釬焊溫度 的英文怎麼說
中文拼音 [hànhànwēndù]
釬焊溫度
英文
brazing temperature-
The technological capabilities of electronic solders were presented through analysis the action of solders in the soldering process, which includes temperature of melting or solidifying, anti - oxidation capability, wetability and overflow capability
摘要通過分析焊料在釬焊過程中的行為，提出了電子焊料的工藝性能主要包括熔化固化溫度、抗氧化性、潤濕性和漫流性。The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on
分析表明：相關的影響因素主要包括合金的組成、純度和化學均勻性；母材的成分、性質和表面的潔凈度；液態焊料的表面張力；釬焊溫度、氣氛、助焊劑的活性；液態焊料表面膜的組成、結構和性能等。Numerical simulation and analysis of pulsed direct current brazing temperature field with computer
脈沖直流電弧釬焊溫度場計算機模擬及分析Numerical simulation and analysis of the temperature field for direct current gtaw arc brazing
電弧釬焊溫度場的數值模擬及分析Abstract : in the present paper the progress was reviewed in the active filler metals with different temperatures for ceramic to metal brazing and related brazing technique of reducing joining - gap residual stress. it was recommended that the key developing field for our country should be the high temperature active filler with heat - and oxidation - resisting properties. the brazing techniques to reduce joining - gap residual stress and the principles to select transition layers for the joining gap were also introduced
文摘:闡述了陶瓷/金屬釬焊用不同溫度的活性釬料及以降低焊縫殘余應力為中心的釬焊工藝進展；指出：在我國耐高溫、抗氧化性優良的高溫耐熱型活性釬料是重點發展方向；介紹了降低焊縫殘余應力的釬焊工藝和焊縫中間添加過渡層的選擇原則。Semiconductor devices - mechanical and climatic test methods - resistance to soldering temperature for through - hole mounted devices
半導體器件.機械和氣候試驗方法.通孔安裝設備的耐釬焊溫度Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices
半導體器件.機械和氣候試驗方法.第15部分:通孔安裝設備的耐釬焊溫度分享友人