研磨粒度 的英文怎麼說

中文拼音 [yánmólìdù]
研磨粒度 英文
grind size
  • 研 : 研同 「硯」
  • 磨 : 磨動詞1 （摩擦） rub; wear 2 （研磨） grind; mull; polish 3 （折磨） grind down; wear down [out]:...
  • 粒 : Ⅰ名 （小圓珠形或小碎塊形物） small particles; grain; granule; pellet Ⅱ量詞（用於粒狀物）
  • 度 : 度動詞[書面語] （推測; 估計） surmise; estimate
  • 研磨 : 1. （用工具研成粉末） grind; pestle2. （用磨料摩擦器物使變得光潔） abrade; polish
  1. The effects of impact angle, particle velocity, erodent size and impact time were demonstrated

    研究了沖蝕角度、沖擊速度、磨粒尺寸、沖蝕時間等影響因素對材料的沖蝕率的影響。
  2. The age hardening characteristic of as - cast cu20ni20mn and cu20ni35mn alloys and the interface characteristic between the alloy and cast tungsten carbide were studied, and on the basis of this study, composites of cu - ni - mn alloy reinforced with different volume fraction ( 0 - 45vol. % ) and different size ( 42 - 362 m ) of cast tungsten carbide particles were made by vacuum hot - pressing liquid sintering technology. pin on disk two body abrasion tests have been performed with different size of sic abrasive under different loads

    本文研究了鑄態cu20ni20mn和cu20ni35mn合金的時效硬化特性及其與鑄造碳化鎢的界面特性，並在此基礎上以不同尺寸（ 42 362 m ）的鑄造碳化鎢顆粒為增強體，採用真空熱壓液相燒結技術制備了不同顆粒含量（ 0 45vol . ）的鑄造碳化鎢顆粒增強cu - ni - mn合金基復合材料；以不同粒度的sic為磨料，在不同載荷條件下利用銷?盤磨損試驗機測試了復合材料的二體磨料磨損性能。
  3. Diamond micro powder ( abrasive grain = 0. 5 u m ) is added to the plating liquor, after many experiments, we discover every parameter of composite electro - brush plating, includes voltage of brush plating, relative velocity of between brush plating pen and workpiece, adding quantity of diamond micro powder etc. finally steel balls millstone covering with ni - fe - diamond composite electro - brush plating film is produced successfully

    試驗中加入粒度為w0 . 5的金剛石微粉，通過反復多次的試驗，確定出了鎳-鐵-金剛石復合電刷鍍中的各項工藝參數，包括電壓、鍍筆和工件的相對速度、金剛石微粉的加入量、溫度等等工藝參數；成功的試製成了覆蓋有鎳-鐵-金剛石復合電刷鍍層的鋼球研磨板。
  4. Sub - micron grades with extremely high wear resistance for abrasive materials such as laminated chip board, hard wood, etc

    是適合於研磨料（比如電木板、硬木）的加工，具有極高的耐磨性，晶粒度為亞微米級的牌號。
  5. The results show that under the same lapping conditions the si3 n4 ball has the lowest material removal rate and the best roundness and roughness, followed by zro2, al2o3, and sic ball

    結果表明：在相同的研磨條件下，具有長柱狀晶粒的氮化硅陶瓷球加工速率最低，但圓度和表面粗糙度最容易控制；氧化鋯和氧化鋁陶瓷球表面質量次之，碳化硅陶瓷球加工速率最高，圓度和表面粗糙度最難控制。
  6. Study on particle size distribution of polypropylene and grafting rate during pan - milling

    磨盤碾磨聚丙烯粒度分佈與接枝率的研究
  7. A theory model about wheat grinding and sifting was presented by collection of and study on foreign and domestic documents, which mainly refer to change of ground particle size between input and output, and mathematics description for material separation by a still and inclined sifting surface

    摘要通過對國內外文獻的整理和研究，列出了小麥研磨和篩分分離的基礎理論模型，主要是研磨顆粒輸入與輸出粒度的變化和靜止傾斜篩面物料分離的數學描述。
  8. Abstract : the effect factors of grinding roller surface roughness areanalyzed and experimented. the law of effect factors such as roller rotary speed, grinding wheel granularity, grinding liquid and so on, about roller surface roughness is obtained. the mathematical model of roughness is established through regression

