晶元組裝 的英文怎麼說

中文拼音 [jīngyuánzǔzhuāng]
晶元組裝 英文
chip mounting
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 組 : Ⅰ名詞1 （由不多的人員組成的單位） group 2 （姓氏） a surname Ⅱ動詞（組織） organize; form Ⅲ量詞（...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 組裝 : package; assembling; packaging組裝車間 composing room; 組裝船 fabricated ship; 組裝生產 assembly ...
  1. Through analysising the characteristics of the power system with floating neutral point deeply, the paper puts forward a new plan of single - phase to ground fault line selection on the base of s ' s signal injecton method and gives the hardware and software design. in this design, the high speed sampling and data processing is carried out through using dsp processor ; the large electrice current is drived through the application of a high - performance audio power amplifier and transformer ; the communication between host computer and detectors is realized through rs485 bus technology ; the difference multilevel frequency - selected amplifier is designed and the feeble signal of space is sampled on the base of the theory of magnetic induction ; the interface between dsp and exterior chip and rs485 interface logical is designed through using fpga ; the using of lcd module and keyboard interfacing chip makes the interface between human and machine ; the programme of host computer and detectors is designed through using blocking design method

    在本設計中，採用高速的dsp處理器，實現了對故障特徵信息的高速採集與處理;採用大功率的功放晶元與變壓器配合的方法，實現了大電流信號的驅動輸出;採用485總線技術，組建了裝置主機與多探測器之間的主從式通訊網路，實現了多干擾條件下裝置主機與多探測器的可靠通訊;設計了差分式多級選頻放大電路，採用磁感應的方法實現了對空間微弱信號的接收;利用fpga技術，實現了控制器與多外設的介面及數字信號的串並轉換;採用了先進的lcd液晶顯示模塊及鍵盤介面晶元，設計了人機信息交互的介面;採用了模塊化的軟體設計方法，開發了裝置主機及探測器的軟體程序。
  2. Once has the bandits and thieves to intrude guards against the place, the detector launches the wireless coded signal immediately, the networking center number which installs when is apart from defense area 150 meter within the main engine to send out the police whistle sound to report to the police immediately, reports to the police dials to establish in advance or reports to the police the telephone, the handset number, answers in the police telephone to return puts user pre - record to report to the police the pronunciation, long - distance reports to the police, simultaneously comes the real - time transmission through the internet to deploy troops for defense, to withdraw from a defended position, to report to the police and so on the condition, inquires the historic record through the computer network

    該系統還採用美國進口原裝晶元與先進的無線數字高頻技術微電腦cpu控制器主機組成。在防範地點安裝好主機后，並設置在布防狀態。一旦有盜賊闖入防範地點，探測器立刻發射無線編碼信號，安裝在距防區150米以內的主機立即發出警笛聲報警，報警時撥打預先設定的聯網中心號碼或報警電話手機號碼，接警電話里回放用戶預錄的報警語音，遠程報警，同時通過網際網路來實時傳遞布防撤防報警等狀態，通過電腦網路來查詢歷史記錄。
  3. Is the our company newest development new generation of intellectualization lives at home the security product, it comes in the opposite party through the internet to report to the police the main engine to carry on the management and the control, real - time grasps the main engine to deploy troops for defense, to withdraw from a defended position, to report to the police and so on the condition, but also may control in family s electric appliance through the computer network, through the network operation, realizes long - distance reports to the police the monitoring

    Sa - 2002 - dn系列是我公司最新開發的新一代智能化家居防盜產品，它通過網際網路來對家裡的報警主機進行管理與控制，實時掌握主機的布防撤防報警等狀態，還可以通過電腦網路來控制家裡的電器，通過網路操作，來實現遠程報警監控！該系統還採用美國進口原裝晶元與先進的無線數字高頻技術微電腦cpu控制器主機組成。在防範地點安裝好主機后，並設置在布防狀態。
  4. Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material

    本文對金剛石材料在多晶元組件熱性能改善和熱應力研究，對金剛石在多晶元組件封裝熱設計應用具有一定的參考價值和提供一定的理論依據。
  5. Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip

    本文根據實際的多晶元組件的封裝結構，建立了三維溫度場分析模型，分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型，分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。
  6. With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed. multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on

    多晶元組件（ multi - chipmodule即mcm ）封裝技術因組裝密度高，改善了頻率特性和傳輸速度等一系列優點獲得了迅速發展。
  7. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  8. Download now if your computer has a chipset that contains a pci to pci bridge connecting to a docking solution that also contains a pci to pci bridge

