晶片鍵合 的英文怎麼說
中文拼音 [jīngpiānjiàngě]
晶片鍵合
英文
wafer bonding-
Experiments were conducted to modify the bonding process to reduce the effects of the critical events
實驗證實，改進的鍵合工藝可以降低關鍵事件對晶片偏轉的影響。An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders
全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。The three dimensional temperature distribution of laser bonding with a gaussian thermal source is modeled using the finite element method
摘要在硅玻璃激光鍵合中，溫度場的分佈是影響晶片能否鍵合的關鍵因素。Based on the analysis of the digital image print head, we first discuss the key technique of the lcos projection display, including the cell characteristic and optical projection system characteristic, then the application of lcos for the digital image print head, its hardware system. this wins initial success for the color correction and system software of our digital image print head
論文在分析國內外數碼電子片夾的基礎上（第一章） ，首先論述了lcos投影系統的關鍵技術，著重分析了lcos投影儀中液晶盒特性以及投影系統光學特性，然後在此基礎上結合實際情況就現階段lcos用於數碼照片擴印系統的基本結構進行一些具體分析，並重點設計與分析了金成lcos數碼電子片夾的系統結構以及各個組成部分，為後面lcos數碼擴印系統的顏色校正以及數碼照片擴印系統軟體的研究提供了一定的基礎（第二章） 。The key stage of fabricating gene chip is pretreatment of glass surface including the processes of nh3h2o treatment, aminosilane treatment and aldehyde treatment. the pretreatment can grow active group that can bind probe effectively on the surface of glass slide. as a result, the actively treated glass slide can suit for fabricating in - situ synthesis high density gene chips
基因晶元制備技術的關鍵步驟是玻片表面預處理，即對玻片表面進行羥基化、氨基化和醛基化處理，使表面生長的活性基團能有效固定寡核苷酸探針，以滿足原位合成高密度基因晶元對玻片的要求。According to the request of this subject, we have developed the system hardware and software for the slave device and the inspection software running on the pc. in this paper all of the followings is illustrated detailedly, such as the research on the principles of measurement and its realization, three means of water - level measurement that are separately based on photo electricity coder, pressure sensor and potentiometer ; selection of the microchip, we choose an advanced integrated soc ( system on chip ) microchip c8051f021 as the main controller ; realization of signal sampling, processing and its conversion in the mcu ; application of high precision 16 bits adc cmos chip - - ad7705 in our system, designing its interface with the microchip and relevant program ; using a trickle charge timekeeping chip ds1302 in the system which can provide time norm and designing of its i / o interface and program ; additionally, a 4 ~ 20ma current output channel to provide system check - up using ad421. in the system, ad421, ad7705 and the microchip compose spi bus ; to communicate with the master pc, here we use two ways which are separately rs232 and rs485 ; moreover, there are alarm unit, keyboard unit, power supply inspection unit and voltage norm providing unit in the system
針對研製任務的要求，課題期間研製了下位機系統硬體和軟體，開發了上位機監控軟體，其中所作的具體工作包括：測量原理的研究和在系統中的實現，在本次設計中用三種方法來進行水位測量，分別是旋轉編碼器法、液位壓力傳感器法和可變電阻器法；主控晶元的選擇，我們選用了高集成度的混合信號系統級晶元c8051f021 ；實現了信號的採集和處理，包括信號的轉換和在單片機內的運算；高集成度16位模數轉換晶元ad7705在系統中的應用，我們完成了它與單片機的介面設計及程序編制任務；精確時鐘晶元ds1302在系統中的應用，在此，我們實現了用單片機的i o口與ds1302的連接和在軟體中對時序的模擬，該晶元的應用給整臺儀器提供了時間基準，方便了儀器的使用；另外，針對研製任務的要求，還給系統加上了一路4 20ma模擬信號電流環的輸出電路來提供系統監測，該部分的實現是通過採用ad421晶元來完成的，本設計中完成了ad421與單片機的spi介面任務，協調了它與ad7705晶元和單片機共同構成的spi總線系統的關系，並完成了程序設計；與上位機的通信介面設計，該部分通過兩種方法實現： rs232通信方式和rs485通信方式；系統設計方面還包括報警電路設計、操作鍵盤設計、電源監控電路設計、電壓基準電路的設計。In our system, the traditional instruments of well depth measureing and indicator diagram are combined into one. in the side of hardware, the embedded system with the core of 80c196 is designed. what ' s more, the system includes keyboard input, liquid crystal display and flash memorizer. in the side of software, there are some moudles such as the measurements of the well depth and indicator diagram, inquisition, communication, computing, demarcate, setting
