樹脂粘合 的英文怎麼說

中文拼音 [shùzhīnián]
樹脂粘合 英文
resin-bonding
  • : Ⅰ名詞1 (木本植物的通稱) tree 2 (姓氏) a surname Ⅱ動詞1 (種植; 栽培) plant; cultivate 2 (樹...
  • : 名詞1. (動植物所含的油質) fat; grease; tallow 2. (胭脂) rouge 3. (姓氏) a surname
  • : 粘動詞(粘附) glue; stick; paste; adhere to; bond
  • : 合量詞(容量單位) ge, a unit of dry measure for grain (=1 decilitre)
  • 樹脂 : resin; jaffaite; peucine
  1. After blanting resin abrasive cloth into small blocks, glue them into a disc, it can be equipped on electronic grinder or wind - driven tools so as to buffing and dry milling functions of inner holds or elbow pipes of metals work pieces

    該產品選用砂布沖成小塊而成,可裝在電磨機、風動工具上,用於復雜金屬件內孔及彎接處、焊疤的打磨、拋光。
  2. Polybutadienes, epoxy resins, and similar polymers may be used while they are in the viscous or liquid state of prepolymerization.

    聚丁二烯,環氧及類似聚物在性狀或液體預聚態都是可用的。
  3. Specification for insulating materials based on mica - specifications for individual materials - glass - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:單項材料規范.第6節:用b級環氧樹脂粘合結的玻璃纖維織物襯底雲母紙
  4. Specification for insulating materials based on mica - specifications for individual materials - polyester film - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:單項材料規范.第4節:用b級環氧樹脂粘合結的聚酯薄膜襯底雲母紙
  5. Specification for insulating materials based on mica ; part 3 : specifications for individual materials ; sheet 6 : glass - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:單項材料規范.第6活頁:用b級環氧樹脂粘合結的玻璃纖維織物襯底雲母紙
  6. Specification for insulating materials based on mica. part 3 : specifications for individual materials. sheet 6 : glass - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:專用材料規范.活頁6 :用b級環氧樹脂粘合結的玻璃纖維織物襯底雲母紙
  7. Specification for insulating materials based on mica ; part 3 : specifications for individual materials ; sheet 4 : polyester film - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:單項材料規范.第4活頁:用b級環氧樹脂粘合結的聚酯薄膜襯底雲母紙
  8. Specification for insulating materials based on mica. part 3 : specifications for individual materials. sheet 4 : polyester film - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:專用材料規范.活頁4 :用b級環氧樹脂粘合結的聚酯薄膜襯底雲母紙
  9. Specification for insulating materials based on mica. part 3 : specificatins for individual materials. sheet 5 : glass - backed mica paper with an epoxy resin binder for post - impregnation

    雲母基絕緣材料規范.第3部分:專用材料規范.活頁5 :用環氧樹脂粘合結的待浸漬處理的玻璃纖維織物襯底雲母紙
  10. Specification for insulating materials based on mica ; part 3 : specifications for individual materials ; sheet 5 : glass - backed mica paper with an epoxy resin binder for post - impregnation

    雲母基絕緣材料規范.第3部分:單項材料規范.第5活頁:用環氧樹脂粘合結的待浸漬處理的玻璃纖維織物襯底雲母紙
  11. Can be used as the raw material or additive for surfactant, alkyd, adhesive, plasticiser, ink, printing ink and coatings ; or as the plasticiser for the production of cellophane and coating processing paper i. e. calendered paper, coated stamp paper, printing coated paper in papermaking industry ; as well as the wetting agent of cigarette

