等各種陶瓷瓷件。
  11. At first we analyze the working mode and equivalent circuit of the encapsulated impatt diode, by use of the matlab software

    首先分析了雪崩二極體的工作方式及其等效電路，利用matlab軟體對二極體封裝后的等效參數進行了編程計算。
  12. In the current production of integrate circuit ( ic ), we usually package the chip with chemical material to protect chips

    在當前的集成電路生產中，為了保護晶元，通常要用化學材料對晶元加以封裝。
  13. The second part introduces concepts and knowledge of the integrate circuit ( ic ) design and package. the third part introduces the realization of the routing algorithm and the

    （ 2 ）包括第二、三章，介紹了集成電路設計和封裝的概念和知識。
  14. This project is focused on microbolometer fpa. this program includes the development design and simulation tools, material research, fabrication process development, and detector and readout circuitry design, fabrication and characterization. the work done in this paper is described as follows : the theory of microbolometer fpa is expounded

    課題的重點放在非致冷微測輻射熱計焦平面陣列，這種非致冷紅外產品的設計研製工作包括：設計和模擬工具的研究、材料選擇和器件製作工藝的研究、探測器和讀出電路的設計研究、真空封裝和性能表徵的研究等。
  15. The resistance products have various types, and are for different lightning arrester, restrictive transformer, capacitor, electric machinery, vacuum switch, transformer neutral point sealed electrical instruments, cable, and railway line overvoltage

    該電阻片具有多種規格型號，用於組裝不同使用場所的避雷器，限制變壓器、電容器、電機、真空開關、變壓器中性點、全封閉電器、電纜、鐵道線路的過電壓。
  16. Note 1 : the integration is that mode for which adopts import the sensor with stainless steel isolation membrane and high - performance special amplification circuit be directly packed in the probe

    注1 :一體式是採用進口不銹鋼隔離膜片的傳感器和高性能的專用放大電路直接封裝在探頭中。
  17. Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages

    塑料封裝集成電路結構熱應力分佈的解析解
  18. The element of the pe, ceramic package and glass package circuit are mostly introduced, and the infection of saltfog test for them in theory is analysed

    摘要主要講述了塑封電路、陶封電路和玻璃封裝電路的成分，並對鹽霧試驗對它們的影響進行了理論分析。
  19. Today, a wide variety of materials and fabrication techniques enable suppliers to design stencils that meet the assembly challenges of fine - pitch technology, miniaturized components and densely packed boards

    今天，多種多樣的材料和製造技術時供應商能設計出的鋼網能迎接細微坡度，小型化部品和高密度封裝電路板的挑戰。
  20. The designing idea and method of laser resistor trimming machine is valuable for designing other laser processing equipments

    其設計思路和方法對其它激光加工設備（如表面封裝電容激光加工設備等）的實現有一定的借鑒價值。
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