晶洞狀 的英文怎麼說

中文拼音 [jīngdòngzhuàng]
晶洞狀 英文
miarolitic
  • : Ⅰ形容詞(光亮) brilliant; glittering Ⅱ名詞1. (水晶) quartz; (rock) crystal 2. (晶體) any crystalline substance
  • : Ⅰ名詞(物體上穿通的或凹入較深的部分; 窟窿; 洞穴) hole; cavity Ⅱ形容詞(深遠; 透徹) profound; thorough; clear
  • : Ⅰ名詞1 (形狀) form; shape 2 (情況) state; condition; situation; circumstances 3 (陳述事件或...
  1. The geode - essentially a rock cavity which has become lined with crystalline deposits - is eight meters in length, 1. 8 metres wide and 1. 7 metres high ( 26 feet by six by six )

    這個-原本是巖石演變成線堆積物-是長8米,寬1 . 8米和高1 . 7米( 26英尺x六英尺x六英尺) 。
  2. The main ore structure include massive % vein > drusy structure, etc. the second type ore penetrates last type ore in some areas

    主要礦石構造為塊構造、脈構造、晶洞狀構造、聚鑲嵌構造等。
  3. Determined by dsc. whereafter, the surface micro - morphology of both sides of tini sma thin film deposited on glass was investigated by atomic force microscope ( afm ), and the difference of morphology between the two sides is observed. it has been shown that, in the growing surface of sputtered tini film, the trend of grain to accumulating along the normal direction like a column is clearly observed, and the grain is very loose which resulted in more microcavities, but in the surface facing to glass substrate, grain is so compact that there are hardly microcavities

    通過濺射法,在玻璃襯底上淀積了tini薄膜,並在600進行了真空退火, dsc法測得其馬氏體逆相變峰值溫度為75 ,利用原子力顯微鏡,對玻璃基tini形記憶合金薄膜的襯底面與生長面進行了表面微觀形貌分析,發現:生長面粒呈現出沿薄膜法線方向柱堆積的趨勢,粒緻密性差,微孔多;而襯底面粒緻密,幾乎沒有微孔存在。
  4. The analysis of microstructure of samples showed that the grain of tio2 were very small under 700, the distance of grain became small with temperature increasing, the rate and size of pore was decreasing. the relative density of sample at 900 was 97 % and the grain size of sintered body was about 200nm. when the temperature exceeded 1100, the grain size of body grew up several times ( > 2 m )

    Tio _ 2燒結體sem顯微形貌分析表明:低溫( 700 )時坯體內顆粒無明顯長大,燒結體緻密度不高( 80 )粒間距隨溫度升高而變小,氣孔率也隨之降低,氣孔尺寸變小;當溫度超過900時,粒間連接緊密,燒結體內出現大量絮物質,緻密度大幅度提高,達97以上,小氣孔已聚集成大孔且分佈均勻,粒長大不明顯( 200nm左右) ;當溫度超過1100時,燒結體緻密度有所提高,但粒尺寸出現異常長大,長大了十幾倍(達2 m以上) 。
  5. It is also found that the geometry of a flip - chip joint and void formation have stronger effects upon current crowding than the multi - phase nature of solder bumps does

    在本研究亦發現,覆接點的幾何形和孔對于電流聚集有很大的影響,其效應遠勝于焊料中的多相結構。
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