研磨速度 的英文怎麼說

中文拼音 [yánmósùdù]
研磨速度 英文
grinding rate
  • 研 : 研同 「硯」
  • 磨 : 磨動詞1 （摩擦） rub; wear 2 （研磨） grind; mull; polish 3 （折磨） grind down; wear down [out]:...
  • 速 : Ⅰ形容詞（迅速; 快） fast; rapid; quick; speedy Ⅱ名詞1 （速度） speed; velocity 2 （姓氏） a surna...
  • 度 : 度動詞[書面語] （推測; 估計） surmise; estimate
  • 研磨 : 1. （用工具研成粉末） grind; pestle2. （用磨料摩擦器物使變得光潔） abrade; polish
  • 速度 : 1. [物理學] velocity; speed; blast; bat 2. [音樂] tempo3. （快慢的程度） speed; rate; pace; tempo
  1. The effects of impact angle, particle velocity, erodent size and impact time were demonstrated

    研究了沖蝕角度、沖擊速度、磨粒尺寸、沖蝕時間等影響因素對材料的沖蝕率的影響。
  2. By study we find the activeness of carbon nanotube may be enhanced after oxidization, sensitization and activation. then we consider temperature, ph and composition of plating bath, in order to make the speed of coating as possible as slow

    通過研究，發現經過研磨、氧化、敏化、活化后，可以提高碳納米管表面的活性，通過改進鍍液成分， ph值以及溫度等，使沉積的速度盡可能的低。
  3. I on the tamshui line, reducing train speed, schedule length, wheel friction and number of carriages from six to three, plus erecting more effective sound barriers along the emergent section close to minchuan west road station

    新北投支線採取調降行車速度、減少班次、六車組改為三車組、車輪切削、鋼軌研磨等改善措施；民權西路站進入地下段前，增設全罩式隔音墻工程。
  4. Diamond micro powder ( abrasive grain = 0. 5 u m ) is added to the plating liquor, after many experiments, we discover every parameter of composite electro - brush plating, includes voltage of brush plating, relative velocity of between brush plating pen and workpiece, adding quantity of diamond micro powder etc. finally steel balls millstone covering with ni - fe - diamond composite electro - brush plating film is produced successfully

    試驗中加入粒度為w0 . 5的金剛石微粉，通過反復多次的試驗，確定出了鎳-鐵-金剛石復合電刷鍍中的各項工藝參數，包括電壓、鍍筆和工件的相對速度、金剛石微粉的加入量、溫度等等工藝參數；成功的試製成了覆蓋有鎳-鐵-金剛石復合電刷鍍層的鋼球研磨板。
  5. On the other side, based on research on noncircular surface grinding features, this deissertation designs the data structure of simulation driver, then, applies interpolation theory to design the grinding motion simulation module and researches all sorts of cases on constructing the solid swept of grinding wheels in the process of noncircular surfaces grinding, finally, designs nc codes verification simulation module by using design model - based verification technique

    在實體模擬技術方面，詳細研究了非圓曲面磨削加工的特徵並設計了對應的模擬驅動數據結構;應用插補原理設計了體現加工速度的運動過程模擬模塊;詳細研究了非圓曲面磨削加工中砂輪的相對和絕對運動掃掠實體的構造，並採用基於精確實體設計模型的驗證方法構建了數控代碼的模擬驗證模塊。
  6. This paper describes the structure and kinematic parameters for the uniform lapping of the four shafts ball - lapping machine using analytical and graphical methods, and establishes full conditions of the uniform lapping on requring equal pressure and velocity of four lap tools

    根據四軸球體研磨機的球體研磨原理，由實現球體均勻研磨所需的壓力和速度條件，對該機的結構參數和運動參數進行了解析和圖解分析，建立了實現球體均勻研磨的充分必要條件。
  7. Equations of mesh, shorting contact line, undercutting limit line, meshing limit lines and the existence conditions, angle between the direction of relative speed and the direction of contact line, induced normal curvature about every point on the contact line are established. moreover, the paper also theoretically analyzed the error of the grinded gear surface. on the basis of the theory, the computer program is worked out to automatically produce the contact line and the boundary curves of mesh. analysis of meshing circs under different parameters can be done so that we can gain the best process condition

    首先對漸開面二次包絡理論進行了深入的探討，推導出了兩次嚙合的嚙合方程式、瞬時接觸線方程式、根切界限線方程式、嚙合界限線的方程式及其存在條件，相對運動速度方向與接觸線方向的夾角及接觸線上各點的誘導法曲率；此外，還對磨齒后工件的齒面誤差進行了理論分析；並在理論基礎上編制了相應的計算機程序，自動生成接觸線族及嚙合界限線，對不同參數條件下的嚙合情況進行分析，可以使工藝條件達到最佳狀態；最後研究了磨齒裝置，設計了磨齒機的傳動系統。
  8. The results show that under the same lapping conditions the si3 n4 ball has the lowest material removal rate and the best roundness and roughness, followed by zro2, al2o3, and sic ball

