There are three genetic types of mineral deposits in the beiya ore district : cu - au polymetallic deposits related to alkaline porphyries, comprising porphyritic cu - au deposits and polymetallic skarn deposits related to quartz - albite porphyry and quartz - k - feldspar porphyry ; fe - au deposits related to gabbro or basalt magma, consisting of magmatic fe - au deposits and sedimentary polymetallic deposits formed in caves and lakes ; and palaeo - placers formed at the weathering surface, in lakes and in karsts
北衙金礦有3種成因不同的礦床：與堿性斑巖有關的銅金多金屬礦，包括與石英鈉長斑巖和石英正長斑巖有關的斑巖型銅金礦床和
矽卡巖型多金屬礦床；與輝長玄武巖漿有關的鐵金礦床，包括熔漿型鐵金礦床和噴流沉積型多金屬礦床，後者又有洞穴和湖相沉積環境之分；及古
砂礦，有古風化殼型
砂礦、河湖相古
砂礦和洞穴沉積古
砂礦。
The quartz sand powder mainly used fors the glass, porcelain and ceramics, enamel ware, hot bottle, sodium silicates, cast, building materials, grind, fire - proof, the profession s main raw material of work, communication etc.
石英粉石英
砂粉主要是用於玻璃陶瓷搪瓷熱瓶膽
矽酸鈉鑄造建材研磨耐火軍工通訊等行業的主要原料。
The main kinds of rocks include carbonate rocks, tuffite, siliceous rocks and quartz sand - stone
主要巖石類型包括碳酸鹽巖、沈積凝灰巖、
矽質巖和石英
砂巖。
C. application : it is used in making glassware - plate glass, wired glass, figured glass, hollow glass, foam glass and glass block as beer bottle, cups, vacuum flask, optical glass, fiberglass and so forth. its application is common in founding, smelting, fireproof material, cement and chemical industry
用途：製造玻璃，耐火材料，冶煉
矽鐵，冶金熔劑，陶瓷，研磨材料，鑄造，石英在建築中利用其有很強的抗酸性介質浸蝕能力，用來制取耐酸混凝土及耐酸
砂漿。
Conical sand from stone
風化石錐輾
矽砂
Concial sand from coarse sand
粗
砂錐輾
矽砂
The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement
研究結果表明，增大
砂輪軸向進給速度和減小工件轉速，採用粗粒度
砂輪有利於提高磨削
矽片的材料去除率，
砂輪軸向進給速度對材料去除率的影響最為顯著；適當增大
砂輪轉速，減小
砂輪軸向進給速度，採用細粒度
砂輪可以減小磨削表面粗糙度；在其它條件一定的情況下，
砂輪速度超過一定值會導致材料去除率減小，主軸電機電流急劇增大，表面粗糙度變差；採用比# 2000粒度更細的
砂輪磨削時，材料去除率減小，
矽片表面粗糙度沒有明顯改善。
By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated
摘要利用基於自旋轉磨削原理的
矽片超精密磨床，通過試驗研究了
砂輪粒度、
砂輪轉速、工件轉速及
砂輪進給速度等主要因素對材料去除率、
砂輪主軸電機電流以及磨削后
矽片表面粗糙度的影響關系。
Silica base sand
氧化
矽基
砂
Silicon carbide grinding wheel
碳化矽砂輪