    文摘:對影響磨削輥面粗糙度的因素進行了系統分析和實驗研究，得出了軋輥轉速、砂輪速度、砂輪粒度、磨削液等因素對磨削輥面粗糙度影響的一般規律，利用回歸分析的方法建立了粗糙度的數學模型。
  9. This edta route has several remarkable advantages in comparison with other method. because of the greater ability of edta anions to chelate metal cations, and forming very stable and soluble complexes, all of the starting materials are mixed at the molecular or atoms level in a solution, it is easy to control the composition and a high degree of homogeneity is achievable

    傳統的合成方法是高溫固相反應，由於灼燒溫度高、灼燒時間長，形成硬團聚體，產物粒徑較大，一般為m級，需進行球磨粉碎以減少其粒徑，很難制得均相、均一粒度分佈的氧化物粉體，在研磨過程中容易引入雜質且晶形破壞使得發光亮度減小。
  10. Erosive resistance of grey cast iron matrix composite has been investigated, on the condition of different volume fraction of wc and erosive angles and volume fraction of. the results showed that, the erosive resistance of composite with volume fraction of 27 wt % was the best ; volume abrasion rate of composites with different erosive angles was maximum at 50 angle, but volume abrasion rate was less at 0 and 70 angle ; on condition of the same volume fraction of wc and larger size of quartz sand in slurry, volume abrasion rate increased

    結果表明：碳化鎢體積分數為27的灰鐵基復合材料的耐沖蝕磨損性能最佳；不同沖蝕角下復合材料的體積碳化鎢顆粒增強鐵基表面復合材料及其沖蝕磨損性能研究摘要磨損量在50 「沖蝕角處最大，在0 」和70 」沖蝕角處較小；在碳化鎢顆粒體積分數相同的情況下，當漿料中的石英砂粒度大時，其體積磨損量增大。
  11. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明，增大砂輪軸向進給速度和減小工件轉速，採用粗粒度砂輪有利於提高磨削矽片的材料去除率，砂輪軸向進給速度對材料去除率的影響最為顯著；適當增大砂輪轉速，減小砂輪軸向進給速度，採用細粒度砂輪可以減小磨削表面粗糙度；在其它條件一定的情況下，砂輪速度超過一定值會導致材料去除率減小，主軸電機電流急劇增大，表面粗糙度變差；採用比# 2000粒度更細的砂輪磨削時，材料去除率減小，矽片表面粗糙度沒有明顯改善。
  12. By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated

    摘要利用基於自旋轉磨削原理的矽片超精密磨床，通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。
  13. 2 ) the inductance transducer used to identify large wear particle is developed. the analytical theory of wear particle and detection windings are expatiated and inner magnetic distribution of inductance transducer is discussed, the geometry parameters are optimized by using genetic algorithm, and the finite element analysis method is used in the designing

    2 ）研製了識別大磨損顆粒的材質和測定其粒度的電感傳感器，闡述了磨損顆粒與檢測線圈的解析關系，探討了傳感器的理論基礎，分析了電感式檢測傳感器內部的磁場分佈，並應用遺傳演算法優化了傳感器幾何參數，最後進行了有限元模擬分析。
  14. Based on the relations of wear particles, wear faults and wear mode, main characteristics of wear particles size, origin, shape and granularity are analyzed. on the view of strategies and functions of monitoring, an on - line oil monitoring system is designed and key technologies for development of monitoring system are presented. the inductance and optic - fiber transducer based laboratory are designed and tested

    論文基於磨損顆粒、磨損故障與磨損形式的關系，分析了磨損顆粒的尺寸、來源、形狀和粒度等基本特徵，並從監測策略和功能分析的角度設計了在線油液監測系統，提出了開發中必須解決的關鍵技術，研製了電感和光纖組合測量傳感器。
  15. A study on the granularity of tiny slag powder produced by ball milling and vertical milling

    球磨和立式磨礦渣微粉的粒度特性研究
  16. Testing method for grain size of coated abrasive macrogrits p12 - p220

