晶片加工 的英文怎麼說

中文拼音 [jīngpiānjiāgōng]
晶片加工 英文
wafer process
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 片 : 片構詞成分。
  • 工 : Ⅰ名詞1 （工人和工人階級） worker; workman; the working class 2 （工作; 生產勞動） work; labour 3 ...
  • 晶片 : chip; crystal plate; wafer
  1. Waxes for electron wafer binding : waxes for electron wafer binding, mainly used in precision process of micro electron wafer ( u piece, s piece or smd piece ), excellent strong adhesive ability, no scathe to element, cleanup easily after process

    電子晶片粘接蠟系列：主要用於微電子矽片或石英晶片（ u片、 s片或smd片）的精密加工，具有極強的附著力，對元件無任何損傷，使用后易去除。
  2. Chemical - mechanical - polishing ( cmp ) has been rapidly developing and finding extensive applications in the integrated circuit ( ic ) manufacturing industry for processing hard disk of computer and silicon wafer with super - smooth and flawless surface

    集成電路（ ic ）製造工業中，化學機械拋光（ chemicalmechanicalpolishing ， cmp ）廣泛應用於計算機硬盤片、硅晶片超光滑無損傷表面的加工。
  3. Prior to google, alan spent 15 years at digital compaq hp s western research laboratory where he worked on a variety of chip design and architecture projects, including the microtitan floating point unit, bips the fastest microprocessor of its era

    在他加入google之前， alan在digital compaq hp的西部研究室工作了15年，致力於各種晶片的設計及製造專案，其中包括當時最快的微處理器： microtitan floating point unit ， bips 。
  4. After being oriented, cutted and polished, the grown crystals was processed into a series of wafers

    將晶體進行定向、切割和拋光，加工成晶片，測定了稀土離子的分凝系數、晶體的晶胞參數和折射率。
  5. As czt wafer is so gentle and crisp that the surface processing is a hard task

    Czt晶片軟且脆，表面加工難度很大，很容易破碎。
  6. High - prcesion processing of silicon carbide

    單晶片的超精密加工
  7. Product this getting wet pouch active mt of packaging completely, main raw materials active mt one natural having special crystallization layers of silicate clay ore of form scarce, sublimated and processed and succeeded by special technology, one layer of forms tetrahedron and octahedra chip of it are arranged into six mao net, cause the crystalline grain to expand after absorbing water, pick up the moisture, get rid of oxygen, keeps fresh, anticorro sion, long result function, it is a kind of healthy green environmentally safe product

    本品是透濕性小袋包裝的活性mt ，主要原料活性mt是一種天然稀有的具特殊結晶層狀的硅酸鹽粘土礦，經特殊技術提純加工而成，它的層狀四面體和八面體晶片排成六角網格，吸水后引起晶格膨脹，具吸濕、除氧、保鮮、防蝕、長效功能，是一種健康綠色環保產品。
  8. Mainly for capacitance, semiconductor, jingzhen, resistance, ic chips, jiechajian procedures, connecting pieces, switching devices, silicon, triode, diode, piezoelectric ceramic base films, tubes, electron tubes, electronic stamping, precision metal parts, production processes between cleansing processes

    晶元接插件連接件轉接器矽片三極體二極體壓電陶瓷基片顯象管電真空器件等內精密電子沖壓五金零件，生產加工過程工序間的清洗。
  9. Moore estimates have been produced to date, nearly every one has been built on the “ ground level, ” directly on the surface of silicon crystals

    半導體工程師完成了一項令人意想不到的成就，就是讓微晶片里的電晶體密度加倍成長，這在業界稱為摩爾定律。
  10. Our company can offer pcb to the masses of customers and copy the board, change board, pcb design, principle picture make, bom from make, chip decipher and pcb produce, stick to scenes of processing a connected sequence. our aim : " quality first, the customer is the highest " we will do the best service for you with the biggest cordiality in any demand of yours, expect to cooperate, with you sincerely

    我司可為廣大客戶提供pcb抄板改板pcb設計原理圖製作bom單製作晶元解密以及pcb生產貼片加工一條服務。我們的宗旨： 「質量第一，客戶至上」您的任何需求我們都將以最大的熱誠為您做最好的服務，真誠期待與您合作。
  11. High - tech company engaged in research, development, and manufacturing of lubrication purification equipment

    -生產和加工各種規格的晶片晶塊和晶棒。
  12. The company s research was handsomely rewarded when the crystal growth team managed to produce its first 4 - inch ingot only one month after the arrival of new crystal puller. this first ingot weighing 6 kg is a 36o y - rotated cut crystal which is the most commonly used in rf saw applications

    這支36 ? y軸旋轉切型的晶棒，是現在手機內部射頻聲表濾波器最常用的切型，其重六公斤，四英寸直徑的可用部分超過80毫米長度，可以加工出100片以上的拋光片。
  13. So in one hand it requires the wafer ' s diameter to be more large in order to enhance the productivity, and on the other hand it puts forward more strict requirement about the crystal perfection and electricity character. especially the electronic character and the equality of micro - area in the crystal wafer has become the key factor to determine whether the device can be made on it or not. so the resistivity measurement of micro - area become one most important procedure in the chip machining. to ensure the produce quality of chip and the perfect performance of final production, the four - probe testing technology need to be deeply studied

    圖形日益微細化，電路尺寸不斷縮小，目前ic製造以8英寸、 0 . 13 m為主，預計在2007年左右將以12英寸、 65nm為主，這一方面要求圓片直徑不斷增大以提高生產率，另一方面對晶體的完美性、機械及電特性也提出了更為嚴格的要求。特別是微區的電學特性及其均勻性已經成為決定將來器件性能優劣的關鍵因素。因此，微區電阻率的測試成為晶元加工之中的重要工序。
  14. Silicon wafer machining mechanism, machining method and machining devices are summed up, research status is analyzed in its application, prospect on progress and research work for the future is conducted

