通焊孔 的英文怎麼說

中文拼音 [tōnghànkǒng]
通焊孔 英文
clearance hole
  • 通 : 通量詞（用於動作）
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  1. Usually, glass insulated terminals are either soldered or cemented into the throughhole in the case.

    通常是把玻璃絕緣接線端焊接或者是粘合在殼體上的通孔內。
  2. Direct connect vias conduct so much heat away from the pin and into the plane that high temperature or long soldering time may be required to complete the joint - thermal damage could occur to both the board and the component from soldering or desoldering

    在焊接時，直接連接的過孔會通過引腳把大量的熱傳導至內電層，因此完成焊接就需要很高的溫度或者延長焊接時間，這就會導致在焊接或拆焊時發生電路板或元件的損壞。
  3. In order to effectively determine the position and distribution of porosities in laser welding sampes with complex structure, a preliminary research was proceeded on the distribtion features of porosities and a formula which can calculate the buried depth of porosities was deduced based on the line profile distribution curve of the flaw position

    為了確定復雜結構激光焊件焊縫中氣孔缺陷的位置和分佈，對氣孔缺陷的分佈特徵進行了研究，推導出氣孔缺陷埋藏深度的計算公式，設計了峰值異常缺陷和斜凹型異常缺陷投影距離自動提取演算法，確定了缺陷在鈦合金激光焊件中的分佈特徵，並通過模擬試件的破壞性試驗對該公式進行了驗證。
  4. There may be exceptions to this if bypass piping is welded to the valve body or if a pressure relief hole is drilled in one side of the valve

    但是也有例外，比如有旁通管焊接在閥體上或在閥門的一端鉆有一個減壓孔。
  5. Light gauge metal containers - round vent - hole cans with soldered ends for milk and milk products - capacities and related diameters

    薄壁金屬容器.裝牛奶和牛奶製品用帶焊封埠的圓形通氣孔罐.容積和相關尺寸
  6. Resistance to soldering temperature for through - hole mounted devices

    通孔固定裝置的焊接溫度抗性
  7. This paper analyzes the repairing feature on perforating casing and presents a new procedure that the root of perforating hole is covered by a little block age plate and then repair welding is carried out

    通過對射孔槍管修復特點的分析，提出了先利用小堵板蓋住射孔眼的根部，再進行補焊的新工藝，實現了槍管的重復利用，為油田同類產品的修復提供了寶貴經驗。
  8. The reduction factors derived from curve fitting based on calculation results by the finite element program ( ansys ) considering all kinds of damages such as cutouts, corrosion, cracks, denting, initial deflection and residual stress are introduced to modify the effective width of perfect panel in the present paper

    本文考慮板中可能存在孔洞、腐蝕、裂縫、局部撞損和初始焊接變形或殘余應力等損傷和初始缺陷，對不同的損傷形式用有限元程序（ ansys ）進行大量的計算，通過曲線擬合的方法引入折減系數對完好板格的有效寬度進行修正。
  9. Printed board assemblies - sectional specification - requirements for through - hole mount soldered assemblies

    印製電路板組件.分規范.通孔安裝焊接組件要求
  10. All parts of the apparatus were welded in each transparent plastics box, and these boxes can be expediently inserted or pulled out of the scaleboard ; on the scaleboard, the nine eyelets combined with the " 田 " are connected, they can be used as a node when we do experiments

    元器件焊裝在透明塑料盒內，盒與底板可以方便地插拔連接；底板上以「田」字組成的九個小孔內部相互連通，實驗時可以成為電路中的一個結點。
  11. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors

    通孔盤狀及平面陣列陶瓷多層電容器焊料所含的鉛。
  12. Workmanship requirements for soldered electronic assemblies - through - hole mount assemblies

    釬焊電子組件的工藝要求.通孔安裝組件
  13. Workmanship requirements for soldered electronic assemblies - part 3 : through - hole mount assemblies

    釬焊電子組件的工藝要求.第3部分:通孔安裝組件
  14. Semiconductor devices - mechanical and climatic test methods - resistance to soldering temperature for through - hole mounted devices

    半導體器件.機械和氣候試驗方法.通孔安裝設備的耐釬焊溫度
  15. Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices

    半導體器件.機械和氣候試驗方法.第15部分:通孔安裝設備的耐釬焊溫度
  16. Abstract : causes for porosity occurrence in welding seams were investigated by means of statistic analysis of the porosity degree of welding seams of the submerged arc weld spiral pipes made with x65 and q235 steels from different works and mating weld materials, and of selecting proper mating material on the basis of different oxygen contents in the base metals

    文摘:通過對不同廠家生產的x65級和q235鋼材與不同的焊接材料相匹配所生產的螺旋埋弧焊管焊縫內的氣孔進行統計分析，並從鋼材中氧含量的多少及其焊接材料匹配的不同，來研究焊縫中氣孔產生的原因。
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