    砂布用研磨材料粗晶粒的粒度試驗方法
  17. The diamond indenter is a king of standard measuring tool used to determine the standardized blocks and verify and calibrate schelometers. it is made by welding, grinding and machining certain grain of quality natural diamond into the rockwell, vickers of brinell hardness

    金剛石壓頭是將一粒定量的優質天然金剛石，按要求鑲焊研磨再機械加工成洛氏、維氏和布氏的標準計量工具，主要用於硬度塊的定度和對硬度計的鑒定。
  18. The properties of cn thin films such as their morphology, component, crystal structure and the bonding structure and the relation between those properties and the gas - phase reaction parameters were discussed, showing that the deposition of p - c3n4 thin film is the compete result of various reaction processes in the dynamics balance conditions ; the process of cn films depo sition is diagnosed in situ through the optical emission spectra technique, the effects of experimental parameters on the concentration of the precursors and the gas - phase reactions in the plasma have been obtained ; the main reaction precursors for film deposition identified ; the relation between the characteristics of cn thin films and the reaction process in the plasma is analyzed. the cn thin films deposition under different substrate temperatures in high pressure pe - pld shows that the si atom of the substrate has participated the cn films growth process, based on this the growth mode of cn thin films on the si substrate is proposed. the further experiment of cn thin films deposition on si substrate scratched by diamond as well as covered with fe catalyzer has been attempted, which indicates that changing the dynamics conditions of the surface reaction can alter the growth characteristic of the cn thin films and can enhance obviously the films growth rate

    採用pld技術進行了碳氮化合物薄膜沉積，得到了含氮量為21at的cn薄膜；研究了襯底溫度和反應氣體壓強對薄膜結構特性的影響，給出了cn薄膜中n含量較小、 sp ~ 3鍵合結構成分較少和薄膜中僅含有局域cn晶體的原因；引入脈沖輝光放電等離子體增強pld的氣相反應，給出了提高薄膜晶態sp ~ 3鍵合結構成分和薄膜的含n量可行性途徑；應用pe - cvd技術以ch _ 4 + n _ 2為反應氣體並引入輔助氣體h _ 2 ，得到了含n量為56at的晶態cn薄膜；探討了cn薄膜形貌、成分、晶體結構、價鍵狀態等特性及其與氣體壓強和放電電流的關系，證明了- c _ 3n _ 4薄膜沉積為滿足動力學平衡條件的各種反應過程的競爭結果；採用光學發射譜技術對cn薄膜生長過程進行了實時診斷，得到了實驗參量對等離子體中活性粒子相對濃度和氣相反應過程的影響規律，給出了cn薄膜沉積的主要反應前驅物，揭示了cn薄膜特性和等離子體內反應過程之間的聯系；採用高氣壓pe - pld技術研究了不同襯底溫度條件下cn化合物薄膜的結構特性，揭示了si原子對薄膜生長過程的影響，給出了si基表面碳氮薄膜的生長模式；在金剛石研磨和催化劑fe處理的si襯底上進行cn薄膜沉積，證明了通過控制材料表面動力學條件可以改變碳氮薄膜結構特性，並可顯著提高晶態碳氮材料的生長速率。
  19. The above sharpening - stone are made of the blank silicon - carbide and green silicon - carbide with the vitrified bond. and are available for bro ceaaing all kinds of stone materials and floors. for the finer grain sizes, they can be also used in sharpening of the cutting tools

    此種磨石採用黑碳化硅、綠碳化硅、棕剛玉為原料，用陶瓷結合劑製作而成，適用於各種石材、地面的研磨，粒度較細的，也可用來磨礪刀具。
  20. The cmp experiment was carried out systematically on litao3 wafer. the polished surface foughness and material removal rate in different polishing conditions were measured and the effects of polishing pad material and its condition, pressure, rotating speed of the polishing plate, the type and size of abrasive, and the properties of the polishing slurry on the surface routhness and material removal rate were analysed in details

    通過對鉭酸鋰晶片的化學機械拋光過程的實驗研究，通過測量鉭酸鋰晶片在不同拋光條件下的表面粗糙度和材料去除率，詳細分析了拋光墊材料和狀態、拋光壓力、拋光盤轉速、磨料種類及粒度、拋光液組成等幾個因素對拋光表面質量和材料去除率的影響規律。
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