釬焊性 的英文怎麼說

中文拼音 [hànhànxìng]
釬焊性 英文
brazability
  • 釬 : 名詞（釬子） drill rod [steel]; borer
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 性 : Ⅰ名詞1 （性格） nature; character; disposition 2 （性能; 性質） property; quality 3 （性別） sex ...
  1. The research results show that, from the viewpoint of second phase morphologies, there exist quite differences between the grain - type materials ( such as wc / bcu brazing deposit material, wrs1000 and 1zt tungsten carbide strengthening overlaying material, as well as the wear - resistant material of polymer adhesive coating etc. ), and the aggregation - type as well as dispersion - type ones ( such as zg35simn, wrd - 1 and khc - k2 depositing material ) in the wear - resistance and sand slurry abrasion mechanism. the sand slurry abrasion mechanisms are brought forward, of new wear - resistant materials with the features of grain - type second phase morphologies

    研究發現，與聚合型、彌散型第二相的材料（如zg35simn 、 wrd ? 1和khc ? k2熔敷材料等）相比，顆粒型第二相的材料（如wc bcu釬焊熔敷耐磨材料、 wrs1000型耐磨材料、 1zt碳化鎢顆粒增強熔敷材料及ktc ? 1耐磨膠粘塗層材料等）在耐磨性能和磨損機理等方面均有不同，總結提出了以「顆粒型第二相」為特徵的耐磨新材料泥沙磨損機理。
  2. Study on order distribution of monolayer brazing grindingplate s grind grain

    單層釬焊砂盤磨粒分佈有序性研究
  3. The strength and wear resistance of diamond drill bits for petroleum exploitation will be increased considerably when cast tungsten carbide is applied and adheres to the substrate firmly with cast tungsten carbide of 80 - 200mesh as the skelton and copper alloy as the soldering material in a process of non - pressure immersion

    石油鉆探行業用的金剛石鉆頭，用粒度為80 ? 200目的鑄造碳化鎢粉作骨架，採用無壓浸漬工藝，以銅合金作釬焊料，將鑄造碳化鎢與基體牢固結合，強度、耐磨性大大提高。
  4. Testing of solderability for soft soldering ; wetting tests

    軟釬焊可軟釬性的檢驗.濕潤試驗
  5. The technological capabilities of electronic solders were presented through analysis the action of solders in the soldering process, which includes temperature of melting or solidifying, anti - oxidation capability, wetability and overflow capability

    摘要通過分析焊料在釬焊過程中的行為，提出了電子焊料的工藝性能主要包括熔化固化溫度、抗氧化性、潤濕性和漫流性。
  6. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明：相關的影響因素主要包括合金的組成、純度和化學均勻性；母材的成分、性質和表面的潔凈度；液態焊料的表面張力；釬焊溫度、氣氛、助焊劑的活性；液態焊料表面膜的組成、結構和性能等。
  7. This article introduced the development and ti - based brazing material used for titanium alloys, and analyzed the relationship between metallurgical structure and mechanical property of welding joint, mechanical behavior under high temperature 、 corrosion resisting property and fatigue capability of the joint were also represented

    本文介紹了鈦合金用的鈦基釬焊料的發展現狀，重點評價了鈦基釬料釬焊后組織與力學性能的關系，以及鈦基釬料的高溫力學性能、耐蝕性以及疲勞性能等。
  8. Testing of solderability for soft soldering ; vertical dipping test for pre - tinned specimens ; testing ; assessment

    軟釬焊可軟釬性的檢驗.預鍍錫試樣的垂直浸漬試驗.檢
  9. Testing of solderability for soft soldering ; vertical dipping test for specimens of copper alloys ; testing ; assessment

    軟釬焊可軟釬性的檢驗.銅合金試樣的垂直浸漬試驗.檢
  10. Solderability tests for component leads, terminations, lugs, terminals and wires

    元件引線接線端焊片接頭和金屬絲的軟釬焊性試驗
  11. Solderability tests for component leads, terminations, lugs, terminals, and wires

    元件引線終端接線片端子和電線的可釬焊性試驗
  12. Determining solderability of thick film conductors

    厚膜導體的軟釬焊性測定
  13. Standard test method for solderability of metallic - coated products

    金屬塗覆產品的軟釬焊性試驗方法
  14. Electromechanical components for electronic equipment - basic testing procedures and measuring methods - soldering tests - test 12f - sealing against flux and cleaning solvents in machine soldering

    電子設備用機電元件.基本試驗規程和測量方法.釬焊性試驗.試驗12f :機械釬焊焊接過程中溶劑和清洗劑密封性
  15. Elements of electrical and optical connection - test methods - soft solderability

    電氣和光學連接元件.試驗方法.可軟釬焊性能
  16. Solderability test method

    軟釬焊性試驗方法
  17. Solderability and brazeability. definition and use of a specimen with variable gap

    可釬焊性.帶可變間隙試樣的定義和使用方法
  18. Tp 52 test procedures for solderability of contact terminations use in connectors sockets

    連接器插座中使用的觸點終端的軟釬焊性的tp52試驗程序
  19. Environmental testing - tests - test ta - soldering - solderability testing by the wetting balance method

    環境試驗.試驗.試驗2 . 1ta :釬焊.用濕平衡法進行釬焊性試驗
  20. Aerospace series - elements of electrical and optical connection - test methods - part 501 : soft solderability

    航空航天系列.光電連接件.試驗方法.第501部分:軟釬焊性
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