晶界滑移 的英文怎麼說
中文拼音 [jīngjiègǔyí]
晶界滑移
英文
grain boundary glide- 晶 : Ⅰ形容詞(光亮) brilliant; glittering Ⅱ名詞1. (水晶) quartz; (rock) crystal 2. (晶體) any crystalline substance
- 界 : 名詞1 (相交的地方; 劃分的界限) boundary 2 (一定的范圍) scope; extent 3 (按職業、工作或性別等...
- 滑 : Ⅰ形容詞1 (光滑; 滑溜) slippery; smooth 2 (油滑; 狡詐) cunning; crafty; slippery Ⅱ動詞(貼著物...
- 移 : Ⅰ動詞1. (移動) move; remove; shift 2. (改變; 變動) change; alter Ⅱ名詞(姓氏) a surname
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The presence of small amount of liquid at grain boundaries tends to form thin viscous layer which surrounds the finer grains. intergranular fracture may occur at the grain boundaries between two fine grains not covered by viscous phases. the high ductility achieved at low strain rates is generally attributed to dislocation glide - creep accommodation mechanisms
原始晶界上產生少量液相,形成薄的固液共存粘性層並包圍細化的晶粒,沿晶斷裂主要發生在無粘性層的細晶粒間;而在較低應變速率下,三叉晶界位錯攀援?蠕變協調機制鬆弛晶界滑移產生的應力集中,晶界上產生較多液相,有利於晶界滑移進行。The apparent activation volume calculated by the model is about 2500a3, which was ten times larger than that of usual amorphous alloy and was at the same range of the amorphous polymer. the model shows the main deformation mechanism of nanocrystalline ag is grain boundary sliding, which in some extent declares the similar forms of equation with amorphous alloys. with the ananlysis to the hrem of nanocrystalline ag, the discrepancy of the apparent activation volume between the nanocrystalline ag and amorphous alloys is interpreted by the loss of atoms participating in grain boundary sliding without enough reconstruction by the movement of atoms under the low temperature
運用晶界滑移的熱激活理論對壓縮實驗結果進行了數值擬合,擬合曲線與實驗數據符合很好,得到了晶界滑移的表觀激活體積(熱激活基本單位體積與局域瞬態應變的乘積) ,約為2500a ~ 3 ,先當于幾十個原子體積大小的瞬態變化,約為非晶合金的10倍以上,與非晶高聚物的表觀激活體積相當。To explain the inverse hall - petch relation in nanocrystalline metals, a geometric model is made, which assumes that the grains are spherical crystals, and the thick of grain boundary is considerable compared with the microcrystalline metals
提出了一個球形晶體純晶界滑移幾何模型,得到出現反hall - petch關系的條件和小晶粒尺寸條件納米晶金屬材料的強度極限。The substructure near the damage position was studied by ebsp, then vonbined with the relationship among substructure grain boundary sliding grain size and material deformation compatibility the mechanics of creep damage was discussed
使用電子背散射衍射技術研究了不同損傷位置附近的亞結構形成情況,結合亞結構、晶界滑移、晶粒尺寸與材料變形協調性等材料變形特點,對蠕變損傷機理進行了探討。Under the careful retrospection and analysis on the previous and recent experiments about mechanical behavior of nanocrystalline metals performed by almost main investigators, the dislocation and atomic diffusion is believed to contribute hardly to the deformation of nanocrystalline alloy, and a model based on thermal activation process was applied to fit the experimental data of nanocrystalline ag
結果表明,納米晶金屬ag的不僅具有比粗晶ag高2 - 6倍的拉伸和壓縮強度,而且在大范性形變階段顯示了極低的加工硬化和應變速率敏感性。結合位錯理路和非晶合金形變特徵,提出納米晶金屬ag的塑性變形主要由於晶界滑移貢獻。From an examination of the tensile behavior of cz ly12 alloys under different temperature and strain rate, two kinds of deformation and intergranular fracture behaviors were observed that were opposite to the characteristic strain rate range in fine - grained superplasticity. the mechanisms are described as follows. the high ductility achieved at high strain rate is generally attributed to the dominant role of gbs accommodating mechanisms, which is considered as dislocation creep within grains controlled by subgrains
研究選用自然時效淬火態的ly12鋁合金,進行了一系列不同溫度和應變速率下的單軸拉伸試驗, 480下,觀察到與傳統細晶超塑性特徵區間相反的行為:較高應變速率下,動態再結晶使晶粒細化,促進了晶界滑移,亞晶界控制的晶內位錯蠕變是晶界滑移的主要協調機制。The microprocesses of deformation and fracture in 18 - 8 stainless steel were observed by in - situ tension in tem. it was found that the dislocations were emitted from the grainboundary and dislocation source inside a grain and slip along their slip system respectively. partial dislocation could also be emitted from the grainboundary, and moved into the grain, and that leaving behind a stacking fault
摘要浙江人學博1 :學位論文採用透射電鏡動態拉伸、原位觀察icrlsnigti不銹鋼形變與斷裂過程,發現不銹鋼變形時,晶界和晶內位錯源均可產生位錯,並沿各自的滑移系運動。The flexural strength and fracture toughness of ti3sic2 material obtained by hot - pressing is 223mpa and 5. 1 mpa m1 / 2 respectively ; the mechanisms of grain bending, grain delamination, crack deflection inside the layered grain, crack deflection and branch, pull out grain are main energy absorbing mechanisms
~ 1ti _ 3sic _ 2材料的彎曲強度和斷裂韌性分別為223mpa和5 . 1mpa ? m ~ ( 1 / 2 ) 。主要能量吸收機制為:晶粒的彎曲、層間滑移,裂紋在層間擴展與偏轉,裂紋在晶粒間沿晶界擴展、分叉和晶粒的拔出。分享友人