鍵合 的英文怎麼說

中文拼音 [jiàngě]
鍵合 英文
interlinking; [化學] bonding; linkage
  • 鍵 : 名詞1 [機械工程] （使軸與齒輪、皮帶輪等連接並固定在一起的零件） key 2 [書面語] （插門的金屬棍子）...
  • 合 : 合量詞（容量單位） ge, a unit of dry measure for grain （=1 decilitre）
  1. It revealed that hexagonal structure was easily synthesized in the neutral medium, and lamellar structure was inclined to prepare under basic condition, and from the cooperative charge density matching mechanism and function of manganese iron and template molecular, the alkalescence influence on the structure was explained, and appropriate neutral hexadecylamine ( hda ) availed to synthesis of mesophase with more ordered degree for the mediation of packing parameter

    通過水熱合成方法對錳氧有序相的合成進行初步研究，探討合成工藝對有序結構的影響：在中性的條件下，易合成六方有序結構產物；在堿性條件下，更易合成層狀結構產物。並從電荷匹配的原則及錳離子與模板劑間鍵合作用解釋了堿量的多少對合成產物結構的影響。
  2. The binding affinity of remaining hemoglobin sites for oxygen is changed by the presence of co binding.

    氧在血紅蛋白其餘位置上的鍵合力被一氧化碳所改變。
  3. By using laser light scattering ( lls ) and scanning electron microscopy ( sem ), the particle sizes of ultrafine silicon dioxide diminish and the congeries dispersibility were obviously improved, which shows that the hydrophobic property of ultrafine silicon dioxide after being modified has been much more strengthened, this surface modification provides wide market to reuse ultrafine silicon dioxide waste material

    表明超細二氧化硅顆粒表面鍵合了疏水性有機分子鏈，蔬水性增強，達到了改性目的，為超細二氧化硅廢料的回收利用提供了廣闊的市場。
  4. Interfacial atoms diffusion or covalence by a circulated - argon ion bombardment process could improve the adhesion strength between the coatings and the uranium substrate

    循環氬離子轟擊鍍方法可促進使膜-基界面原子間的擴散或鍵合，有利於提高膜-基結合強度。
  5. Research on the thermode bonding procee for flip chip

    倒裝晶元熱電極鍵合工藝研究
  6. Cpk study of bonding process in hic production

    混合集成電路鍵合工序能力指數探索
  7. The development of renewable amperometric is a possible way to circumvent the problem. here, antigen ( antibody ) is immobilized with graphite ( carbon ) and carrier on a transducer, the analyze is measured through on enzyme catalytic reaction after sandwich or competitive immunoreaction

    將抗原（抗體）與石墨或者碳固定在載體材料中，在一個競爭性的或者夾心式的免疫反應后，將酶標抗原（抗體）鍵合在傳感器表面，通過一個酶催化反應來確定待測抗原（抗體）的濃度。
  8. The development of renewable amperometric is a possible way to circumvent the problem. here, antigen ( antibody ) is immobilized with graphite ( carbon ) and carrier on a transducer, the analyze is measured through on enzyme catalytic reaction after sandwitch or competitive immunoreaction. the surface of immuno - sensor can be renewed by used in a new immunoassay

    將抗原（抗體）與石墨或者碳固定在載體材料中，在一個競爭性的或者夾心式的免疫反應后，將酶標抗原（抗體）鍵合在傳感器表面，通過一個酶催化反應來確定待測抗原（抗體）的濃度。
  9. There was a weakening of the intermolecular bonds, primarily in the amorphous region of the polymer.

    分子間鍵合減弱，尤其在聚合物的無定形區內更為明顯。
  10. Normally, we use the word bond to describe the linkage between a particular pair of atoms.

    通常我們用鍵這個詞來描述指定的一對原子之間的鍵合。
  11. No probe leakage was found when the sensor dipped in ethanol and n - hexane for 15 days. this technique is limited for its prolix procession and request of special active function in the structure of molecular probe, sol - gel : the development of sol - gel technique provides a convenient way to incorporate molecular probe in porous inorganic material

    化學鍵合法：分子探針通過化學反應鍵合於固定相，在溶劑中不泄漏，提高了傳感器使用壽命，在乙醇和正己烷中浸泡15天，未見探針分子泄漏。但繁雜的過程和對探針分子結構的特殊要求限制這一方光纖化學傳感器、儀器系統的研製們比生物和環境監測中的應用（摘要） 2法的應用。
  12. Click wrap contract ' s fairness and its regulative system

    按鍵合同的公平性及其管制機制
  13. Good bonds are always accompanied by surface extension, that is, plastic shear strain.

