環氧粘結劑 的英文怎麼說

中文拼音 [huányǎngniánjiē]
環氧粘結劑 英文
epoxy adhesive
  • : Ⅰ名詞1 (環子) ring; hoop 2 (環節) link 3 (姓氏) a surname Ⅱ動詞(圍繞) surround; encircle;...
  • : 名詞[化學] (氣體元素) oxygen (o)
  • : 粘動詞(粘附) glue; stick; paste; adhere to; bond
  • : 結動詞(長出果實或種子) bear (fruit); form (seed)
  • : Ⅰ名詞1 (藥劑; 制劑) a pharmaceutical or other chemical preparation 2 (某些有化學作用的物品) a...
  • 環氧 : epoxy
  1. Specification for insulating materials based on mica - specifications for individual materials - glass - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:單項材料規范.第6節:用b級樹脂的玻璃纖維織物襯底雲母紙
  2. Specification for insulating materials based on mica - specifications for individual materials - polyester film - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:單項材料規范.第4節:用b級樹脂的聚酯薄膜襯底雲母紙
  3. Specification for insulating materials based on mica ; part 3 : specifications for individual materials ; sheet 6 : glass - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:單項材料規范.第6活頁:用b級樹脂的玻璃纖維織物襯底雲母紙
  4. Specification for insulating materials based on mica. part 3 : specifications for individual materials. sheet 6 : glass - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:專用材料規范.活頁6 :用b級樹脂的玻璃纖維織物襯底雲母紙
  5. Specification for insulating materials based on mica ; part 3 : specifications for individual materials ; sheet 4 : polyester film - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:單項材料規范.第4活頁:用b級樹脂的聚酯薄膜襯底雲母紙
  6. Specification for insulating materials based on mica. part 3 : specifications for individual materials. sheet 4 : polyester film - backed mica paper with a b - stage epoxy resin binder

    雲母基絕緣材料規范.第3部分:專用材料規范.活頁4 :用b級樹脂的聚酯薄膜襯底雲母紙
  7. Used for producing polyester resin, polyimide resin, water soluble, alkyd resin, water soluble polyurethane resin, plasticizer, water soluble amino - alkyd resin, curing agent for epoxy resin, aeroengine oil, electric capacitor maceration oil, binder, sizing agent, smoke suppressor, instant binder, etc.

    :用於製造聚酯樹脂及聚酰亞胺樹脂水溶性聚脂樹脂水溶性聚氨酯樹脂增塑和水溶性氨基醇酸樹脂樹脂固化以及高級航空潤滑油電力電溶器浸漬油粒料施膠消煙瞬時
  8. Ansi a108. 1 - 1992 specifications for installation of ceramic tile with organic adhesives or water cleanable tile setting epoxy adhesive included in ansi a108. 1 - 1992

    用有機或水可洗樹脂陶瓷磚鋪設瓷磚的規范
  9. Ansi a108. 1 - 1992 specifications for chemical resistant, water cleanable tile - setting and grouting epoxy and water cleanable tile setting epoxy adhesive included in ansi a108. 1 - 1992

    耐化學藥品的水可清洗的磁磚安裝和灌漿樹脂和水可清洗的磁磚固定規范
  10. A. the preparation of sliding ink for plastic printing. b., widely used in ht e preparation of double components epoxy paint and epoxy adhesive, the curing matter own fine mechanical and electrochemical property ; it is also applied in the manufacture of low temp

    B二聚酸與多元胺反應生成具有活性胺基的聚酰胺,廣泛應用於製造雙組份油漆及環氧粘結劑,固化物具有良好的機械電化學等性能。
  11. An excellent adhesive was prepared from bismaleimide ( bmi ), epoxy resin ( e - 51 and tde - 85 ), 4, 4 ' - diaminodiphenyl sulfone ( dds ) in this thesis. the influence of liquid rubber and polymer ether imide ( pei ) on the properties ( especially high - temperature strength and the peeling strength ) were discussed, their different toughening characteristics and mechanisms were discussed. last, the process and effection of heat - resisted structural adhesive were studied by adhesive experiment of synchronizer in automobile. the results of investigation made clear : the adhesive, has good properties, especially heat - resisted properity

    根據材料分子設計的原理,研究了二苯甲烷雙馬來酰亞胺( bmi ) 4 , 4 』 ?二胺基二苯基碸( dds ) e ? 51 tde ? 85組成的體系,研究該體系在作為高溫構膠使用時的接性能;然後研究了用無規羧基液體丁腈橡膠( ctbn ? x )和聚醚酰亞胺( pei )分別來增韌該體系的增韌效果;最後通過碳纖維耐磨材料與同步器圓錐接實驗,研究了耐高溫構膠接工藝和使用效果。
  12. In addition, a new analytical method was used to solve the shear strength of the fiber / epoxy interface. the result showed good agreement with that from the kelly - tyson equation. meanwhile, according to the sfc tests of the single fiber reinforced epoxy matrix composites treated by four types of surface treatments, the interfacial adhesion conditions were estimated by critical fiber length, interfacial shear strength and single fiber microdamge mode