    結果表明：在相同的研磨條件下，具有長柱狀晶粒的氮化硅陶瓷球加工速率最低，但圓度和表面粗糙度最容易控制；氧化鋯和氧化鋁陶瓷球表面質量次之，碳化硅陶瓷球加工速率最高，圓度和表面粗糙度最難控制。
  9. Abstract : the effect factors of grinding roller surface roughness areanalyzed and experimented. the law of effect factors such as roller rotary speed, grinding wheel granularity, grinding liquid and so on, about roller surface roughness is obtained. the mathematical model of roughness is established through regression

    文摘:對影響磨削輥面粗糙度的因素進行了系統分析和實驗研究，得出了軋輥轉速、砂輪速度、砂輪粒度、磨削液等因素對磨削輥面粗糙度影響的一般規律，利用回歸分析的方法建立了粗糙度的數學模型。
  10. The processing speed and precision adsolutely ezceeds type of machine made by the states or japan as truly reaches extreme precision, time saving, hign efficiency of professional and multiple function of grinding tool

    加工速度及精密度絕對超越歐洲、美國、日本製造之任何機種，真正達到極精密、省時間、高效率的專業用全功能研磨加工利器。
  11. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明，增大砂輪軸向進給速度和減小工件轉速，採用粗粒度砂輪有利於提高磨削矽片的材料去除率，砂輪軸向進給速度對材料去除率的影響最為顯著；適當增大砂輪轉速，減小砂輪軸向進給速度，採用細粒度砂輪可以減小磨削表面粗糙度；在其它條件一定的情況下，砂輪速度超過一定值會導致材料去除率減小，主軸電機電流急劇增大，表面粗糙度變差；採用比# 2000粒度更細的砂輪磨削時，材料去除率減小，矽片表面粗糙度沒有明顯改善。
  12. Aiming at the key component, through analyzing the time domain and frequency characteristic of acceleration vibration signals and force signals, this paper attempts to find the infection factors of grinding vibration and to optimize the grinding parameters, which is based on ultra - high speed surface grinding experimentation

    摘要以關鍵部件為研究對象，通過在超高速磨削實驗臺上進行磨削工藝試驗，對比不同參數下加速度振動信號和磨削力信號的時頻特徵，分析了磨削過程振動特性及其各種影響因素，提出磨削工藝參數優化方案。
  13. By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated

    摘要利用基於自旋轉磨削原理的矽片超精密磨床，通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。
  14. Abstract : based on two important factors of influencing efficiency of ball mill. - revolution speed and feed size, the paper studies internal regulation actting on energy consumption of ball mill, establishes a mathematical model for the optimization of low energy consumption ball mill system

    文摘:從影響球磨機效率的兩個重要因素? ?轉速和物料的入磨細度著手，研究其與球磨機能耗之間的內在規律.通過粉磨試驗，建立了相應的數學模型，為低能耗球磨系統的優化提供了依據
  15. Speed glaze contains a high level of pure polishing oils and only a small amount of very fine diminishing abrasives for cleaning / removing surface imperfections, blemishes, and surface stain

    快速上釉包括高濃度的純拋光油和只是一小部分的縮微的研磨劑，用於清潔漆面上的污點、瑕疵、污垢等。
  16. The properties of cn thin films such as their morphology, component, crystal structure and the bonding structure and the relation between those properties and the gas - phase reaction parameters were discussed, showing that the deposition of p - c3n4 thin film is the compete result of various reaction processes in the dynamics balance conditions ; the process of cn films depo sition is diagnosed in situ through the optical emission spectra technique, the effects of experimental parameters on the concentration of the precursors and the gas - phase reactions in the plasma have been obtained ; the main reaction precursors for film deposition identified ; the relation between the characteristics of cn thin films and the reaction process in the plasma is analyzed. the cn thin films deposition under different substrate temperatures in high pressure pe - pld shows that the si atom of the substrate has participated the cn films growth process, based on this the growth mode of cn thin films on the si substrate is proposed. the further experiment of cn thin films deposition on si substrate scratched by diamond as well as covered with fe catalyzer has been attempted, which indicates that changing the dynamics conditions of the surface reaction can alter the growth characteristic of the cn thin films and can enhance obviously the films growth rate

