自化視距測量 的英文怎麼說

中文拼音 [huàshìliáng]
自化視距測量 英文
tacheomeric survey
  • : Ⅰ代詞(自己) self; oneself; one s own Ⅱ副詞(自然;當然) certainly; of course; naturally; willin...
  • : Ⅰ動詞1. (看) look at 2. (看待) regard; look upon 3. (考察) inspect; watch Ⅱ名詞(姓氏) a surname
  • : Ⅰ名詞1 (距離) distance 2 (雄雞、雉等的腿的後面突出像腳趾的部分) spur (of a cock etc )Ⅱ動詞...
  • : 動詞1. (測量) survey; fathom; measure 2. (測度; 推測) conjecture; infer
  • : 量動1. (度量) measure 2. (估量) estimate; size up
  • 視距 : apparent distance
  • 測量 : measure; survey; gauge; meter; measurement; measuring; surveying; mensuration; metering; gauging;...
  1. Electrical parameter includes voltage, current, power, frequency, power factor, and so on. the adjustment system of electrical network needs many panel instruments that can show the electrical parameter, such as voltage, current, power, cycle etc. tjsually these instrument is not accurate, wastes manpower resource, and the management of the data is inconvenient and easy to mistake. recently the development of micro - electronics technology and the advent of slsi. especially the advent of singlechip, lead to a new revolution in the field of instrument

    電工參數一般包括電壓、電流、功率、頻率、功率因數等。在電網調度的設備中需要配置多隻顯示上述電工參數的鑲嵌式面板表,如電壓表、電流表、功率表等等,其一般均為指針式面板表,精度低,可離近,數據需要人工抄錄,浪費人力資源,數據管理不便,容易出錯。
  2. With the development of microelectronic products ( integrated circuit, printed circuit board, etc ) directing to high density, thin separation and low defect ratio, its inspection requirement is higher on aspects of precision, efficiency, universal, and intelligence etc. therefore, this paper researched on the general key techniques in the field of microelectronic products vision inspection, covered the shortage of traditional inspection on aspects of fast and precision locating, image mosaic, and fine defect test, completed theory study on physical dimension and defect inspection of microelectronic products based on machine vision, developed the prototype and used lots of experiments to prove its correctness and feasibility

    隨著微電子產品(集成電路晶元、印刷電路板等)向著高密度、細間和低缺陷方向發展,對其檢技術在精密、高效、通用和智能等方面提出了更高要求。由此,本文對微電子產品覺檢中的關鍵技術進行研究,彌補了傳統檢在精確快速定位、圖像全景組合和精細缺陷檢等方面的不足,最終完成基於機器覺的微電子產品外形尺寸和缺陷檢的理論研究和樣機研製,並進行了大實驗證明其正確性和可行性,力圖為我國主創新的微電子產品覺檢技術提供理論和實際借鑒。
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