質子注入 的英文怎麼說

中文拼音 [zhízizhù]
質子注入 英文
protonation
  • : Ⅰ名詞1 (性質; 本質) nature; character; essence 2 (質量) quality 3 (物質) matter; substance;...
  • : 子Ⅰ名詞1 (兒子) son 2 (人的通稱) person 3 (古代特指有學問的男人) ancient title of respect f...
  • : Ⅰ動詞1 (灌入) pour; irrigate 2 (集中) concentrate on; fix on; focus on 3 (用文字來解釋字句)...
  • : Ⅰ動詞1 (進來或進去) enter 2 (參加) join; be admitted into; become a member of 3 (合乎) conf...
  • 質子 : [物理學] proton; uron; hydrion; merron質子泵 proton pump; 質子層 proton sphere; 質子轟擊 proton b...
  • 注入 : pour into; empty into; inpouring; injection; infusion [拉丁語]; infunde [法國]; abouchement; influxion
  1. Some gas - sensitive test to deoxidizing gas have carried out based on tio _ 2 films by sputtering and doped some impurity. the experimental results showed that tio _ 2 films have different electron injecting principle and reactive mechanism, the behaviors of gas - sensor for hydrogen and ethanol manifest dissimilitude. this is due to that the oxygen vacancies were compensated by the impurity

    用濺射制備的薄膜摻部分雜對還原性氣體進行氣敏測試,發現tio _ 2薄膜對酒精氣體和氫氣有不同的反應機制和電機理,氣敏特性也表現出不同,而雜的引反而降低了tio _ 2薄膜的敏感性,可能是由於雜對氧空位的補償所引起。
  2. A lot of experiments have been done in the process of exploiture soft packaging li - ion battery about how to choice the rational arts and crafts. the content include : how to deal with the collector, add how much pvdf in the material, how long the material need to stirring and the right viscidity, how much condubtivity agent the electrode need, what theckness is best, choice different collectors, the degree of dryness of the electrode, theckness of pressed model, how much electrolyte will be added, placement how long after added the electrolyte, system of formation how to influnce the battery, in formation the battery need or not need preesure from outside, how to vacuumize and the optimize matching positive pole and negative pole. with these practice make sure the parameter of the positive pole should less than 90 m ; according to different vacuumize order the conduc - tivity agent in anode will be 5mass % and 9mass %, respectively, and in cathode the data is 2mass % ; every 100mah added to 0. 4 ml electrolyte ; before formation the battery should be placement 8 hours and the system of formation must be less than 0. 01c before the voltage reach to 3. 0v ; should press in outside when battery in formation ; to these batteries which capacity more than 350mah the vacuum time not excess 15s ; the optimize matching positive pole and negative pole between 2. 10 : 1 and 2. 15 : 1. finally make out the battery which cycling performance and security are all very well

    液態軟包裝鋰離電池的研究主要是對關鍵工藝進行了優化設計,具體包括:集流體的處理、 pvdf的加量、漿料攪拌時間和粘度、導電劑的加量、電極膜的厚度、不同集流體的選擇、電極膜的乾燥程度、壓型的厚度、電解液的加量、電解液后靜置時間的長短、化成制度的影響、化成時電池所具有的壓力影響、抽真空的處理、正負極活性物的匹配。最後確定出液態軟包裝鋰離電池最佳工藝參數:正極膜的厚度小於90 m ;根據化成時不同抽真空順序,確定正極膜中的導電劑的加量分別為5mass %和9mass % ;負極膜中導電劑的加量為2mass % ;電解液的加量為每100mah添加0 . 4ml ;化成前電池的靜置時間應當大於8h ;電池在3 . 0v之前採用小於0 . 01c的化成制度;在化成過程中應當施加一定的外部壓力;對於350mah的電池抽真空的延時不應大於15s ;而正負極活性物量比應當在2 . 1 : 1 2 . 15 : 1之間。
  3. We have developed many treatment equipment covering vacuum aluminum plating, decorative plating film, hard film plating, ion injection, vacuum winding film plating, and vacuum thermal treatment equipment, forming 12 large series including over 50 specifications and types