    產品說明:可用作表面活性劑醇酸樹脂粘合劑增塑劑墨水油墨漆的原料或添加劑在造紙工業中用作玻璃紙和塗布加工紙如蠟光紙塗料郵票紙印刷塗料紙等生產時的塑化劑卷煙中保持煙草的潤濕劑等。
  12. Study on the optical properties of transparent epoxy / clay nanocomposites a new type transparent epoxy based nanocomposites has been prepared by the reaction of alkylammonium exchanged montmorillonite ( amt ) with diglycidyl ether of bisphenol a ( dgeba ) and triethylamine as the curing agent. the morphology of amt in the epoxy matrix was characterized with x - ray diffraction ( xrd ), scanning electron microscopy ( sem ) and transmission electron microscopy ( tem )

    光學透明環氧土納米復材料光學性能採用十八烷基伯胺鹽、十六烷基三甲基溴化胺處理na基蒙脫土製備出兩種不同的有機土,以三乙胺為固化劑,有機土與雙酚a型環氧熔融插層聚后制備出剝離型和插層型兩種結構的環氧土納米復材料。
  13. The factors which effect the fsmf filler to build up strength and toughness in the resin matrix composite materials include the size and the shape of fsmf grain the glue performance on the interface of resin matrix and the grain of fsmf

    同時得出fsmf顆粒與基體界面上的結性能、 fsmf顆粒的大小和fsmf顆粒的形狀等是影響fsmf填充材料增強增韌的重要因素。
  14. A structural material made of wood fragments, such as chips or shavings, that are mechanically pressed into sheet form and bonded together with resin

    碎料板由碎木,如木屑或創花製成的一種結構材料,用樹脂粘合在一起並用機器壓成板狀
  15. Pressure - sensitive adhesive tapes for electrical purposes - part 3 : specifications for individual materials ; sheet 17 : polyester epoxy combinations with pressure - sensitive adhesive

    電工用壓敏帶.第3部分:單項材料規范.活頁17 :塗熱敏劑的聚酯環氧的帶
  16. The paper consists of the following parts : ( 1 ) synthesis of a novel resol with dibenzyl ether bond ; ( 2 ) preparation of the phenolic resin / layered silicates nanocomposites ( rplsn ) and investigating the melt intercalation and curing behavior ; ( 3 ) discussing mechanical properties and its related influence factor

    本文分為三個部分:首先成帶芐基醚鍵的熱固性酚醛,然後制備土聚物納米復材料討論其熔融插層和剝離行為,最後討論各種因素對力學性能的影響。一帶芐基醚鍵的無氨熱固性酚醛成。
  17. The intercalation and exfoliation behavior of lamellar clay in the thermoset resin / clay composites during curing was studied in this paper. for epoxy / organoclay system, intercalation and exfoliation behavior of organoclays in epoxy resin has been investigated

    本論文以熱固性/土復體系為研究對象,主要研究了分散在聚物基質中的層狀土在固化過程中插層和剝離行為。
  18. 2 resin with bad wetness systems such as epoxy resin, polyester, alkyd, acrylic resin, operate as the following process : add the solvent - add organic bentonite powder mix and stir 10 minutes, wet enough - add the polar active agent mix and stir 5 - 10 minutes, make it swell and disperse - add resin and stir - add the surface active agent - add pigment, stir and disperse to the needed granularity - dilute to the needed viscosity main points for use methods

    2當使用潤濕性差的系統環氧,聚酯,短油酸,丙烯酸操作如下:加入溶劑混加入有機膨潤土粉末攪拌混10分鐘,使其完全潤濕加入極性活化劑攪拌混5 - 10分鐘,使其膨脹,分散加入攪拌加入表面活化劑攪拌分散至所需細度稀釋至所需度。
  19. The effect of the amt morphology on the optical transparency of epoxy / amt composites ( ep / amt ) was also investigated. the light transmittance of exfoliated and intercalated nanocomposites was made a comparison

    採用xrd 、 sem和tem等實驗手段對材料的結構進行了表徵;並對環氧土二元納米復材料的光學性能進行了系統的研究。
  20. Application of ceramic tiling by the thin bed method using epoxy resin adhesives

    第3部分:採用環氧樹脂粘合劑的稀灰漿工藝陶瓷襯砌的
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