熱脆材料 的英文怎麼說

中文拼音 [rècuìcáiliào]
熱脆材料 英文
hot brittle material
  • 脆 : 形容詞1 （容易折斷破碎） fragile; brittle 2 （較硬的食物容易弄碎弄裂） crisp 3 （聲音清脆） （of ...
  • 材 : 名詞1 （木料） timber 2 （泛指可以直接製成成品的東西; 材料） material 3 （供寫作或參考的資料） ma...
  • 料 : 名詞1 （材料; 原料） material; stuff 2 （喂牲口用的穀物） feed; fodder 3 （料器） glassware 4 （...
  • 材料 : 1. （原料） material 2. （資料） data; material 3. （適于做某種事的人才） makings; stuff
  1. It was found that nitrogen increased the fracture strength of silicon single crystal. we consider that the nitrogen may change the shockley band on silicon surface and form complex to influence the fracture procedure

    本文從硅材料的基本概念入手，闡述了硅單晶材料的脆性斷裂、脆塑轉變以及在熱處理過程中的翹曲研究，並通過這三個部分進行實驗。
  2. Take a good look and you ll notice that the cold cabbage hearts are all perfectly cut, and that the tofu skin and the sesame - paste grilled bread are handmade by the chef. even the pickled cabbage for the boiled pork hotpot, so popular during winter, is made using only the best white cabbage, and when added to the traditional copper pot of boiling broth it seems to suffuse the room with warmth

    放眼店內，涼拌白菜心的刀工整，素拉皮與芝麻醬燒都是師傅自製，連冬天熱賣的酸菜白肉鍋，也在大白菜材料上精挑細選，腌漬出酸脆而不嗆鼻的北方酸白菜，在傳統大銅鍋上煮出一室的溫暖。
  3. The maximal power outputs of 37. 0 mw / cm2 and 30. 0 mw / cm2 for the p - and n - type laminated materials respectively at the temperature difference 490 have been experimentally obtained, which are about 2. 5 and 3. 0 times those of - fesi2. chemical analyses show that the interface failure between the bridge alloy and the semiconductor bi2te3 results mainly from the eutectic mixtures with low melting point and brittle compounds formed during welding and long time annealing at 190. it is found that the electrical properties of a laminated structure are mainly controlled by the wettability of the bridge alloy on the semiconductor surface

    發現： 1 ）疊層材料具有明顯優于均質材料的熱電性能，在490溫差下， p -型和n -型疊層材料的最大輸出功率分別達到37 . 0和30 . 0 （ mw / cm ~ 2 ） ，是同類型均質- fesi _ 2的2 . 5和3倍； 2 ）在焊接過程和190長時間退火處理過程中，焊接過渡層合金和基體半導體（特別是bi _ 2te _ 3 ）之間存在明顯的元素相互擴散，從而在過渡層中形成一些低熔點共晶體和脆性化合物，這是導致疊層材料破壞的主要原因； 3 ）焊接過渡層合金與半導體基體之間的潤濕性是影響界面層電性能的主要因素。
  4. The result of experiment showed that the reaction between ti and c is a thermodynamic course, when 2 wt % mg is added to melt, it can restrain the formation of fragility phase al3ti, and gained al matrix composite which contained tic reinforced particles only. because mg reacts with the forms a micro - high temperature field around the oxide around the graphite particles and the oxygen gas which is brought by the immersion bell, and the reaction gives out a lot of heat energy, thus forms many high micro - fields in melt, which prompt the reaction between the al and ti

    加入適量的mg （ 2wt ）可以抑制tic al復合材料中的脆性相al _ 3ti的產生，生成僅含tic的鋁基復合材料；由於活化劑鎂在體系中與石墨顆粒周圍的氧化物、以及外來的氧反應放熱，在熔體中形成微高溫區，促進al - ti反應，同時， al - ti反應也是放熱反應，因此體系中的內能急劇增大，促使al _ 3ti分解以及ti朝c顆粒擴散，縮短反應的孕育時間。
  5. Having the same mechanical character as other ceramic products, mosi2 heating elements belong to the brittleness material so that they are easy to rupture at the normal temperature, which brings some difficulty to transport and install, but it may be avoided if they were installed and used correctly

    二硅化鉬電熱元件的機械性質和其它陶瓷製品一樣，在常溫下屬于脆性材料容易斷裂，這給運輸和安裝帶來了一定的困難，但只安裝合理和使用得當是可以避免的。
  6. Cross section morphology analysis showed that the fracture appearance of tungsten carbide particle reinforced steel matrix composites was a mixture of quasi - cleavage fracture and toughness fracture. the fracture appearance of tungsten carbide particle always displayed as quasi - cleavage fracture, while the cross section morphology of steel matrix transformed with the heat treatment techniques

    斷口形貌分析顯示， wc鋼復合材料的斷口形貌呈韌-脆復合斷口特徵，硬脆的wc顆粒常發生脆性解理斷裂，而韌性較高的鋼基體的斷口形貌則因熱處理工藝而異。
  7. It results in great degradation of the properities of spacecraft surface materials such as the solar absorptance increase of thermal control coatings, mechanical properties damage of thin films, et al

    它會導致航天器的表面材料性能發生極大的退化，例如熱控塗層太陽吸收率上升、薄膜材料機械性能變壞、變脆等等。
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