    先後開發了真空鍍鋁裝飾鍍膜工具硬鍍膜及離真空卷繞鍍膜和真空熱處理設備。已形成12大系列, 50餘種規格型號。
  4. The soi is of crystal quality and the box is uniform in thickness, with the interfaces of si / sioa / si smooth and sharp. we have systematically studied the dependence of the formed soi structure on the process parameters, such as ion energy, implantation dosage, substrate temperature, as well as the annealing temperature. with xtem, sims, srp, rbs, ir, raman, aes, xps and other characterization tools, it was found that a dose window at fixed energy for water plasma ion implantation to form high quality soi structure similar to the conventional simox process exists

    本論文還系統地研究了不同劑量、能量、時基底溫度以及退火溫度對所形成soi結構性能的影響,藉助xtem 、 sims 、 srp 、 rbs 、 ie 、 raman 、 aes 、 xps等測試分析手段,我們發現,與傳統氧隔離( simox )技術類似,存在著「劑量窗口」形成優的soi材料,但在水等離體離方式中soi材料結構量對劑量變化更為敏感,隨著劑量的增大, soi材料的埋層厚度增大而表層硅厚度減小。
  5. Since polymer light - emitting diodes ( pleds ) were invented, much efforts have been made to improve the brightness and efficiency of its electroluminescence for realizing pled commercial application. we investigated several factors influencing the brightness, efficiency and spectrum characteristics of pleds el, especially focused our attention on the processes of carrier injection, transport, recombination and annihilation factors influencing brightness efficiency of organic electroluminescence ( oel ) in doped single and double - layer pleds

    本文以提高聚合物器件的效率和亮度為目標,提出了提高及b幾種方案,研究了材料性,器件結構,它們的穩態及瞬態特性及發光機理,特別關了以兼具電空穴傳輸能力的分及摻雜聚合物作成的單雙層摻雜聚合物發光器件中的載流、遷移、復合及湮滅等。
  6. The calculated results show that, for low energy protons ( energy less than several decade mev ), the contribution of proton nuclear reaction to energy deposition can be neglected ; while for high energy protons ( energy greater than several hundred mev ), the great difference appears for the above two cases. this gives us an indication that the contribution of proton nuclear reaction to the energy deposition must be concerned for high - energy protons. the propagation process in material of thermal shock wave induced by high - energy intense - current pulsed proton beam irradiation is calculated for several different proton energies

    對于射能量為418 ( j cm ~ 2 )脈沖寬度為0 . 1 s的矩形脈沖強流束,計算結果表明,由於束能量不同,引起的初始熱激波( 0 . 1 s時刻的熱激波)有單峰結構,也有雙峰結構,不同能量的強流束引起的熱激波在傳播的過程中都會出現明顯的彈性前驅波。
  7. In the calculation, the energy deposited in aluminum by proton beams is first calculated by m - c simulation, then a 1 - d elastic - plastic fluid model is used to simulate the following thermal shock wave process as a result of thermal - mechanical effect by proton irradiation. the shape of proton is taken as a rectangle pulse with a width of 0. 1 microseconds, the energy flux o

    對於3mm的鋁材料,射粒束為矩形脈沖(脈寬為0 . 1 s )的情況下,計算得到了電束、束輻照引起鋁材料斷裂的能量閾值與射電束、束能量的關系曲線,該曲線存在最小值,分別對應6mev的束的34 . 7j cm ~ 2和0 . 35mev電束的42 . 1j cm ~ 2 。
  8. Sige simox : oxygen ions with high dose were implanted into sige grown directly on silicon substrate for the first time, and sige - oi novel structure was formed successfully with additional high temperature annealing ; it has been confirmed that oxygen implantation with 45kev, 3 1017cm - 2 and annealing at 12500c in ar + 5 % o2 for 5 hours, are fit for the formation of sige - oi structure ; ge loss during the high temperature annealing has been observed, which is originated from ge volatility and ge diffusion ; it has been proposed to use nanoporous layer induced by h + / he + implantation to surppress ge diffusion and to use surface oxidation to overcome the upper limit of sige simox. sige smart - cut : hydrogen ions were implanted into sige material and followed by high temperature process ( 4000c to 7000c ) ; blistering study was done and suggested the possibility of sige layer transfer by smart - cut technology ; it is concluded that the bubble formation is easier in sige than in si, and the strain in sige / si and the difference of binding energy in sige and in si could possibly contribute to this effect. behavior of sige / si implanted with hydrogen : gave a detailed study on sige implanted by beamline or phi hydrogen implantation ; it has been found that great strain is introduced into sige by hydrogen implantation and this strain could be alleviated by high temperature annealing ; both for conditional beamline implantation and piii hydrogen implantation, 600 is appropriate for the post - implantation treatment