    良好的鍵合總伴有表面延伸即塑性切向形變。
  14. Using molecular imprinting method, the 1, 3 - dimethylxanthine theophylline, tho molecular recognition membranes, containing an segments as membrane formation sites and aa segments as functional sites, were prepared by the phase inversion technique. here, tho was selected as a template molecule. the hydrogen bonding between aa segments and the tho templates was measured by ft - ir and nmr. the tho templates can be removed from the membrane through washing with acetic acid aqueous solution. the permeation of tho through the membranes is far more than that of 1, 3, 7 - trimethylxanthine caffeine, caf, which demonstrated the function of tho molecular recognition of the membrane. the results also show that the increase of the tho templates concentration in the cast solution caused an increase of tho amounts taken into the copolymer membrane

    Ft - ir及nmr測試結果表明：制備的高分子膜中， tho模板分子和膜中的丙烯酸功能殘基存在著氫鍵鍵合作用。大量的極性醋酸水溶液可抽出膜中的模板分子。 tho溶液和與模板分子具有相似結構的1 ， 3 ， 7 -三甲基黃嘌呤咖啡因， caf溶液的基質透過實驗結果：進入膜結構中tho分子的量遠大於caf分子，這表明制備的高分子膜具有tho分子識別功能。
  15. Abstract : the effects of terbium ion on the conformation of calmodulin and on the interaction between calmodulin and melittin have been studied by the endogenous fluorescent spectrometry of calmodulin and melittin, and the sensitized fluorescent spectrometry of terbium ion, respectively. the results show that terbium ions have a tight binding site in the i and ii metal - binding sites of calmodulin. the conformation of calmodulin induced by terbium ion can bind melittin and transfer the tryptophane residue of melittin to a relatively hydrophobic environment, while the binding of melittin to calmodulin produces effect on the binding orders of terbium ion in camodulin. results from ft - ir spectrometry have revealed that upon binding of lanthanum ion, apo - calmodulin undergoes a conformational change with the increase of - helix content and the decrease of - sheet content. melittin ' s binding to calmodulin has no effect on its conformation induced by the binding of lanthanum ion to calmodulin

    文摘:分別用鈣調蛋白和蜂毒素的內源熒光光譜以及鋱離子的敏化熒光光譜考察了鋱離子對鈣調蛋白構象變化以及對鈣調蛋白與蜂毒素相互作用的影響.結果表明，鋱離子首先結合在鈣調蛋白的第和第位點，鋱離子不影響鈣調蛋白與蜂毒素的相互作用，蜂毒素與鈣調蛋白作用后不影響鋱離子在鈣調蛋白上的鍵合順序.傅里葉變換紅外光譜結果表明三價的鑭離子與鈣調蛋白作用使鈣調蛋白的螺旋結構增加，折疊結構減少，與鈣離子對它的二級結構影響相類似.稀土離子在鈣調蛋白-蜂毒素復合體系中主要與鈣調蛋白作用
  16. In the dissertation, the effects of the air slide - film damping on the capacitive accelerometers having different slot structures which are completely or partly etched, and fabricated by the anodic bonding between silicon and glass and bulk silicon micromachining process are researched by changing the distance between the moving structure and substrate, the thickness of the structure, the width of the completely etched slot structure, the depth of the partly etched slot structure according to the two well known air slide - film damping models

    對于橫向運動的體微機械器件，其周圍空氣表現為滑膜阻尼。本文基於滑膜阻尼的兩個模型，通過改變振子與襯底的間距、振子的厚度、刻透的柵槽的寬度、沒有刻透的柵槽的深度等參數，研究了這些參數對硅?玻璃鍵合工藝製作的體硅微機械電容式傳感器阻尼特性的影響。
  17. As a contrast object, gold wire ball bonding technology was also studied

    金絲球鍵合作為對比研究對象引入本文研究范圍。
  18. Trough the experiment, we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter )

    通過實驗，探索出了合適的貼裝方式（ 183焊膏貼裝）和管芯鍵合工藝（直徑18 m的金絲球焊） 。
  19. Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components

    銅絲球鍵合是一種有望取代現行金絲球鍵合工藝的新技術，這一技術對于降低微電子元器件的成本、提高元器件的可靠性具有重要意義。
  20. The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail

    本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。
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