電路失效 的英文怎麼說

中文拼音 [diànlùshīxiào]
電路失效 英文
circuit malfunction
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 效 : Ⅰ名詞（效果; 功用） effect; efficiency; result Ⅱ動詞1 （仿效） imitate; follow the example of 2 ...
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. Monitor apparatus can measure valid value of three phase voltage and current, power factor, three phase disequilibrium, instant flecker of short time and harmonic without twenty, degree and harmonic distortion total. the paper are laid on the following. ( 1 ) master plan and function of circuit, ( 2 ) hardware design including circuit and principle of a / d conversion, phase lock, liquid crystal display and keystroke and so on, ( 3 ) design of system software including digital filtering, fft, a / d conversion and monitor interface of pc, ( 4 ) system test

    監測儀能夠完成包括三相電壓、三相電流的有效值、功率因數、三相不平衡、電壓短期閃變、以及20次內的諧波、諧波相位、諧波失真總量等的測量。論文重點介紹了以下幾部分： （ 1 ）電路的總體設計和功能； （ 2 ）硬體設計，包括a d轉換、鎖相環、液晶顯示和按鍵輸入等原理和電路。 （ 3 ）系統軟體設計，包括a d轉換、 fft 、數字濾波等程序的原理和演算法以及上位機監控界面的設計； （ 4 ）系統測試。
  2. With the stringent requirement of low output voltage and high output current, semiconductor diode is necessarily replaced by synchronous rectifier to minimum voltage drop. because the existed driving schemes can not drive srs properly, two novel driving schemes for synchronous rectifiers in magnetic amplifier post regulating circuit are proposed in this paper

    已有的同步整流管驅動電路主要面對多路輸出的主輸出電路，而應用磁放大器調節的輔助輸出電路同步整流管的驅動，現有的方法存在磁放大器調節與同步整流管驅動的失配，降低了開關電源的效率。
  3. The sample and hold circuit is employed by the bottom plate sampling technique, which could not only cancel the charge injection error but also eliminate the effect of clock feed - through

    采樣保持電路設計採用了電容下極板采樣技術，不僅有效地避免了電荷注入效應引起的采樣信號失真，而且消除了時鐘饋通效應的不良影響。
  4. On the base of studying imaging theory of lens, the imaging theory of laser confocal scanning microscopy was analyzed in detail in this paper, and the advancement of that the optical fiber was applied to the system was described ; on the base of completed the demonstration for whole project, the experiment scheme was designed ; the relationship between the main parameters of key devices and the resolution was deduced, and the requirements of coupling efficiency and vignetting effects to optical system was analyzed ; the design of optical system and the planar scanning controlling circuit was completed ; a new method was put forward to resolved the inherent non - liner scanning problem of the galvanometer scanner by using software liner controlling in circuit design, and the perfect planar scanning was realized ; at last the low noise, high multiple and non - distortion amplify circuit of photoelectric detector was completed

    本文在透鏡成像理論的基礎上，系統、深入地分析了共焦掃描顯微成像的機理，論述了應用單模光纖的激光共焦掃描顯微成像系統的優點；進行了總體方案的論證，並設計確定了單模光纖激光共焦掃描顯微成像系統的總體方案；從理論上推導分析了解析度要求與試驗系統中相關器件主要參數之間的關系，分析了系統耦合效率和漸暈現象對光學系統的設計要求；完成了方案中光學系統和二維掃描控制電路的設計，並在電路設計中採用了用軟體解決檢流計式光學掃描器（振鏡）非線性問題的新方法，能夠實現較為理想的二維模擬掃描；完成了高增益、低噪聲和低失真的探測接收系統的設計和調試。
  5. Standard test method for estimating electromigration median time - to - failure and sigma of integrated circuit metallizations metric

    集成電路金屬噴鍍總量和電遷移中值失效時間的評定標準試驗方法
  6. Standard guide for design of flat, straight - line test structures for detecting metallization open - circuit or resistance - increase failure due to electromigration metric

    檢測由電遷移造成的噴鍍金屬開路或阻力增加失效率用的平板直線試驗結構設計的標準指南
  7. About the techniques of the reliability design, a common method for 1c reliability design is introduced and the failure principles of electronmigration are studie d

    在可靠性設計方面，介紹了集成電路可靠性設計的一般方法。影響鋁互連的電遷移失效的各種因素中，電流密度是主導因素。
  8. Consequently, the metal interconnects of vlsi have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes

    作為vlsi互連線的金屬薄膜的截面積越來越小，其承受的功率密度急劇增加，使得電遷移成為電路的主要失效模式之一。
  9. Failure analysis of analog device resulted by electrostatic discharge

    雙極型半導體電路靜電損傷失效分析
  10. The conventional only circuit model simulation method is out of effect, so the field - circuit mix simulation method is adopted