    Sige - simox工藝方面:首次採用硅( 100 )襯底上直接外延的100nm厚sige的樣品中高劑量的o離,通過退火處理成功制備了sige - oi新結構,即sige - simox工藝,證實了以45kev3 10 ~ ( 17 ) 7cm ~ ( - 2 )劑量的氧離,隨后在氧化層的保護下經1250 , ar + 5 o _ 2氣氛的高溫退火( 5小時)過程,可以制備出sige - oi新型材料;實驗中觀察到退火過程中的ge損失現象,分析了其原因是ge揮發( ge通過表面氧化層以geo揮發性物的形式進退火氣氛)和ge擴散( ge穿過離形成的氧化埋層而進si襯底中) ,其中ge擴散是主要原因;根據實驗結果及實驗中出現的問題,對下一步工作提出兩個改進的方案:一是通過在si襯底中適量h ~ + / he ~ +形成納米孔層來阻斷ge擴散通路,二是可以通過控製表面氧化來調節安止額士淤丈撈要表面sige層中的ge組分,從而部分解決sige
  9. The gettering processes usually are estimated by gettering of au to nanocavity in silicon. in this paper, the characteristics of nanocavity gettering mechanism, diffusion and distributing of aurum and ion implantation in silicon were described. in this work, many bumps on the polishing surface of the silicon, after a he + impantation in and subsequently a hot - treatment, were observed using atomic force microscope ( afm )

    我們意到,在研究氫、氦離誘生微孔的吸除作用時多以對金雜的吸除效果來對吸除工藝進行評估,因此本文對微孔吸除機理、金在硅中的擴散和分佈以及半導體中離的特點進行了描述。
  10. In the present work, water plasma ion implantation, instead of the conventional oxygen plasma ion implantation, has been employed to fabricate soi materials. the masses of the three dominant ion species in the water vapor plasma, h2o +, ho +, and o +, are very close to each other, which overcome the problem of co - existence of o and 02 in oxygen plasma source. the oxygen depth profiles in the water plasma ion as - implanted silicon do not disperse much, which makes it possible for the formation of single buried oxide ( box ) layer by choosing appropriate implantation energy and dose

    本論文創造性地採用水等離體離方式代替傳統的氧離方式來制備soi結構材料,由於水等離體中的三種離h _ 2o ~ + 、 ho ~ +和o ~ +量數相差很小,克服了氧等離體中因o _ 2 ~ +和o ~ +量數相差大而引起的氧在硅中的分佈彌散,使硅后的氧射程分佈相對集中,比較容易退火后形成soi結構材料。
  11. Surface chemical analysis - secondary - ion mass spectrometry - determination of relative sensitivity factors from ion - implanted reference materials

    表面化學分析.次級離譜法.測定離標樣的相對靈敏系數
  12. Blitz the attention of the panel : that a gang of terrorists entered a building residents, and kidnapped hostages, with the aim of building 806. 807 two rooms, starting immediately, must be the eradication of criminals, hostage rescue

    突擊小組意:有一夥恐怖分了一幢居民大樓,並挾持了人,目標是大樓的806 , 807兩個房間,立即出發,務必消滅罪犯,解救人
  13. Moreover, we observed the concentration profiles of the ion - implanted samples and the diffused samples by c - v method, and discovered that the carrier concentration decreased with increasing of the diffusion depth. whereas, the peak concentration of the ion - implanted samples located at 0. 248151 u m beneath the surface and the peak concentration of the diffused samples located at the surface. furthermore, the carrier concentration of mnas source diffused sample as high as 102 % m3can be obtained, and the surface was much smoother compared with that of the pure mn source diffused sample