    如果您的計算機裝有晶元組，而且該晶元組所包含的pci到pci連接橋連接到也包含pci到pci連接橋的底座解決方案，那麼請立即下載此更新。
  9. Firstly, we present the conception and technology of software reuse, then deeply discuss key technologies of software reuse such as software component technology, software architecture and domain analysis, etc, whose software component, i. e. software chip, is the main part of software reuse ; software architecture is software framework, which can been reused as software framework of a large granularity and higher abstract level and offers the fundament and the context for component integration ; domain analysis concentrates on a special application domain so that the generality of the design of software component is not considered in wide range, meanwhile its ratio of the reuse increases

    本文首先敘述了軟體復用的概念和軟體復用技術，然後深入探討了軟體構件技術，軟體體系結構和領域分析等軟體復用中的關鍵技術，其中軟體構件技術（即軟晶元）是軟體復用的核心；軟體體系結構是軟體的骨架，可以作為一種大粒度的、抽象級別較高的軟體體系結構進行復用，並能夠為構件的組裝提供基礎和上下文；領域分析使軟體復用的目標集中在一個特定應用領域內，使構件的製作不需要在很廣的范圍內考慮其通用性，構件的復用率也相應增大。
  10. And designed a program used by this method to design a filter. the result complies with the analytic result. at the end of this paper, according to the project of airline broadcast, the author designd filter with high rectangular factor, five channelizing filter banks, saw programmable correlator implemented with multiplayer muti - chip technology, saw resonator

    本文的最後，結合某航空直擴數傳電臺的工程要求，設計了高矩形系數的前置濾波器、聲表面波濾波器組、採用多晶元組裝厚膜工藝技術的聲表面波可編程相關器和聲表面波壓控振蕩器，完成了解調解擴單元的硬體設計。
  11. Lightweight, removable head supports a wide range of components from extremely small chips to large parts, enabling a diverse range of production configurations

    搭載了輕型和裝卸式的貼裝工作頭，貼裝范圍從極小晶元到大型組件，能夠構築所有的生產型態
  12. In this paper outlining the characteristics of diamond substrate and problems to be faced with, and measures to be taken, introducing knowledge of multi - chips modules packaging

    本文首先綜述了熱沉用金剛石基板的特點和面臨的問題及相應的措施;並介紹了多晶元組件封裝技術相關知識。
  13. Chip device configuration

    晶元裝置組態
  14. Today, the most advanced alignment methods have used the technology of machine vision and image proceeding, by which the feature marks on dies or substrate are recognized or measured, by which machine movement equipments are leaded to complete alignment. die leveling and auto - focus usually be completed before vision - based alignment of die and substrate

    自動對準系統是自動貼片機中的關鍵組件之一，現階段最先進的對準方法是利用機器視覺和圖像處理技術來識別和測量微細標記特徵，然後反饋給控制系統引導機械裝置進行對準定位，在對準之前還必須對晶元進行「調平」以及實現「對焦」獲得清晰的標記圖像。
  15. In a world full of sbcs with loose power leads, giant " wall wart " power supplies, elaborate power requirements, and exposed chips, it s nice to have a box where, once the hard drive is in it, it takes a standard electrical outlet two - prong, even, for those of you in older houses and just works

    在一個全部由sbc組成的世界中，有鬆散的電源線，巨大的「 wall wart 」電源，復雜的電源要求，以及裸露的晶元，最好有一個機箱，這樣，一旦裝入了硬盤驅動器，它使用標準的插座（甚至是兩個尖頭的那種，用於老房子之中的）就可以正常工作。
  16. The new chi will not have four cores on a single slice of silicon, but i tead co ist of two dual - core chi stuck together

    新的晶元將不會在單個矽片上安裝四個內核，而是包含兩個了2個組合在一起的雙核晶元。
  17. The new chips will not have four cores on a single slice of silicon, but instead consist of two dual - core chips stuck together

    新的晶元將不會在單個矽片上安裝四個內核，而是包含兩個了2個組合在一起的雙核晶元。
  18. It is proved that thermal fatigue is the main cause of the invalidity of the package. therefore, it is significant to research the reliability of solder ball under the thermal cycle

    實踐證明熱作用是晶元封裝組件失效破壞的主導因素，因此熱循環條件下的焊點可靠性研究有著非常重要的意義。
  19. These were circuits on single chips with up to ten components on them, small - scale integration ( ssi )

    其實就是在一塊單獨的晶元上安裝了有十來個組件構成的電路，即小型集成電路（ ssi ） 。
  20. Coverage ranges from thermal properties and semiconductor materials to mosfets, digital logic families, memory devices, microprocessors, digital - to - analog and analog - to - digital converters, digital filters, and multichip module technology

    覆蓋范圍從熱性能和半導體材料的mosfet ，數字邏輯家庭，記憶體裝置，微處理器，數位類比和模擬到數字轉換器，數字濾波器，以及多晶元組件技術。
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