焊球法 的英文怎麼說

中文拼音 [hànqiú]
焊球法 英文
test methods for bare wiressolderability test of coatingsolder globule methodthod
  • : 動詞(用熔化的金屬修補金屬器物或使金屬工件連接起來) weld; solder
  • : 名詞1 (以半圓的直徑為軸 使半圓旋轉一周而成的立體; 由中心到表面各點距離都相等的立體) sphere; glo...
  • : Ⅰ名詞1 (由國家制定或認可的行為規則的總稱) law 2 (方法; 方式) way; method; mode; means 3 (標...
  1. Metal ball valves - flanged and butt - welding ends

    蘭端金屬
  2. Specification for solderability tester by globule method

    焊球法性測試儀.技術條件
  3. Test methods for bare wires - solderability test of coating - solder globule method

    裸電線試驗方鍍層可性試驗焊球法
  4. As the inner shape of the thin aluminum alloy sheets will deform and differ from the theoretical ellipsoid to some extent after welding processing, it is very difficult to meet the requirements of the tolerance between the honeycomb sandwich and thin aluminum sheets when only conventional cnc and traditional manual manufacturing techniques are used

    由於上、下底蒙皮接成型過程中的變形使其內表面形狀相對于理論橢面具有較大的誤差,採用常規的橢面數控加工方,或傳統的按上底蒙皮內表面手工打磨、研合修配方加工蜂窩夾芯表面無保證配合精度要求。
  5. Control and reduce the deformation of welding for frame of ball nodal in such kind of steel tube as diagonal laying of quardcone and quaraune diagonal laying with double phase

    兩向正交斜放類型鋼管節點網架接變形的方
  6. Methods for ultrasonic testing and classification of welds for steel space grid structures with welded joints

    節點鋼網架縫.超聲波探傷及質量分級
  7. Methods for ultrasonic testing and classification of welds for steel space grid structures with bolted joints

    螺栓節點鋼網架縫.超聲波探傷及質量分級
  8. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體器件的機械標準化.繪製表面安裝半導體器件封裝外形圖的一般規則.網格陣列封裝尺寸的測量方
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