記憶元件 的英文怎麼說

中文拼音 [jìyìyuánjiàn]
記憶元件 英文
memory element
  • 記 : Ⅰ動詞1 （把印象保持在腦子里） remember; bear in mind; commit to memory 2 （記錄; 記載;登記） writ...
  • 憶 : 動詞（回想; 記得） recall; recollect
  • 件 : Ⅰ量詞（用於個體事物） piece; article; item Ⅱ名詞1. （指可以一一計算的事物） 2. （文件） letter; correspondence; paper; document
  • 記憶 : 1 （記住或想起） remember; recall 2 （保持在腦子里的印象） memory 3 [自動化] storage; 記憶符號 mn...
  1. In the latter case the implied feedback loops will be contained within the memory elements themselves.

    在後一種情況下，隱含的反饋迴路包含在記憶元件的內部。
  2. Experimental results show that niti memory wire for pure martensite or pure austenite and superelastic wire has strain - sensing nature, and memory - wire and superelastic wire possess stress - actuating property during restrained recovery, and that niti superelastic wire can be used as strain - sensing element to monitor structural health condition

    實驗結果表明，純馬氏體態、純奧氏體態niti記憶絲及超彈絲具有應變傳感性能，約束回復中的sma與自然回復過程中的超彈絲具有力驅動性能，一定狀態的sma可實現自傳感驅動； niti超彈性絲可用作結構健康監測的應變傳感元件。
  3. The companys main area of business is ic design, but it also handles most other stages in the ic production process, including marketing, with only ic foundry operations and assembly and testing being outsourced. te hsins product line includes power management ic and amplifier ic. te hsin adopted a strategy based on the recruitment of talented personnel from overseas

    盛群半導體公司為國內前十大ic設計公司，目前產品范圍包括有通用型與專用型微控制器mcu ，除一般應用領域外，更涵蓋語音通訊電腦周邊家電等各專業領域，此外並提供各種電源管理，非揮發性記憶體等微控制器周邊元件。
  4. In consumer market, the different lithium batteries can be used as power sources in memory back up devices, instruments & meters, movable telephones, caculators, notebook computers, electric watches, electric toys, recorders, etc

    在民用方面，可用於作記憶儲存元件、儀器儀表、便攜式電子器件、移動電話、計算機、電子表和電子玩具等的電源。
  5. Based on the established three - dimensional physical model, simplified terms, specified material parameters in thermal and physical properties, boundary conditions, and the calculation method of heat convection of cooling water, the numerical simulation and analysis on steady - state temperature field for continuous unidirectional solidification of niti shape memory alloy wire billets were proceeded under the condition of different combined parameters using ansys finite - element software

    在建立三維物理模型以及確定材料熱物性參數、邊界條件與冷卻水對流換熱系數計算方法的基礎上，採用ansys有限元軟體對不同參數組合條件下鎳鈦形狀記憶合金線坯連續定向凝固的穩態溫度場進行了數值模擬。
  6. Preliminary experimental study on latent thermal energy storage employing multiple phase change materials

    熱電控制記憶合金驅動元件的實驗與數值研究
  7. In addition a number of technologies of shape memory alloy acted as actuator were disscussed

    對形狀記憶合金作為驅動元件的若干應用技術問題進行了探討。
  8. After conducting cargo examination, customs officers uncovered behind the rear seats of the private car 300 computer hard disks bearing suspected forged trade mark and trade description, 3, 207 mobile phones of assorted brands, and 2, 800 pieces of ram, worth about $ 2. 88 million in total

    進行查驗后，海關人員發現後座乘客座位的背後藏有300個懷疑冒牌及印有虛假說明的電腦硬盤、 3 ， 207部無線電話及2 ， 800件電腦隨機接達記憶體（ ram ） ，總值約288萬元。
  9. Should there capacitance of the provisional filing documents in a timely manner into the flash memory chip can guarantee archived documents " permanent retention " flash memory chips into the memory of ( name of the file extension sav document ) only through on - line computer in the mobile disk operating the computer can be deleted or backup, no longer subject to the electric capacitance effects

    因此要將電容內的臨時存檔文件及時寫入閃存晶元才能保證存檔文件的"永久性保留" ，寫入閃存晶元的記憶文件（文件后綴名稱為sav的文件） ，只有通過電腦聯機在移動磁盤下操作才可以在電腦上刪除或備份，不再受電容電能的影響。
  10. Effect of tiaogan jiedu formula on learning and memory in rats with chronic epilepsy and expression of camp responsive element binding protein in hippocampus

    調肝解毒方對慢性癲癇大鼠學習記憶及海馬組織環磷酸腺苷反應元件結合蛋白表達的影響
  11. Code reviews - creating unit and component tests, as well as detecting memory and performance bottlenecks, in parallel to writing code - returns in form of higher quality code and reduced development time

    透過建立自動程式碼審查- -與程式碼編寫同步進行，來建立單元和元件測試，並發現記憶體和效能瓶頸- -帶來了高品質的程式碼，同時也減少了開發的時間。
  12. Coverage ranges from thermal properties and semiconductor materials to mosfets, digital logic families, memory devices, microprocessors, digital - to - analog and analog - to - digital converters, digital filters, and multichip module technology

    覆蓋范圍從熱性能和半導體材料的mosfet ，數字邏輯家庭，記憶體裝置，微處理器，數位類比和模擬到數字轉換器，數字濾波器，以及多晶元組件技術。
  13. What sequence of events do you think would be required to move the contents of one memory cell in a computer to another memory cell

    你認為要搬移某記憶體單元的內容至另一記憶體單元需要哪些一連串的事件來完成
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