    發現兩種摻雜方法的載流濃度大體上都是隨著擴散深度的增加而下降,不同的是離樣品的載流最高濃度處于離表面深度0 . 248151 m處,而擴散樣品的載流最高濃度處于表面,並摻錳( mn )砷化鋅( gaas )材料性的研究且還發現相對于純mn源擴散樣品來說, mnas源擴散樣品的表面較為光滑,且表面載流濃度高達1020 cm 』數量級。
  14. Secondly, we measured the electrical properties of the ion - implanted samples by hall method ( square carrier concentration, square resistance and carrier mobility ). after comparing and analyzing, we can know that the electrical properties were affected by the difference of mn dose, the implantation of c and the annealing temperature

    其次,利用霍爾測試方法測量了每種離樣品的電性(方塊載流濃度、方塊電阻及載流遷移率) ,通過比較分析了解到mn元素劑量、 c元素的以及退火溫度的不同,都會對樣品的電性產生影響。
  15. An ion implanter without ion mass analyzer was applied to simulate the phi procedure to fabricate soi materials by implantation of water plasma ions. thin soi structure was successfully fabricated by the implanter using 50 ~ 90kev water plasma ion implantation with the dose ranging from 2 - 6. 5 + 017cm - 2 and, subsequently, the high temperature annealing

    我們使用無量分析器的離機,模擬等離體離過程,成功地在該機上用水等離體離制備出了界面陡峭、平整,表層硅單晶量好,埋層厚度均勻的薄型soi材料。
  16. The separated phase of blends and carrier injection, transport and decay were firstly investigated by monitoring two different transient el peaks

    首次引監測基和雜兩個瞬態電致峰值來研究低摻雜體系的相分離及載流、遷移和湮滅過程。
  17. The c - bn thin films were deposited on si substrates using the conventional radio - frequency ( rf ) sputtering system. the c - bn / si thin film heterojunctions have been fabricated with doping into n - type ( p - type ) semiconductor by implanting s ( be ) ions into them. i - v curves of bn / si heterojunctions were obtained by the high resistance meter, c - v curves of bn / si heterojunctions were obtained by the c - v meter

    使用rf射頻濺射系統,在si襯底上沉積氮化硼薄膜,用離的方法在制備好的bn薄膜中分別s和be ,成功的制備了bn / sin - p和bn / sip - p薄膜異結,用高阻儀測得bn薄膜表面電阻率和bn / si薄膜異結的i - v曲線,用c - v儀測得bn / si薄膜異結的c - v曲線。
  18. In this paper, we implanted mn + ion of different dose into undoped semi - insulating ( 100 ) gaas substrate then performed rapid thermal annealing in different temperature and time. studied the different annealing condition dependence of the samples " structure, electrical and magnetic properties and the relation of the mn + forms and these properties

    本課題採用離的方法將不同劑量的mn ~ +到非摻雜半絕緣( 100 ) gaas單晶襯底中,然後進行不同溫度和時間的快速熱退火處理,研究了不同的退火條件對樣品層的晶體結構、電特性和磁特性的影響以及mn ~ +在樣品中的存在狀態與這些性之間的關系。
  19. We also investigated the effect of c on the samples formed by ion implantation of mn and c. we studied the samples " crystal structure and surface appearance by x - ray diffraction and afm, experimental results revealed that with increasing the annealing temperature, the crystal lattice reformed and defect in the surface reduced gradually

    還進行了mn ~ + 、 c雙離,研究了c對樣品性的影響。利用x -射線衍射法和原力顯微鏡對樣品的晶體結構和表面形貌進行了研究。發現隨著退火溫度的升高,樣品的晶格量得以恢復;表面形成的晶格缺陷逐漸減少。
  20. We have investigated the influence on the character of cdte thin films with different conditions and parameters. secondly, in normal temperature, cdte thin films are high resistance semiconductor, for improving its electricity capability, we commonly inject benefactor or acceptor impurities into the pure cdte thin films, the ion influx technique is a good method among many adulteration means. at present, the literatures on the doped cdte thin films by the ion influx technique have a fat lot reports

    本論文首先採用近距離升華法在不同基片上制備cdte薄膜,研究了不同工藝條件和參數對cdte薄膜性的影響。其次,在常溫下,本徵cdte薄膜均為高阻半導體。為了改善其導電性能,通常向cdte薄膜中摻施主或受主雜,其中離技術是摻雜方法之一。
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