漏柵極漏電流 的英文怎麼說

中文拼音 [lóuzhàlóudiànliú]
漏柵極漏電流 英文
drain gate leakage current
  • : Ⅰ動詞1 (從孔或縫中滴下、透出或掉出) leak; drip 2 (泄漏) divulge; disclose; leak 3 (遺漏) le...
  • : 柵名詞(柵欄) railings; paling; palisade; bars
  • : i 名詞1 (頂點; 盡頭) the utmost point; extreme 2 (地球的南北兩端; 磁體的兩端; 電源或電器上電流...
  • : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
  • : Ⅰ動1 (液體移動; 流動) flow 2 (移動不定) drift; move; wander 3 (流傳; 傳播) spread 4 (向壞...
  • 電流 : current; galvanic current; electric current; electricity; current flow電流保護裝置 current protec...
  1. Based on the hydrodynamic energy transport model, the influence of variation of negative junction depth caused by concave depth on the characteristics of deep - sub - micron pmosfet has been studied. the results are explained by the interior physical mechanism and compared with that caused by the source / drain depth. research results indicate that with the increase of negative junction depth ( due to the increase of groove depth ), the threshold voltage increases, the sub - threshold characteristics and the drain current driving capability degrade, and the hot carrier immunity becomes better in deep - sub - micron pmosfet. the short - channel - effect suppression and hot - carrier - effect immunity are better, while the degradation of drain current driving ability is smaller than those with the increase of depth of negative junction caused by source / drain junction shallow. so the variation of concave depth is of great advantage to improve the characteristics of grooved - gate mosfet

    基於能量輸運模型對由凹槽深度改變引起的負結深的變化對深亞微米槽pmosfet性能的影響進行了分析,對所得結果從器件內部物理機制上進行了討論,最後與由源結深變化導致的負結深的改變對器件特性的影響進行了對比.研究結果表明隨著負結深(凹槽深度)的增大,槽器件的閾值壓升高,亞閾斜率退化,驅動能力減弱,器件短溝道效應的抑制更為有效,抗熱載子性能的提高較大,且器件的驅動能力的退化要比改變結深小.因此,改變槽深加大負結深更有利於器件性能的提高
  2. In gan hemt drain pulse current collapse experiments, drain current under pulse condition collapsed about 50 % than direct current condition and the pulse signal frequency affected little on current collapse. when gate voltage is small, the relationship between pulse width and drain current is i0 ( + t / 16 )

    在ganhemt脈沖崩塌測試中,發現脈沖條件下比直時減小大約50 % ;脈沖信號頻率對崩塌效應影響較小;當壓較小時,隨著脈沖寬度的改變按i0 ( + t / 16 )的規律變化。
  3. In gan hemt gate pulse experiments, drain current under pulse conditon collapsed about 47 % than direct current condition and the pulse width affected little on current collapse. the relationship between drain current and pulse frequency is ncoxw [ m + ( n + k ? ) vgs + ( n + k ? ) vgs2 ] ( vgs - vth ) 2 / l

    在ganhemt脈沖崩塌測試中,觀察到脈沖條件下比直情況下減小了47 % ;隨著信號頻率的改變,按ncoxw [ m + ( n + k
  4. Based on the hydrodynamics energy transport model, the degradation induced by donor interface state is analyzed for deep - sub - micron grooved - gate and conventional planar pmosfet with different channel doping density. the simulation results indicate that the degradation induced by the same interface state density in grooved - gate pmosfet is larger than that in planar pmosfet, and for both devices of different structure, the impact of n type accepted interface state on device performance is far larger than that of p type. it also manifests that the degradation is different for the device with different channel doping density. the shift of drain current induced by same interface states density increases with the increase of channel do - ping density

    基於體動力學能量輸運模型,對溝道雜質濃度不同的深亞微米槽和平面pmosfet中施主型界面態引起的器件特性的退化進行了研究.研究結果表明同樣濃度的界面態密度在槽器件中引起的器件特性的漂移遠大於平面器件,且子施主界面態密度對器件特性的影響遠大於空穴界面態.特別是溝道雜質濃度不同,界面態引起的器件特性的退化不同.溝道摻雜濃度提高,同樣的界面態密度造成的特性漂移增大
  5. In fet devices, the presence of an electrical field at the gate moderates the flow between the source and drain

    在fet器件中,場的存在會調節源之間的
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