環焊試驗 的英文怎麼說

中文拼音 [huánhànshìyàn]
環焊試驗 英文
ring test
  • 環 : Ⅰ名詞1 （環子） ring; hoop 2 （環節） link 3 （姓氏） a surname Ⅱ動詞（圍繞） surround; encircle;...
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 試 : 名詞（古代占卜用的器具） astrolabe
  • 驗 : 動詞1. （察看; 查考） examine; check; test 2. （產生預期的效果） prove effective; produce the expected result
  • 試驗 : trial; experiment; test
  1. Welded link chain round steel non calibrated non tested

    未校準未試驗過的焊接圓鋼環鏈
  2. Abstract : by measuring the content of hydrogen diffused into the deposited metal under different temperature and humidity in the first environmental welding laboratory of our institute, the influence of the environmental conditions on the hydrogen diffusion was investigated

    文摘:通過在溫濕可調焊接實驗室中進行不同環境條件下的測氫焊接試驗，研究了環境條件對熔敷金屬中擴散氫含量的影響。
  3. Test standard for electromechanical components - switch environmental effects of machine soldering using an infrared system

    機電元件-開關的試驗標準.用紅外系統的機械釬焊的環境影響
  4. Smd environmental testing : tests - test : test methods for solderability of surface mounting devices by wetting balance using lead - free solder paste

    環境試驗:試驗.試驗:用無鉛焊錫膏濕潤平衡法測定表面安裝裝置
  5. Environmental testing - test methods - tests - test te - solderability testing of electronic components for surface mount technology by the wetting balance method

    環境試驗規程.第2部分:試驗方法.第69節:試驗te :潤濕平衡法試驗表面鑲嵌技術用電子元件軟釬焊
  6. Environmental testing. part 2 : tests. test ta : soldering. solderability testing by the wetting balance method

    基本環境試驗規程.第2部分:試驗.第54節:試驗ta :錫焊.潤濕平衡法可焊性試驗
  7. Environmental testing - part 2 : tests - test te : solderability testing of electronic components for surface mount technology by the wetting balance method

    基本環境試驗規程.第2部分:試驗.第69節:試驗te :潤濕平衡法對表面鑲嵌技術用電子元件的軟釬焊試驗
  8. Test standard for electromechanical components environmental effects of machine soldering

    機電元件的試驗標準.機械釬焊的環境影響
  9. Test standard for electromechanical components - environmental effects of machine soldering using a vapor phase system

    機電元件的試驗標準.用汽相系統的機械釬焊的環境影響
  10. Environmental testing. part 2 : tests. test t : soldering

    基本環境試驗程序.第2部分:試驗.試驗t :錫焊
  11. Environmental testing for electric and electronic prodcts. guidance on soldering test

    電工電子產品環境試驗錫焊試驗導則
  12. Environmental testing - test methods - tests - guidance on test t. soldering

    環境試驗.第2部分:試驗方法.第44節:試驗t指南:錫焊
  13. Basic environmental testing procedures for electric and electronic products - part2 : test methods - test t : soldering

    電工電子產品環境試驗第2部分：試驗方法試驗t ：錫焊
  14. Environmental testing - part 2 : tests ; guidance on test t : soldering iec 60068 - 2 - 44 : 1995 ; german version en 60068 - 2 - 44 : 1995

    基本環境試驗.第2部分:試驗.試驗t指南:錫焊
  15. Environmental testing - tests - test ta - soldering - solderability testing by the wetting balance method

    環境試驗.試驗.試驗2 . 1ta :釬焊.用濕平衡法進行釬焊性試驗
  16. Environmental testing. part 2 : tests. test te : solderability testing of electronic components for surface mount technology by the wetting balance method

    環境試驗.第2部分:試驗. te試驗:用加濕平衡法測試表面安裝技術的電子元件的可焊性
  17. Environmental testing - tests - test t. soldering

    環境試驗.試驗.試驗t .釬焊
  18. Environmental testing part 2 : tests. test ta : soldering. solderability testing by the wetting balance method

    環境試驗.第2部分:試驗.試驗ta :軟釬焊.用濕平衡法測試可焊性
  19. Basic environmental testing procedures for electric and electronic products - solderability testing by the wetting balance method

    電工電子產品基本環境試驗規程潤濕稱量法可焊性試驗方法
  20. Basic environmental testing procedures for electric and electronic products - guidance on solderability testing by the wetting balance method

    電工電子產品基本環境試驗規程潤濕稱量法可焊性試驗導則
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