晶元級封裝 的英文怎麼說
中文拼音 [jīngyuánjífēngzhuāng]
晶元級封裝
英文
chiscale package- 晶 : Ⅰ形容詞(光亮) brilliant; glittering Ⅱ名詞1. (水晶) quartz; (rock) crystal 2. (晶體) any crystalline substance
- 級 : Ⅰ名詞1 (等級) level; rank; grade 2 (年級) any of the yearly divisions of a school course; gra...
- 裝 : Ⅰ名詞1 (服裝) dress; outfit; attire; clothing 2 (演員的化裝品) stage makeup and costume Ⅱ動詞...
- 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
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Ultrathin wafer level chip size package technology
超薄型圓片級晶元尺寸封裝技術Wlcsp wafer - level chip scale packaging technology
晶圓片級晶元規模封裝技術Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density
多晶元組件( mcm )是微電子封裝的高級形式,它是把裸晶元與微型元件組裝在同一個高密度布線基板上,組成能夠完成一定的功能的模塊甚至子系統。Bsp supplies the simple interface to operate the peripheral chips conveniently. thus, real - time operating system ( rtos ) can start up from the various hardware successfully and response to the asynchronous event opportunely. on the other hand, rsp implements the encapsulation to rtos and brings up the process model according to the running character of the business layer, realizes the secondary process schedule inside task
一方面,支撐子系統bsp層(板級支撐包)的設計實現了對硬體層的封裝,這包括對cpu ( mpc8241 )的封裝和對外部晶元(串口、網口等)的封裝,通過這層封裝使得實時操作系統能夠成功啟動,及時響應異步事件,實現了硬體的基本功能,並且為上層提供了簡單易用的操作晶元的介面,隔離了軟體對硬體功能要求所必需的具體細節。分享友人