    摘要歸納總結了硅晶片的加工原理、加工方法和加工設備，分析了硅晶片超精密加工的研究現狀，並對硅晶片超精密加工的發展趨勢和今後的研究工作進行了展望。
  15. Consequently, the first chip - trap proposal, put forward by a group at the california institute of technology in 1995, involved cooling the entire chip to near absolute zero using a bulky and expensive liquid - helium refrigerator

    所以， 1995年加州理工學院的一個小組首度提出晶片阱的構想，需要用龐大且昂貴的液態氦冷凍機，將整個晶片冷卻到接近絕對零度。
  16. Using the microwave selective heating property for materials, by setup equivalent equation, and first time inducing the electromagnetic field perturbation theory to the design of heating materials for substrate in mpcvd, three temperature distribution modes were established, including temperature distribution comprehensive mode of inhomogeneous plasma, temperature distribution composite mode of composite substrate materials, temperature distribution perturbation mode of composite materials, which ii provided an whole new technology route to the design of substrate heating system in mpcvd and guided the preparation of heating materials for substrate. and then the heating materials for substrate were designed and optimized to obtain large area homogeneous temperature distribution even larger than substrate holder ' s diameter. as an important part, this thesis researched the nucleation and growth of diamond films in mpcvd, systematically researched the effects of substrate pretreatment, methane concentration, deposition pressure and substrate temperature etc experimental technologic parameters on diamond films " quality on ( 100 ) single crystal silicon substrate in the process of mpcvd, characterized the films qualities in laser raman spectra ( raman ), x - ray diffraction ( xrd ), scanning electron microscopy ( sem ), infrared transmission spectra ( ir ), atomic force microscopy ( afm ), determined the optimum parameters for mpcvd high quality diamond in the mpcvd - 4 mode system

    該系統可通過沉積參數的精確控制，以控制沉積過程，減少金剛石膜生長過程中的缺陷，並採用光纖光譜儀檢測分析等離子體的可見光光譜以監測微波等離體化學氣相沉積過程；利用微波對材料的選擇加熱特性，通過構造等效方程，並首次將電磁場攝動理論引入到mpcvd的基片加熱材料的設計中，建立了非均勻等離子體溫度場綜合模型、復合介質基片材料的復合溫度場模型及復合介質材料溫度場攝動模型，為mpcvd的基片加熱系統設計提供了一條全新的技術路線以指導基片加熱材料的制備，並對基片加熱材料進行了設計和優選，以獲取大面積均勻的溫度場區，甚至獲得大於基片臺尺寸的均勻溫度區；作為研究重點之一，開展了微波等離體化學氣相沉積金剛石的成核與生長研究，系統地研究了在（ 100 ）單晶硅基片上mpcvd沉積金剛石膜的實驗過程中，基片預處理、甲烷濃度、沉積氣壓、基體溫度等不同實驗工藝參數對金剛石薄膜質量的影響，分別用raman光譜、 x射線衍射（ xrd ） 、掃描電鏡（ sem ） 、紅外透射光譜（ ir ） 、原子力顯微鏡（ afm ）對薄膜進行了表徵，確立了該系統上mpcvd金剛石膜的最佳的實驗工藝參數。
  17. A solid - state shear compounding technology based on pan - milling ( s3c ) has established, by which the graphite with weakly combined structure are exfoliated and then compounded with pp at nanoscale. the obtained pp / graphite nanocomposites have greatly enhanced electrical and thermal conductivity. their structures and properties were characterized by analysis of particle size and distribution, sem, tem, xrd, the electrical conductivity, the thermal conductivity and heat - decomposition temperature etc. by taking advantages of the layered inorganic fillers with a weak interaction between layers ( e. g

    磨盤碾磨剪切力場使pp分子鏈斷裂，相對分子質量減小，石墨的導熱和潤滑性能抑制pp的降解和粉碎，使pp / yep250 （膨脹石墨250倍）復合粉磨盤碾磨固相剪切復合技術及導電導熱pp /石墨納米復合材料的制備與性能體中， pp分子運動活性提高，結晶能力增強，為pp在熔融加工中進一步向己剝離的石墨片層間擴散，形成納米復合結構創造了條件。
  18. Applying amorphous ni - cu - p composite electroless plating as anticorrosion plating, the heat transfer performance of the fin - tube condensing heat exchanger processed by the plating - expanding - plating technology and the expanding - plating technology is experimentally studied

    摘要以非晶態鎳銅磷復合化學鍍層作為防腐鍍層，對採用先鍍后脹再鍍和先脹后鍍2種加工二藝的肋片管式冷凝換熱器進行了換熱性能實驗研究。
  19. Grain - oriented electrical steel sheet and strip delivered in the fully processed state

    加工完畢出廠的晶粒取向的電工鋼片和鋼帶
  20. The research of patch antennas based on photonic - bandgap ( pbg ) structures is a relatively new area. the goal is to improve the performance of the patch antennas by using the special features of pbg structures. though some good research results have been obtained by scientists in the world, there still exit some problems to be solved for improving the performaces and reducing the size, weight and cost

    雖然國內外已經在基底鉆孔型、地面腐蝕型、高阻抗表面型、 uc - pbg型、覆層型和軟表面型電磁（光子）晶體貼片天線等方面開展了研究，但是在這些研究中還遺留著多方面的問題有待解決，以顯著改善天線的性能指標，減少天線的體積，重量，降低天線的加工費用等。
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