    常規的純電路模型模擬方法失效，而採用場路混合模擬的方法。
  11. On the condition of absence of feature degradation modal of parts and effective aid tool, the failure mechanism and reliability model of parts in power module are analysised, and with the result of failure analysis and empirical data the life model of metalized electrode capacitor is figured out, which is proved to be weibull distributions

    在缺乏元器件性能老化模型和有效輔助工具的前提下，研究了能源模塊電路主要元器件的失效機理和可靠性模型。利用對金屬化膜電容器失效分析結果和經驗數據給出金屬化膜電容器的威布爾壽命模型。
  12. Based on the model of the interconnect failure, taking the existence of defect into account, the influence of the open soft fault on the interconnect reliability is deeply studied, and a new lifetime model of interconnect is presented

    本文從互連線失效的電遷移模型出發，考慮到缺陷存在時，由局域缺陷導致的開路軟故障對互連線可靠性的作用，給出了缺陷統計分佈情況下新的互連線壽命模型。
  13. Hardware circuit includes the unit loop circuits such as main loop circuit, drive circuit, control circuit, protective circuit, the circuit of power source and displaying circuit etc. the function that the induction cooker can realizes are mainly as follows : heat function, warm function, time function, no pan detecting and alarm function, which includes overheat alarm, over voltage or under voltage alarm, fan failure alarm etc. the displaying interface has digital number display indicator and vacuum fluorescent display

    硬體電路主要包括主迴路、激勵電路、控制電路、保護電路、電源電路和顯示電路等單元迴路，主要實現的功能如下：加熱功能、定溫功能、定時功能、無鍋檢測功能、報警功能，具體包括過熱報警、過壓或者欠壓報警、風扇失效報警等。顯示界面有數碼管顯示和真空熒光屏顯示。
  14. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  15. The n / n + and p / p + epitaxial structures, which become popular with the development of coms technology, because they can avoid the latch - up and a softerror of ulsi while they combined with the intrinsic gettering ( ig ) technique

    Coms工藝中普遍採用n / n ~ + 、 p / p ~ +的外延結構，這種以重摻雜矽片為襯底的外延結構與內吸雜工藝相結合，是解決集成電路中的閂鎖效應和粒子引起的軟失效的有效途徑。
  16. In this circuit, we use many kinds of negative feedback to modify the ou tput wave, which can decrease the distortion. and we use the high - voltage and high frequency capacitance efficiency, which can decrease the disturbance of output signal of variable frequency source for the test of part discharge

    採用了多種負反饋迴路修正輸出波形，使得輸出電壓波形的失真度很小；並且在電路中有效利用高壓高頻電容，減小了變頻電源輸出的電壓對局部放電試驗時的干擾。
  17. At the same time, the method of disposal phase shift of ct by compensation is introduced. then the analysis and statistic of electrical power quality, the control scheme and compensating amount of capacitor for reactive power compensation are analyzed respectively. and in the paper, the control with a / y and the switch with ac contactor and solid state switch is valid measure not only for improving operate level economically and amending electrical power quality but also for avoiding of replacing switch frequently and decrease economic loss

    然後對現有的演算法進行了詳細的分析、比較，篩選出既能滿足硬體要求又可降低投資、保證精度、簡化軟體的方案，確定了準同步采樣的方案，並通過對準同步采樣誤差的分析，提出了一種從45開始采樣，從而提高精度的采樣數據處理辦法，同時，對于電流互感器相位漂移提出了一種補償辦法，接著對裝置中電能質量分析與統計以及無功補償中電容器的補償量、投切原則也作了相應分析，其中對于無功補償採用y混合接線，並利用交流接觸器和固態開關共同投切電容，不但提高了經濟運行水平、改善了電能質量，而且有效的避免了頻繁更換開關，減少了經濟損失；最後，設計了裝置的硬體電路並繪制了相應的軟體流程圖。
  18. If you share a computer at work with others, disable " cookies " in your internet browsing software or delete sensitive " cookies " in the browser. subscribe to " private thoughts " to stay up - to - date on privacy matters

    如你在工作上與他人共用一部電腦，請設法令網際網路瀏覽軟體的曲奇檔案功能失效，或是將瀏覽器的敏感曲奇檔案刪除。
  19. Abstract : abstract ： the status and trend of the ic failure analysis technology in china was reviewed with practical cases ， including nondestructive failure analysis ， signal tracing ， secondary effect ， sample preparation and back side failure location

    摘要：摘要：通過實例綜述了目前國內集成電路失效分析技術的現狀和發展方向，包括：無損失效分析技術、信號尋跡技術、二次效應技術、樣品制備技術和背面失效定位技術，為進一步開展這方面的工作提供參考。
  20. If there is a loss of electrical power, emergency track lights installed near the floor will illuminate. [ it will lead you to exits. ] [ white / blue lights lead to red lights, which indicate the exits

    如電源失效，安裝在地板上的應急路徑燈將發出亮光[將引導您至出口] [白/藍色為撤離路徑燈，紅色為出口燈。
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