樹膠粘結劑 的英文怎麼說

中文拼音 [shùjiāoniánjiē]
樹膠粘結劑 英文
resinoid bond
  • : Ⅰ名詞1 (木本植物的通稱) tree 2 (姓氏) a surname Ⅱ動詞1 (種植; 栽培) plant; cultivate 2 (樹...
  • : Ⅰ名詞1 (某些具有黏性的物質) glue; gum 2 (橡膠) rubber 3 (姓氏) a surname Ⅱ動詞(用膠粘) st...
  • : 粘動詞(粘附) glue; stick; paste; adhere to; bond
  • : 結動詞(長出果實或種子) bear (fruit); form (seed)
  • : Ⅰ名詞1 (藥劑; 制劑) a pharmaceutical or other chemical preparation 2 (某些有化學作用的物品) a...
  1. Used for producing polyester resin, polyimide resin, water soluble, alkyd resin, water soluble polyurethane resin, plasticizer, water soluble amino - alkyd resin, curing agent for epoxy resin, aeroengine oil, electric capacitor maceration oil, binder, sizing agent, smoke suppressor, instant binder, etc.

    :用於製造聚酯脂及聚酰亞胺脂水溶性聚脂脂水溶性聚氨酯脂增塑和水溶性氨基醇酸脂環氧脂固化以及高級航空潤滑油電力電溶器浸漬油粒料消煙瞬時
  2. Performance for a piezoresistive transducer pressure sensor to thermal and pressure environments can be predicted by finite element method. a simplified 1 / 8 model, considering silicon dioxide and nitride process as well as stack anodic bonding and adhesive bonding processes, was developed. the fem results were found to be comparable to experimental data. case studies suggested that pyrex stack induces certain amount of non - linearity, while it isolates hard epoxy nonlinear effect. flexible epoxy bonding or soft adhesive bonding is preferred to the packaging process. the viscoelasticity and viscoplasticity of bonding material will result in hysteresis and drift errors to sensor output. however, soft adhesive s influence on sensor can be ignored under relative stable environments. more over, detailed design and process information will help to improve modeling application

    熱、壓環境下壓阻變換壓力傳感器的性能可以通過有限元方法預測.這里研究了簡化的1 / 8模型,模型考慮了二氧化硅和氮化硅生成過程及堆陽極鍵合和合過程.果發現有限元預測果和實驗數據具有可比性.範例研究表明,硼硅堆導致產生一定的非線性,但它隔離了硬環氧脂的非線性.在包裝過程中最好使用柔性環氧黏合或軟黏合.黏合材料的黏彈性和黏塑性將會導致傳感器輸出的滯后和漂移誤差.然而,在相對穩定的環境下,軟黏合對傳感器的影響可以忽略.此外,詳細的設計和過程信息有助於提高模型的適用性
  3. Its research contains the preparation and technical index of application of h9110 solventless impregnating resin of the ansatured polyester - imede. it analyses reactivity of the resin by dsc and provides the research process of 9547 - 1 single glass cloth reinforced dry mica tape and the alteration of mica tape michines. it also characterizes the structure of h9110 solventless impregnating resin and the resin to dry mica tape by infared spectroscopy and nuclear magnetic resonance hydrogen spectroscopy

    研究內容包括h9110不飽和聚酯亞胺無溶浸漬脂的制備及使用工業參數的確定,用dsc分析了該脂的反應活性; 9547 - 1單面玻璃布補強少粉雲母帶的研製過程和雲母帶製造設備的改進;用紅外光譜和核磁共振分析表徵了h9110不飽和聚酯亞胺無溶浸漬脂和少粉雲母帶脂的構。
  4. The main results are summarized as follows : first, formulation tailoring and curing process of epoxy resin adhesive have been studied, and the peel strengths were tested. the curing temperatures are obtained following the result of curing reaction heat flow tested by dsc

    主要研究內容和果如下:首先,研究了作為基底材料基體的環氧的配方,利用差示掃描量熱儀( dsc )確定了的固化溫度,並對進行了性能測試。
  5. Abstract : this paper introduces a new class f epoxy glass - cloth laminate. the synthesis of a epoxy adhesive and the production process were studied. the properties of the laminate were compared with those of some similar products abroad. the results show that the laminate has higher adhesive strength 、 resistivity in moist conditions 、 dielectric strength and mechanical strength in higher temperatures. it is applicable for electric equipments, especially those to run in higher moisture or higher temperature conditions

    文摘:本文介紹了最近開發成功的一種新型f級耐高溫層壓板,研究了環氧的合成,層壓板的製造工藝及其性能,並與國外同類產品進行了對比,果表明,它具有接強度、浸水后絕緣電阻及耐電壓、高溫機械強度高等特性,可用作大型高壓電機、輸變電設備以及核電工程、低溫高真空工程中絕緣構材料,尤其適用於高電壓、高溫、高機械強度的工作環境。
  6. Specification for insulating materials based on mica - specifications for individual materials - polyester film mica paper with an epoxy resin binder for single conductor taping

    雲母基絕緣材料規范.第3部分:單項材料規范.單根導線帶用帶有環氧的聚脂薄膜雲母紙
  7. When change the component of adhesive its shear strength increased from 39. 3 mpa to 53. 5 mpa at room temperature and it have long - term usage at 180 with 25 mpa and can be served at 230 in short period. the addition of liquid rubber resulted in a 300 % increase in the peeling strength. the addition of polymer ether imide led to a 260 % increase in the peeling strength, a 15 % increase in shear strength and a 10 increase in tg ( tg = 195. 54 )

    研究果表明: bmi dds e ? 51 tde ? 85組成的體系的室溫剪切強度為39 . 3mpa ,當改變環氧脂的含量時,剪切強度提高到53 . 5mpa ;用無規羧基液體丁腈橡改性環氧時室溫剝離強度提高3 . 0倍;用聚醚酰亞胺改性環氧,室溫剪切強度最高可達45 . 2mpa ,剝離強度提高2 . 6倍,玻璃化轉變溫度tg = 195 . 54 ,比未增韌體系提高10以上;碳纖維耐磨材料與同步器圓錐環的接實驗果表明,的使用工藝性能良好,滿足室溫剪切強度30mpa和180剪切強度12 . 5mpa的技術要求。
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