電子組件 的英文怎麼說

中文拼音 [diànzizǔjiàn]
電子組件 英文
electronic building brick
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 子 : 子Ⅰ名詞1 （兒子） son 2 （人的通稱） person 3 （古代特指有學問的男人） ancient title of respect f...
  • 組 : Ⅰ名詞1 （由不多的人員組成的單位） group 2 （姓氏） a surname Ⅱ動詞（組織） organize; form Ⅲ量詞（...
  • 件 : Ⅰ量詞（用於個體事物） piece; article; item Ⅱ名詞1. （指可以一一計算的事物） 2. （文件） letter; correspondence; paper; document
  • 電子 : [物理學] [電學] electron
  • 組件 : assembler
  1. Attachment materials for electronic assembly - requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用的連接材料.電子焊接設備用的電子分級焊料合金和助熔劑和非助熔劑的要求
  2. Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用連接材料.第1 - 3部分:電子焊接用電子級釬焊合金及有焊劑和無焊劑的固體焊料的要求
  3. Attachment materials for electronic assembly - part 1 - 2 : requirements for solder pastes for high - quality interconnections in electronics assembly

    電子組件用連接材料.第1 - 2部分:電子組件中高質量互連用焊膏的要求
  4. Pseu proximity switch electronic unit

    接近電門電子組件
  5. Attachment materials for electronic assembly - requirements for soldering fluxes for high - quality interconnections in electronics assembly

    電子組件用的連接材料.電子組件中的優質互連接器用軟焊釬助熔劑的要求
  6. Reliability data handbook - universal model for reliability prediction of electronics components, pcbs and equipment

    可靠性數據手冊.電子組件pcbs和設備的可靠性預測用通用模型
  7. Printed board assemblies - part 1 : generic specification - requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    印刷電路板組件.第1部分:一般規范.使用表面安裝和相關裝配技術的焊接電氣組件和電子組件的要求
  8. Dynamic loading plays a critical role in the functional performance and mechanical reliability of microelectronic components and devices

    動力載荷對微電子組件和裝置能否可靠工作起關鍵作用。
  9. The full color of led display system adopts nowadays the newest led technology and controlling theory which makes its price lower, capability more stable, power consumption lower, resolution degree of per unit area higher, the color more reality and enrich, electronic parts when composing system fewer, the rate of error reduces. full colors of indoor

    全彩led顯示屏系統，採用了當今最新led技術和控制理論，使全彩色led顯示屏價格更低性能更穩定功耗更低單位面積解析度更高色彩更逼真豐富組成系統時電子組件更少使得故障率降低。
  10. Requirements for soldered electrical and electronic assemblies

    軟釬焊電氣和電子組件的要求
  11. A typical optocoupler made up of two electronic assembles : an ir led and an output optoelectronic detector which are integrated into a dip

    典型的光耦合器是將兩個電子組件-紅外（ ir ）發光二極體（ led ）和輸出光電探測器集合到一個雙列直插式封裝（ dip ）中。
  12. Photonic components form the basis of today s voice and data communications and tv broadcasting networks, and are the fundamental enabling technologies that will deliver us low cost high bandwidth communication solutions

    光電子組件是現代語音，數據傳輸，及有線電視的主要構成基礎，亦是令致低成本高容量傳輸技術可行的重要因素。
  13. Sep standard electronic package

    標準電子組件
  14. Workmanship requirements for soldered electronic assemblies - through - hole mount assemblies

    釬焊電子組件的工藝要求.通孔安裝組件
  15. Workmanship requirements for soldered electronic assemblies - part 3 : through - hole mount assemblies

    釬焊電子組件的工藝要求.第3部分:通孔安裝組件
  16. Since 1998, a total of more than hk $ 140 million was awarded to cuhk, in which hk $ 16. 6 million was appropriated by the information technology fund to set up the ppl, dedicated to the r & d of photonic component packaging and related technologies and processes

    自一九九八年起，中大共獲得超過一億四千萬港元撥款，其中包括創新科技基金一千六百六十萬港元撥款，用作成立光電子封裝實驗室，研究光電子組件的封裝及有關技術。
  17. Low viscosity, cures at room temperature to a transparent gel, the cured gel state provides excellent mechanical cushioning and vibration damping for delicate electronic assemblies

    低粘度，室溫固化成透明凝膠，固化后的凝膠對于精密電子組件有著良好的機械緩沖和減振作用，且具有低溫性能。
  18. Diversified product range from electronics components to assembly machinery

    多元化產品由一般電子組件至大型安裝機器。
  19. Blank detail specification : microwave modular electronic units of assessed quality - capability approval ; german version en 160201 : 1997

    空白詳細規范.經質量鑒定的微波模塊電子組件.性能認
  20. Sectional specification : microwave modular electronic units of assessed quality - part 2 : index of test methods ; german version en 160200 - 2 : 1997

    分規范.經質量鑒定的微波模塊電子組件.第2部分:試驗
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