晶元級封裝 的英文怎麼說

中文拼音 [jīngyuánfēngzhuāng]
晶元級封裝 英文
chiscale package
  • : Ⅰ形容詞(光亮) brilliant; glittering Ⅱ名詞1. (水晶) quartz; (rock) crystal 2. (晶體) any crystalline substance
  • : Ⅰ名詞1 (等級) level; rank; grade 2 (年級) any of the yearly divisions of a school course; gra...
  • : Ⅰ名詞1 (服裝) dress; outfit; attire; clothing 2 (演員的化裝品) stage makeup and costume Ⅱ動詞...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Ultrathin wafer level chip size package technology

    超薄型圓片尺寸技術
  2. Wlcsp wafer - level chip scale packaging technology

    圓片規模技術
  3. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    組件( mcm )是微電子的高形式,它是把裸與微型件組在同一個高密度布線基板上,組成能夠完成一定的功能的模塊甚至子系統。
  4. Bsp supplies the simple interface to operate the peripheral chips conveniently. thus, real - time operating system ( rtos ) can start up from the various hardware successfully and response to the asynchronous event opportunely. on the other hand, rsp implements the encapsulation to rtos and brings up the process model according to the running character of the business layer, realizes the secondary process schedule inside task

    一方面,支撐子系統bsp層(板支撐包)的設計實現了對硬體層的,這包括對cpu ( mpc8241 )的和對外部(串口、網口等)的,通過這層使得實時操作系統能夠成功啟動,及時響應異步事件,實現了硬體的基本功能,並且為上層提供了簡單易用的操作的介面,隔離了軟體對硬體功能要求所必需的具體細節。
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