電火高成形法 的英文怎麼說

中文拼音 [diànhuǒgāochéngxíng]
電火高成形法 英文
spark pressure working process
  • : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
  • : fire
  • : Ⅰ形容詞1 (從下向上距離大; 離地面遠) tall; high 2 (在一般標準或平均程度之上; 等級在上的) above...
  • : Ⅰ動詞1 (完成; 成功) accomplish; succeed 2 (成為; 變為) become; turn into 3 (成全) help comp...
  • : Ⅰ名詞1 (由國家制定或認可的行為規則的總稱) law 2 (方法; 方式) way; method; mode; means 3 (標...
  1. The relationship between sputtering conditions and the depositional speed shows : with working pressure 1. 2 pa, sputtering power 180w, the depositional speed of tio2 thin film is 40nm / h, and increases with the increasing of sputtering power. it can be also founded that the depositional speed is nearly proportional to the working pressure : within the range of 0. 3pa to 1. 6pa, the depositional speed increases linearly with the increase of ar pressure. with the enhancement of the substrate ' s temperature of sputtering or annealing, the resulted thin films show a tendency of decreasing in thickness, and increasing in refractivity

    本實驗是採用磁控濺射方,在不同的溫度下制備了tio _ 2薄膜,並對薄膜進行了不同溫度和時間的退處理,通過原子力顯微鏡( afm ) 、 x射線衍射( xrd ) 、掃描鏡( sem )等檢測手段對薄膜的表面貌和組結構進行了分析,結果如下: ( 1 )濺射工藝條件與薄膜沉積速度的關系表明:採用1 . 2pa工作氣壓, 180w的射頻功率tio _ 2薄膜的沉積速率為40nm h ,並隨射頻功率的增加而提,呈近似的線性關系,在0 . 3pa 1 . 6pa氣壓范圍中,氬氣壓強升沉積速率迅速增加,濺射溫度提和退處理能使薄膜的厚度減小和折射率提
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