    此外,文中對單纖維復合材料斷裂實驗運用了新的解析方法,求解了玻璃纖維復合材料界面的剪切強度,與kelly - tyson等式方法求得的界面剪切強度有著很好的一致性;同時,對四種不同表面處理處理的單纖維復合材料斷裂實驗進行了分析,從臨界纖維長度、界面剪切強度和單纖維斷裂實驗中纖維斷點周圍基體形貌評價了界面的情況。
  13. Specification for insulating materials based on mica. part 3 : specificatins for individual materials. sheet 5 : glass - backed mica paper with an epoxy resin binder for post - impregnation

    雲母基絕緣材料規范.第3部分:專用材料規范.活頁5 :用樹脂的待浸漬處理的玻璃纖維織物襯底雲母紙
  14. Specification for insulating materials based on mica ; part 3 : specifications for individual materials ; sheet 5 : glass - backed mica paper with an epoxy resin binder for post - impregnation

    雲母基絕緣材料規范.第3部分:單項材料規范.第5活頁:用樹脂的待浸漬處理的玻璃纖維織物襯底雲母紙
  15. Performance for a piezoresistive transducer pressure sensor to thermal and pressure environments can be predicted by finite element method. a simplified 1 / 8 model, considering silicon dioxide and nitride process as well as stack anodic bonding and adhesive bonding processes, was developed. the fem results were found to be comparable to experimental data. case studies suggested that pyrex stack induces certain amount of non - linearity, while it isolates hard epoxy nonlinear effect. flexible epoxy bonding or soft adhesive bonding is preferred to the packaging process. the viscoelasticity and viscoplasticity of bonding material will result in hysteresis and drift errors to sensor output. however, soft adhesive s influence on sensor can be ignored under relative stable environments. more over, detailed design and process information will help to improve modeling application

    熱、壓境下壓阻變換壓力傳感器的性能可以通過有限元方法預測.這里研究了簡化的1 / 8模型,模型考慮了二化硅和氮化硅生成過程及堆陽極鍵合和膠合過程.果發現有限元預測果和實驗數據具有可比性.範例研究表明,硼硅堆導致產生一定的非線性,但它隔離了硬樹脂的非線性.在包裝過程中最好使用柔性黏合或軟黏膠性合.黏合材料的黏彈性和黏塑性將會導致傳感器輸出的滯后和漂移誤差.然而,在相對穩定的境下,軟黏合對傳感器的影響可以忽略.此外,詳細的設計和過程信息有助於提高模型的適用性
  16. The epoxy resin modified by polysiloxane have the advantage of both polysiloane and epoxy resin, it have good heat - resistance, moisture - resistance, dielectric properties. to improve the heat - resistance and the strengthening of the composite, nano - sio2 has been add into the reaction system to modify the epoxy resin with polysiloxane

    這種復合基體能有效得利用有機硅樹脂優異的耐熱性、耐候性、電絕緣性、憎水性、阻然性及耐寒性能,同時又具有樹脂良好的性、耐溶性及配伍性等優點。
  17. Study on the optical properties of transparent epoxy / clay nanocomposites a new type transparent epoxy based nanocomposites has been prepared by the reaction of alkylammonium exchanged montmorillonite ( amt ) with diglycidyl ether of bisphenol a ( dgeba ) and triethylamine as the curing agent. the morphology of amt in the epoxy matrix was characterized with x - ray diffraction ( xrd ), scanning electron microscopy ( sem ) and transmission electron microscopy ( tem )

    光學透明樹脂土納米復合材料光學性能採用十八烷基伯胺鹽、十六烷基三甲基溴化胺處理na基蒙脫土製備出兩種不同的有機土,以三乙胺為固化,有機土與雙酚a型樹脂熔融插層聚合后制備出剝離型和插層型兩種構的樹脂土納米復合材料。
  18. Standard test method for bond strength of epoxy - resin systems used with concrete by slant shear

    斜切法測定混凝土用樹脂強度的標準試驗方法
  19. Specification for insulating materials based on mica - specifications for individual materials - polyester film mica paper with an epoxy resin binder for single conductor taping

    雲母基絕緣材料規范.第3部分:單項材料規范.單根導線膠帶用帶有樹脂的聚脂薄膜雲母紙
  20. Solid epoxy resin with the low epoxy value is better than liquid epoxy resin to the magnetic performance, and the content is 2 % wt will do good to improve the magnetic characteristics of the bonded ndfeb magnet

    選用固態樹脂( e - 12 )且在ndfeb磁體中的含量為2 3為最好。
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