焊點 的英文怎麼說

中文拼音 [hàndiǎn]
焊點 英文
soldered dot; welding spot
  • : 動詞(用熔化的金屬修補金屬器物或使金屬工件連接起來) weld; solder
  • : Ⅰ名詞1 (液體的小滴) drop (of liquid) 2 (細小的痕跡) spot; dot; speck 3 (漢字的筆畫「、」)...
  1. Non - destructive examination of fusion welds - visual examination

    焊點的無損檢驗.目視檢查
  2. The joints heat up as a result of the joule heating effect

    焦耳熱效應造成焊點溫度提高。
  3. Our mylar sleeves are mainly used to protect a wide range of electrical equipments, such as thermal protectors, temperature limiting switches, refrigerant compressors, rechargeable batteries, fuses, transformers, motors, electrical wires, electrical ? heating elements, capacitors, telephone relay, soldered dot, tie - in and winding, etc

    我們的聚脂套管主要用於熱保護器、高溫控制開關、製冷壓縮機、充電電池、保險絲、變壓器、馬達、電線、電器元件、電容、電話繼電器、焊點、接頭、線圈等耐絕緣及機械保護。
  4. The company has workshops for product designing, carving, die - casting, polishing, electroplating, laser engraving, drop moulding, grinding, painting, tin soldering, brazing, silver soldering and spot welding, as well as quality test center

    公司下設產品設計、刻模、壓鑄、拋光、電鍍、激光雕刻、滴塑、磨砂、畫漆、錫、銅、銀車間及產品質量檢測中心。
  5. Quality assessment of soldered joints of sma

    表面組裝組件的焊點質量評定
  6. Carefully handle the solder and ensure all the contact points and solder are clean - try different quantities of solder, make sure your soldering iron has been adjusted to the best temperature

    -不同的焊點:線路焊點的運用位置搭配,種不同,量的比例,溫度的調整
  7. According to the m1l - std - 883c standard of thermal cycle loading, the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint

    採用mil - std - 883c標準,通過溫度循環實驗,使用高頻超聲顯微鏡( c - sam )無損檢測技術,測量了在不同焊點狀態下, b型和d型兩種實際倒裝封裝晶元與底充膠界面分層裂縫傳播速率。
  8. Secondly, features extracting algorithm based on histogram, features extracting algorithm based on shape and features extracting algorithm based on texture are imported to solve the drawback of traditional features extracting algorithms based on structured illumination with a layer circle that make use of image information deficiently. we extract abundant features information

    其次,針對目前基於結構式光源的焊點特徵提取中沒有充分利用焊點圖像信息的問題,在焊點特徵提取方面,引入了基於直方圖的焊點圖像特徵提取方法、基於形狀的焊點圖像特徵提取方法和基於紋理的焊點圖像特徵提取方法。
  9. Argon welder, oxygen welder, co2 welder, electric welder, allumen composite sole welder and ultrasonic plastic welder total : 14 sets braze, iron welding stainless steel welding, plastic welding, welding of composite sole of stainless steel aluminum, direct welding, roll welding, spot welding

    氬弧機氧氣機二氧化碳機電機鋁合金復合底機超聲波塑料機共計14臺銅不銹鋼塑料不銹鋼鋁復底焊點
  10. In the transition from lead to lead - free, for the manufacturers of electronic products, there is expected to be a period when lead and lead - free materials will be used within the same mounting process, the mixed solder joint which formed in this situation is very complicated

    摘要在從有鉛向無鉛轉換過程中,電子產品製造商不可避免會碰到同一組裝過程中有鉛和無鉛同時存在的混合情況,這種情況下形成的混合焊點是很復雜的。
  11. Solder bar is made from high purity metal. by means of strict qualitg control the oxide and metallic and non - metallic impnrities and effectively minimized, the available high purity solder bar is with uniform and glazed surface good wetting and spreading ability after molten bright joint and minimum oxide residue after soldering. our product is suitable for wave and handwork soldering with high quality requirement

    本公司生產錫條採用高純度金屬原料,在嚴格品管條件下,有效控制氧化程度以及金屬和非金屬雜質含量,錫條表面均勻光滑,純度極高,熔化后流動性好,潤濕性極佳,焊點光亮,氧化渣物極少發生,適用於高品質要求的各種波峰和手工
  12. Wear of electrode and surface forming quality in continuous spot welding of aluminum allays

    鋁合金連續時電極燒損與焊點表面質量的變化規律
  13. Pcb nails, 110 " spot quick connect or screw endpoint

    Pcb釘, 110 "焊點快速連接,或螺絲釘端
  14. Effect of cpga gull wing lead size on reliability of soldered joints

    翼形引線焊點可靠性的影響
  15. 110 " spot or pcb fast link endpoint

    110 "焊點快速連接或pcb端
  16. The reliability of lead - free solder joint

    無鉛焊點的可靠性問題
  17. Bga test technology amp; amp; quality control

    焊點的質量控制
  18. Solder joint fatigue life predictions for csp package under power cycling

    封裝結構焊點的壽命預測分析
  19. Non destructive testing of welded joints - ultrasonic testing of welded joints

    焊點無損檢驗.焊點超聲檢驗
  20. Atoms in the solder joints move as a result of both diffusion and electromigration

    另一方面,擴散和電遷移效應,則造成焊點中的原子移動。
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