本測井儀器將傳統的測井深儀器和測功圖儀器合二為一，硬體中設計了以80c196單片機為核心的嵌入式系統，並配有鍵盤和液晶顯示以及閃速存儲器；軟體包括測量、查詢、通訊、計算、標定和設置等模塊。Our analysis shows that the criterion for self - propagating wafer bonding is relevant to the dimensionless parameter
分析結果表明，晶片直接鍵合的條件與無量綱參數有關。Using the infrared transmission theory, which is to say that the bonding part of the sample can make the light pass, and the un - bonding part of the sample will block the light, at the same time, the unique method of cold lamp - house is used to manufacture the instrument of testing the wafer bonding quality in order to select the high quality one for the next technical research
摘要利用紅外透射原理，即根據鍵合晶片中鍵合部分可以透光而未鍵合部分幾乎不能透光的原理，同時採用冷光源的獨特方法構建了鍵合質量測試平臺以用於初步篩選符合下一步工藝探索的高質量鍵合晶片。In the present research, scanning electron microscope ( sem ), laser raman spectroscopy ( lrs ), x - ray photoelectron spectroscopy ( xrs ), x - ray diffraction ( xrd ) and electron probe micro analysis ( epma ) were utilized to investigate the difference in micro - structure and elements distribution between domestic and foreign pdcs. combined with analysis on current manufacturing process, the mechanism for the difference was discussed. scanning electron microscope ( sem ), laser granularity analysis, atom emission spectroscopy ( aes ) and plasma emission spectroscopy ( icpaes ) are also utilized to investigate the grain shape and impurities of key material - diamond power
本課題採用掃描電鏡、拉曼光譜、光電子能譜、 x -射線衍射分析、電子探針等方法分析了國內外聚晶金剛石-硬質合金復合片在微觀組織結構、元素成分分佈方面的差異，結合對現有燒結工藝的分析，研討了造成這些差異的機理；採用掃描電子顯微鏡、激光粒度分析、原子發射光譜、等離子發射光譜等方法對關鍵原材料-金剛石微粉的晶形、雜質含量進行了比較分析測試。This paper researches the integrating application of adaptive antenna array technology, spread - spectrum communication technology and transform - domain filter technology in shortwave communication area, basing on the background of improving on the shortwave communication equipments being used in chinese army, and all the key techniques mentioned above are implemented in a single fpga chip
本文以改造我軍現役短波通信設備為背景，研究了自適應天線陣技術、擴頻通信技術、變換域濾波技術等多種現代數字信號處理技術在短波通信中的綜合應用，並以單片超大規模fpga晶元為硬體處理平臺，對系統中的關鍵技術進行了設計與實現。Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field
摘要晶片直接鍵合技術是材料集成的一項新工藝，是近年來集成光電子領域的研究熱點之一。The criterion of microroughness for self - propagating wafer bonding is studied according to jkr contact theory, where the microroughness model is based on a sinusoidal distribution for gap height and gap length
摘要根據jkr接觸理論，推導出晶片直接鍵合時晶片接觸表面粗糙度需要滿足的條件，其中晶片接觸表面粗糙度的描述是基於縫隙長度和縫隙高度的正弦波模型。In the side of hardware, the embedded system with the core of 80c196 is designed. what ' s more, the system includes keyboard input and liquid crystal display. in the side of software, there are some modules such as the measurements of the well depth and indicator diagram, inquisition, data computing, signal adjusting, serial port communication and graphic printing
本試井儀器將傳統的測井深儀器和測功圖儀器合二為一，硬體中設計了以80c196單片機為核心的嵌入式系統，並配有鍵盤和液晶顯示；軟體包括反射波和功圖的測量、查詢、數據計算、信號調理、串口通訊和圖形列印等模塊。2. go into one question in particular, that is the design of monitor software. through the c51 language, it makes many functions come true, including the distinction of the keycode, indication of lcd screen, dispose of the input - and - output data, management of the interface like serial port and i2c bus, and make a development on firmware which confirm to the standard hid - usb class
2 .著重討論了監控軟體的設計，通過單片機c51語言，實現了包括鍵碼識別、液晶屏顯示，輸入輸出數據處理、串口與i2c介面管理在內的功能，並進行了符合hid - usb群組規范的固件開發。分享友人