磨削容量 的英文怎麼說
中文拼音 [móxiāoróngliáng]
磨削容量
英文
grinding capacity-
The unstable solid solution would disintegrate and transform into carbide phases in these systems of sisocso, tisocso and zrsocso, based on the increase of free energy introduced by the effect mechanical alloying. for the system of wsocso, the solid solution had not transformed into tungsten carbides but an amorphous phase, which was different from those systems. the exist of fe in these experiments, which came from the abrasion of ball - milling tool because of the higher hardness of w and w - c solid solution, would induce the crystalline - to - amorphous phase transformation during milling
C50球磨體系中，繼續球磨時，不穩定的固溶體在機械合金化作用下，由於體系能量提高，會發生分解相變，從而可以形成碳化物；對于w扣c50球磨體系， w ? c固溶體具有較高的硬度，磨削不銹鋼質的球磨介質和球磨容器，而引入雜質，其中fe會促使固溶體向非晶相轉變。This paper mainly aims at the strategic demands for large - aperture lightweight mirror proposed by high - tech development. its main research contents are : select material blank for lightweight mirror according to physical and chemical properties of optical glass ; analyze and calculate the deformation quantity of the mirror with finite element method ; design and optimize mirror body structure of 400 lightweight plane mirror and 450 lightweight spherical mirror, analyze glass cutting principle, design specisl - use grinding wheel structure, select reasonable technological parameters to implement the processing of weight reduction holes on 400 plane mirror ; analyze etching mechanism of hydrofluoric acid, look for the technological parameters such as the optimal acid concentration and etching time etc. ; eliminate the stress of weight reduction holes and micro - cracks on 400 lightweight plane mirror ; discuss the processing principle and
本論文的研究主要是瞄準國家高技術對大口徑輕型鏡的戰略需求而開展的。主要研究內容是：根據光學玻璃的物理與化學性能，選擇輕型鏡坯材料；用有限元法對鏡子的變形進行分析、計算，找出變形規律，優化設計400mm輕型平面鏡、 450mm輕型球面鏡鏡體結構；分析玻璃切削原理，設計專用磨輪結構，選擇合理工藝技術參數，完成400mm平面鏡輕量化減重孔的加工；分析氫氟酸腐蝕光學玻璃機理，尋找最佳酸濃度、腐蝕作用時間等工藝參數，實現400mm平面鏡減重孔應力與微裂紋的消除；討論分離器加工原理和工藝技術特點，完成400mm平面輕型鏡面形加工。There exist large stress, intensive scratch, damage and pollution of ion in wafer process, so it is necessary to improve mechanism of slicing and lapping by changing single mechanical function to equilibrium chemical and mechanical function for small damage and low stress. reducing damage and stress and enhancing quality and efficiency of product result in a base of followed process so as to improve wafer process and enhance finished product ratio of whole wafer process
目前加工過程中存在應力過大，造成表面劃傷嚴重，容易產生破損，離子沾污的問題，因而必須改善切削、研磨機理，把單一的機械作用變為均勻穩定的化學機械作用，以達到淺損傷、低應力的目的，有效的減少破損層和應力的累積，提高產品質量和加工的效率。Instrument technology research center ( itrc ) has devoted to limited and diversified ultra - precision components fabrication for more than 30 years, and established various aspheric optics fabrication units, precision centering machines, and micro lens and diffractive optical element ( doe ) machining devices in the past years
摘要為配合國內光電產業之蓬勃發展，儀器科技研究中心在既有之傳統光學加工與精密光機元件、微光學元件以及非球面光學元件之加工與檢測技術能量上，於94年度引進五軸超精密鉆石車削輪磨機，以擴展完整的光學工程技術陣容，滿足多樣性之研發需求。分享友人