    採用pld技術進行了碳氮化合物薄膜沉積，得到了含氮量為21at的cn薄膜；研究了襯底溫度和反應氣體壓強對薄膜結構特性的影響，給出了cn薄膜中n含量較小、 sp ~ 3鍵合結構成分較少和薄膜中僅含有局域cn晶體的原因；引入脈沖輝光放電等離子體增強pld的氣相反應，給出了提高薄膜晶態sp ~ 3鍵合結構成分和薄膜的含n量可行性途徑；應用pe - cvd技術以ch _ 4 + n _ 2為反應氣體並引入輔助氣體h _ 2 ，得到了含n量為56at的晶態cn薄膜；探討了cn薄膜形貌、成分、晶體結構、價鍵狀態等特性及其與氣體壓強和放電電流的關系，證明了- c _ 3n _ 4薄膜沉積為滿足動力學平衡條件的各種反應過程的競爭結果；採用光學發射譜技術對cn薄膜生長過程進行了實時診斷，得到了實驗參量對等離子體中活性粒子相對濃度和氣相反應過程的影響規律，給出了cn薄膜沉積的主要反應前驅物，揭示了cn薄膜特性和等離子體內反應過程之間的聯系；採用高氣壓pe - pld技術研究了不同襯底溫度條件下cn化合物薄膜的結構特性，揭示了si原子對薄膜生長過程的影響，給出了si基表面碳氮薄膜的生長模式；在金剛石研磨和催化劑fe處理的si襯底上進行cn薄膜沉積，證明了通過控制材料表面動力學條件可以改變碳氮薄膜結構特性，並可顯著提高晶態碳氮材料的生長速率。
  17. The establishment of gear fault data warehouse the paper studies several gear cases in drive lab of wuhan university of science and technology. the signal of normal gear pair, the one has been worn seriously, the one which has circular pitch error and the one whose pinion has a ruptured tooth is acquired independently. after fft transformation, the amplitude values of 0 - 0. 4 multiple engage frequency, 0. 4 - 0. 5 multiple engage frequency, 0. 5 - 1 multiple engage frequency, 1 multiple engage frequency, 2 multiple engage frequency, 3 multiple engage frequency, 4 multiple engage frequency and greater then 4 multiple engage frequency of every signal are obtained respectively

    論文主要完成下列內容: 1 .齒輪故障數據倉庫的建立以武漢科技大學傳動實驗室的若干臺齒輪箱為研究對象，分別採集正常齒輪副、磨損嚴重的齒輪副、有周節誤差的齒輪副和小齒輪有一個斷齒的齒輪副的振動加速度信號，經過fft變換，分別得到每個信號的0 ~ 0 . 4倍嚙合頻率、 0 . 4 ~ 0 . 5倍嚙合頻率、 0 . 5 ~ 1倍嚙合頻率、 1倍嚙合頻率、 2倍嚙合頻率、 3倍嚙合頻率、 4倍嚙合頻率和大於4倍嚙合頻率幅值。
  18. The primary investigation was carried out using mechanical polishing equipment. the diamond films after polishing were observed by means of scanning electron microscope. the machining process and the factors which influence the polishing efficiency and quality were preliminary discussed

    開展了金剛石膜的機械拋光研究，使用自製的研磨裝置對金剛石膜進行精拋光加工，分析拋光速度等工藝參數對加工效果和效率的影響，並通過sem等手段分析了微觀形貌和拋光機理。
  19. The position of the trajectory depends on the ratio of bead - to - fluid density, the ratio of bead - to - disc radius and the reynolds number which describes the operating conditions of the stirred media mill. by means of the beads motion in the calculation domain, the influence of different comminution operation parameters on comminution results is discussed. those parameters mainly include the beads size, beads density, stirrer angular speed and liquid density and viscosity etc. those parameters are optimized so that the comminution results are improved

    通過研究研磨介質在計算域內的運動來探索不同的粉磨技術參數對粉碎效果的影響，這些粉磨技術參數主要包括磨介尺寸、磨介密度、攪拌盤速度、液流密度及粘度等；通過優化這些參數來達到提高攪拌盤式攪拌磨粉磨效果的目的。
  20. In this paper, ptfe and ptfe composited with sicp, sicw, mos2p and sicp + mos2p with various ratios respectively have been obtained by compression molding. under the condition of dry friction, a systematic study has been done on the weight loss and the friction coefficient of composites and the relations between the properties and content of the filling, the load and the sliding velocity

    在干摩擦滑動磨損條件下，對ptfe材料及其復合材料的磨損失重、摩擦系數及磨損機理進行了研究，同時對其與磨損外部條件（載荷、滑動速度）和材料的內部因素（填料的含量、粒徑、種類）的關系進行了較為系統的研究。
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