電路製造 的英文怎麼說

中文拼音 [diànlùzhìzào]
電路製造 英文
circuit manufacture
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 造 : Ⅰ動詞1 （做; 製作） make; build; create; produce 2 （假編） cook up; fabricate; concoct 3 [書面語...
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. These defects appear during crystal growth, but crystals having such defects are not considered usable for ic manufacture and are discarded.

    這些缺陷在晶體生長時出現，有這類缺陷的晶體不能用於集成電路製造，應報廢。
  2. As the ic manufacturing process develops from sub - micron to very deep submicron ( vdsm ) technologies, with current lithography tools ( 248nm and 193nm ), foundries can not manufacture products that designs want because of so - called optical proximity effect ( ope )

    當集成電路生產工藝發展到納米級時，利用現有的曝光設備（ 248nm和193nm ） ，由於所謂的光學鄰近效應，集成電路製造廠商已經無法製造出滿足電路功能要求的產品。
  3. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  4. Expected that during 2007 - 2011, compound annual growth rate of sales revenue in china ' s integrated circuits industry will arrive to 27. 7 % ; until 2011, the sales revenue of chinese ic industry will exceed rmb 300 billion, at that time, china will become one of the world ' s most important ic manufacturing bases

    預計2007年2011年，中國集成電路產業銷售收入的年均復合增長率將達到27 . 7 ，到2011年，中國集成電路產業銷售收入將突破3000億元，屆時中國將成為世界重要的集成電路製造基地之一。
  5. Data parallel coprocessor dpc, which is scalable and has the powerful data processing ability, is designed for the high performance dsp application market

    隨著集成電路製造工藝的進步，微處理器的處理能力與存儲系統之間的差距越來越大，存儲系統已經成為影響微處理器整體性能的瓶頸。
  6. Cnc took over glass cutting, pattern making, electrical discharge machining, steel - mill roll grinding, coordinate measuring, electron beam welding, tube bending, drafting, printed circuit manufacturing, coil winding, functional testing, robots, and many other processes

    從玻璃切割、樣式設計、發電機電流負載、鋼廠滾動打磨、坐標測量、電子束焊接、彎管製作、起草方案、印刷電路製造、線圈纏繞、功能檢測到自動機械等許多過程都已由數字計算機控制系統控制完成。
  7. With the development of semiconductor process technology, nowadays a system on a pcb ( printed circuit board ) which is composed of several ics can be integrated into a chip

    隨著集成電路製造工藝的飛速發展，人們已經可以將原先用各種電路搭建的板極系統集成在一塊晶元上。
  8. This thesis aims at discussing the model of manufacturing defects, the principles of soft and hard faults induced by manufacturing defects, the effects of soft fault on circuit reliability and yield and the relationship between yield loss and reliability decrease caused by manufacturing defects. the author ' s main contributions are as following : reliability and yield are two significant factors to semiconductor manufacture. based on the principles of the manufacturability engineering, the thesis discusses the effects of the manufacturing defect on the functional yield, parametric yield and the reliability for ics, and abstracts geometric models from actual chips

    本文對集成電路製造缺陷模型、由製造缺陷導致的軟、硬故障的作用機理、軟故障對電路可靠性和成品率的影響以及由製造缺陷導致的電路成品率的損失和可靠性下降之間的關系進行了系統的研究，主要研究結果如下：可靠性和成品率是影響半導體生產的兩個主要因素，本文首先從集成電路的可製造性工程理論出發，討論了製造缺陷在影響集成電路功能成品率、參數成品率和可靠性方面的作用。
  9. Lithography, as used in the manufacture of ics, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer.

    光刻技術應用到集成電路製造中，就是將掩模版的幾何圖形轉移到矽片表面的工藝過程。
  10. With the development of manufacturing technology of digital integrated circuit, the voltage test method based on stuck - at fault model can not detect all the faults in modern integrated circuit

    隨著集成電路製造技術的發展，基於固定型故障模型的電壓測試技術越來越不能滿足高性能集成電路的需求。
  11. Article 4 a protected layout - design shall possess originality, namely the layout - design is the product of the intellectual labour of the inventor, and the layout - design is not a standard design generally accepted by the layout - design inventors and integrated circuit manufacturers

    第四條受保護的布圖設計應當具有獨創性，即該布圖設計是創作者自己的智力勞動成果，並且在其創作時該布圖設計在布圖設計創作者和集成電路製造者中不是公認的常規設計。
  12. Circuit fabrication, thin - film

    薄模電路製造
  13. Environmental friendly and energy saving deaerators can be widely used in small to medium size industrial boilers, home heating boilers, beverages ( beer or juice ) manufacture and integrated circuit production, etc

    環保節能除氧器在中小型工業鍋爐、民用供熱鍋爐、啤酒、飲料、集成電路製造等領域可以有廣泛的應用。
  14. If the circuit simulator can be used for ic design and analysis depends on device model, especially the accuracy and simplicity of the model, which would influence the accuracy and speed of the simulation

    電路模擬器能否用於大規模集成電路的設計和分析取決于模擬器中所採用的器件模型，以及該模型中模型參數的準確性。在集成電路製造業中，器件模型同樣非常重要。
  15. Circuit fabrication, tick - film

    厚膜電路製造
  16. The paper mainly found on the application of photoresist in the process of ic fabrication to summarize the facets of reaction mechanism, performance index parameters and finally to indicate some new development directions in terms with process evolution target

    主要圍繞光刻膠在積體電路製造中的應用，對其反應機理及應用性能指標進行闡述，重點從工藝的角度去提出新的研究方向。
  17. Abstract : the progress of the aqueous solution cleaning technology for silicon wafer in very large scale integrated circuit fabrication is reviewed. the future of the aqueous solution cleaning technology is discussed as well

    文摘:本文綜述了超大規模集成電路製造過程中矽片溶液清洗技術的研究歷史及現狀，並對技術的未來發展進行了展望。
  18. This paper surveys robotic wafer handling system for integrate circuit manufacturing, and reviews the operating principle and research results of the main components of the system, i. e., wafer robot and prealigner

    摘要介紹了面向集成電路製造業的矽片機器人傳輸系統，綜述了其主要組成部分矽片機器人和預對準裝置的工作原理及國內外研究成果。
  19. Diffusion / oxidation furnace is a kind of very important equipment which is used in semiconductor process production line. it is applied in the manufacture process of the discrete semiconductor devices and integrated circuit which have diffusion, oxidation, annealing and alloying processing. it is also used in special temperature treatment of other material and is an auto - equipment which has the command of long time working, high precision and high stability

    擴散/氧化爐是半導體工藝生產線上非常重要的一種工藝設備，用於分立半導體器件、集成電路製造過程中各種擴散、氧化、退火及合金工藝，也適用於對其他材料的特殊溫度處理，是一種要求能長時間連續工作、高精度、高穩定性的自動控制設備。
  20. Along with the development of manufacture technology of vlsi, ic design emphasizes reusable design and short design cycle more and more. consequently the concept of ip ( intellectual property ) grows up, the development of many embedded modules make the design of ic simpler. mpu ip core is the typical one in these modules

    在集成電路製造技術進步的同時，集成電路設計也越來越強調設計的可重用性和短設計周期， ip （ intellectualproperty ）的概念應運而生，各種嵌入式功能模塊的開發使集成電路的設計不斷簡化，而其中最典型的當屬微處理器內核。
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