襯底擴散 的英文怎麼說

中文拼音 [chèndekuòsǎn]
襯底擴散 英文
substrate diffusion
  • : Ⅰ動詞1 (在裏面托上一層) line; place sth underneath 2 (陪襯; 襯托) set off Ⅱ名詞(襯在裏面的附...
  • : 底助詞(用在定語后, 表示定語和中心詞之間是領屬關系, 現在多寫作「的」)
  • : 動詞(擴大) expand; enlarge; extend
  • : 散動詞1. (由聚集而分離) break up; disperse 2. (散布) distribute; disseminate; give out 3. (排除) dispel; let out
  1. A monte - carlo method has been developed for simulating the growth of epitaxy flims. the program was compiled using turbo basic language. the influence of growth rate and temperature on surface morphology was studied. the model we used was an advanced diffusion limited aggregation ( dla ) model. the process of deposition and diffusion were considered in this model

    本文利用montecarlo方法,結合薄膜生長理論,採用turbobasic語言編寫程序,對外延薄膜的生長過程進行了模擬。所用的模型為改進的有限聚集模型( dla ) ,研究了薄膜生長過程中沉積速率和溫度對表面形貌的影響。
  2. The source is which is placed along with the polished substrate in an evacuated, sealed quartz ampoule.

    源與拋光一起置放在抽真空密封的石英管內。
  3. < uk > the source is which is placed along with the polished substrate in an evacuated, sealed quartz ampoule. < / uk >

    < uk >源與拋光一起置放在抽真空密封的石英管內。 < / uk >
  4. Sige simox : oxygen ions with high dose were implanted into sige grown directly on silicon substrate for the first time, and sige - oi novel structure was formed successfully with additional high temperature annealing ; it has been confirmed that oxygen implantation with 45kev, 3 1017cm - 2 and annealing at 12500c in ar + 5 % o2 for 5 hours, are fit for the formation of sige - oi structure ; ge loss during the high temperature annealing has been observed, which is originated from ge volatility and ge diffusion ; it has been proposed to use nanoporous layer induced by h + / he + implantation to surppress ge diffusion and to use surface oxidation to overcome the upper limit of sige simox. sige smart - cut : hydrogen ions were implanted into sige material and followed by high temperature process ( 4000c to 7000c ) ; blistering study was done and suggested the possibility of sige layer transfer by smart - cut technology ; it is concluded that the bubble formation is easier in sige than in si, and the strain in sige / si and the difference of binding energy in sige and in si could possibly contribute to this effect. behavior of sige / si implanted with hydrogen : gave a detailed study on sige implanted by beamline or phi hydrogen implantation ; it has been found that great strain is introduced into sige by hydrogen implantation and this strain could be alleviated by high temperature annealing ; both for conditional beamline implantation and piii hydrogen implantation, 600 is appropriate for the post - implantation treatment

    Sige - simox工藝方面:首次採用硅( 100 )上直接外延的100nm厚sige的樣品中注入高劑量的o離子,通過退火處理成功制備了sige - oi新結構,即sige - simox工藝,證實了以45kev注入3 10 ~ ( 17 ) 7cm ~ ( - 2 )劑量的氧離子,隨后在氧化層的保護下經1250 , ar + 5 o _ 2氣氛的高溫退火( 5小時)過程,可以制備出sige - oi新型材料;實驗中觀察到退火過程中的ge損失現象,分析了其原因是ge揮發( ge通過表面氧化層以geo揮發性物質的形式進入退火氣氛)和ge( ge穿過離子注入形成的氧化埋層而進入si中) ,其中ge是主要原因;根據實驗結果及實驗中出現的問題,對下一步工作提出兩個改進的方案:一是通過在si中注入適量h ~ + / he ~ +形成納米孔層來阻斷ge通路,二是可以通過控製表面氧化來調節安止額士淤丈撈要表面sige層中的ge組分,從而部分解決sige
  5. The gas sources that we used are trimethylgallium ( tmg ) and 99. 9999 % purity nitrogen, which were fed into reaction chamber and resonance cavity respectively. the highly dense ecr plasma up to 1011cm - 3 was created in the resonance cavity and introduced to the next reaction chamber by the force of divergent magnetic field. consequently, gan thin film was grew on the substrate sapphire ( 0001 ) placed in the downstream

    實驗採用有機金屬三甲基鎵氣源( tmg )和99 . 9999純度的氮氣,在ecr - pecvd150裝置共振腔內電子迴旋共振吸收微波能量產生的高密度ecr等離子體在磁場梯度和等離子體密度梯度的作用下向下級反應室,在放置於下游區樣品臺上的- al _ 2o _ 3表面附近發生物理化學反應沉積成gan薄膜。
  6. In succession, tini thin film is deposited on single - crystal silicon substrate using optimized parameters utilizing sputtering, and its transformation temperature ( a * ) is 72 ? indicated by dsc curve after being annealed in an ultra - high vacuum ( uhv ) chamber. in addition, the composition of the silicon - based tini film was analyzed by an energy dispersive x - ray spectroscopy ( eds ), and the ti content in the film is approximately 51at %

    按照改進的工藝參數,在單晶硅上濺射-淀積了tini薄膜,並進行了超高真空退火, dsc法測得其馬氏體逆相變峰值溫度為72 ,利用能譜分析( eds )技術測得其ti含量約為51at ,通過對非晶tini薄膜與單晶硅之間的界面進行eds及x射線衍射( xrd )分析,發現在用大功率( 2000w )直流磁控濺射法制備tini薄膜過程中,存在ti 、 ni與si的雙向,發生了界面反應,並有三元化合物ni _ 3ti _ 2si生成。
  7. Rf magnetron sputtering that has been broadly used to fabricate a variety of thin films is a kind of physical vapor deposition ( pvd ), which consists of two main microscopic processes, one is the generation and transportation of the vapor phase particles to form the thin film, the other is the diffusion and aggregation of the film atoms on substrate, which leads to the formation of the film

    射頻磁控濺射是一種物理氣相沉積技術,已被廣泛地用於各種薄膜的制備。它主要包括成膜氣相粒子(原子或分子)的產生和輸運以及輸運到的成膜粒子在上的、聚集、生長成膜兩大過程。
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