淺切削 的英文怎麼說
中文拼音 [jiānqiēxiāo]
淺切削
英文
light cut-
There exist large stress, intensive scratch, damage and pollution of ion in wafer process, so it is necessary to improve mechanism of slicing and lapping by changing single mechanical function to equilibrium chemical and mechanical function for small damage and low stress. reducing damage and stress and enhancing quality and efficiency of product result in a base of followed process so as to improve wafer process and enhance finished product ratio of whole wafer process
目前加工過程中存在應力過大,造成表面劃傷嚴重,容易產生破損,離子沾污的問題,因而必須改善切削、研磨機理,把單一的機械作用變為均勻穩定的化學機械作用,以達到淺損傷、低應力的目的,有效的減少破損層和應力的累積,提高產品質量和加工的效率。
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