高速電鍍 的英文怎麼說

中文拼音 [gāosùdiàndù]
高速電鍍 英文
high speed electrodeposition
  • 高 : Ⅰ形容詞1 （從下向上距離大; 離地面遠） tall; high 2 （在一般標準或平均程度之上; 等級在上的） above...
  • 速 : Ⅰ形容詞（迅速; 快） fast; rapid; quick; speedy Ⅱ名詞1 （速度） speed; velocity 2 （姓氏） a surna...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 鍍 : 動詞（用電解或其他化學方法使一種金屬附著到別的金屬或物體表面上） plate
  • 高速 : （高速度） high speed; high velocity （hv）; high rate; swift; fast; express; high-speed
  • 電鍍 : electroplate; electroplating; electrofacing; （electric） plating; electrocladding; galvanize; ga...
  1. For electrodeposition by dc methods, the metals deposite uninterrupted and the particles were also embeded uninterrupted into the coatings ; for electrodeposition by pc method, the particles with biggish volume were desorbed from the coatings and returned to the electrolyte again owing to the presence of pulse interval ; for electrodeposition by prc method, the particles carried positive charges are much more easy to desorb from the coatings owing to the effecf of reverse pulse current combined with pulse interval, in addition, the reverse pulse current also could dissovle the metals, further accelerates the desorption of particles, thus the particles size embeded in the coatings by prc method is the least

    直流電沉積時，基質金屬的沉積連續進行，粒子在電極表面不間斷嵌入鍍層;單脈沖電沉積由於脈沖間歇的存在使得具有較大體積的粒子會脫附，重新回到溶液中;採用周期換向脈沖時，反向脈沖電流使表面荷正電的較大的粒子更易從電極表面脫附，同時，反向脈沖電流對基質金屬的溶解作用，也會促進粒子的脫附，因此鍍層中復合粒子尺寸最小。隨著鍍層中粒子復合量的增加，三種鍍層的晶粒都明顯細化，說明al _ 2o _ 3的存在阻止了晶粒的長大，提高了電沉積過程中晶核的形成速率。
  2. Current density and electroplating velocity has line relation, but the increscent multiple of electroplating velocity is smaller than that of current density. which indicate that current efficiency decreases with the increase of current density at alcb + lialh4 system. at l - 5a / dm aluminum coating is dense and uniform, especially at 2. 5a / dm

    電流密度與電鍍速度兩者近似成直線關系，但電鍍速度增大的倍數比電流密度增大的倍數要小，說明在alcl _ 3 + lialh _ 4體系中隨著電流密度的提高，電流效率逐漸降低。
  3. Using jgp560c magnetron sputtering equipment, cu / ag film are deposited on cd1 - xznxte substrate by dc magnetron sputtering in order to get the influences of the main experiments parameters such as sputtering power, gas flow, vacuum air pressure, magnetoelectricity power and substrate temperature on deposition rate of film, discovered that dc sputtering power is the most key factor influencing the deposition rate

    在jgp560c型超高真空多功能磁控濺射鍍膜機上，採用直流磁控濺射法在cdznte晶體上制備出cu ag合金薄膜，揭示了氣體流量、直流濺射功率、勵磁電源功率、工作氣壓和襯底溫度等工藝參數對沉積速率的影響規律。結果表明濺射功率對沉積速率的影響最大，隨濺射功率的增大沉積速率快速增大。
  4. The suitable additives recombination can not only improve considerably the quality of chromium coating, increase the brightness, current efficiency, dispersion ability and sedimentation velocity, but also enlarge the application scope of chromium plating technology

    採用適當的添加劑復合不僅可以顯著提高鍍鉻層質量，增加光亮度、電流效率、分散能力和沉積速度，而且可以擴大鍍鉻工藝范圍。
  5. Using contrast and orthogonal experiment methods, the effect of electrolyte formulae for varied concentration of cr03 and technology of chromium plating on coating property was studied systematically in this paper. primary factors and their interrelations, which influence the brightness of coating, the current efficiency, dispersion ability and sedimentation velocity of electrolyte were discovered

    本文採用對比試驗和正交試驗等方法系統地研究了低、中、高三種不同鉻酐濃度的鍍鉻液組成和鍍鉻工藝對鍍鉻層性能的影響，找到了影響鍍層光亮度、鍍液電流效率、分散能力和沉積速度的主要因素及其相互關系。
  6. The technical parameters and the performance of ( ni - p ) - sic composite coating obtained in centrifugal field are also studied the cyclic voltammeter and the cathode polarization techniques have been used to study the effect of additives on ni - p alloy coatings

    本文提出了在離心力場中高速電沉積的方法，並對離心電沉積（ ni - p ） - sic復合鍍層的影響因素及鍍層性能進行了研究。
  7. Application of continuous high speed plating technology in ic lead frame production

    連續高速電鍍技術在集成電路引線框架生產中的應用
  8. Besides, scan rate and cycle period also affect the result ; co - deposition of dualistic oxide is a focus of research, as an element in the same group, ir is selected. deposition rate of composition is decreased by the adding of ir composition, and when the proportion of ir exceeded 50 %, composition procession can be ceased. but cooperation of ir and ru oxide can highly increase the specific capacitance of active material ; annealing treatment under a certain temperature can help to change the hydrate ru composition into mixture state ru oxide, accordingly increase the stabilization of active material

    研究表明:電解液的配製過程中，氯化釕濃度、溶液ph值、陳化時間、溶液溫度對電鍍效果均有影響，其中溶液ph值是最主要的影響因素;在儀器的使用條件探索中，理論結合實驗確定了本電鍍液體系循環伏安電勢窗的理想范圍，並發現循環伏安掃描速度和掃描周期對電鍍結果也有較大影響;混合氧化物的共沉澱是目前研究熱點，在此選用與釕同一族的銥作為共沉澱元素，銥的加入會阻礙氧化物的沉積速度，銥的比例超過50 %會使沉積作用停止，但是二元氧化物的協同作用使沉積的活性物質比容量大大提高;一定溫度下退火后處理作用會使水合釕化物轉變成混合價態的氧化釕，從而提高活性物質的穩定性。
  9. Our main products are flexible 8 copper bar, 2. 6 oxygen - free copper wire, 0. 4 - 2. 5 copper wire of various sizes, naked 0. 08 - 0. 3 copper wire and tinned wire, which meet the requirements of the clients of different aspects and different levels, especially in the recent years, the developed and introduced flexible 8 oxygen - free copper bar which adopts both electrolytic plate and shot copper as raw material, producing packable speedy draw0. 08 copper wire with characteristics, smooth in appearance, free in burs, good in flexibility and good in drawing, appreciated very much by broad clients

    主要產品包括8軟態銅桿14低氧銅桿2 . 6無氧銅線0 . 4 - 2 . 5各種規格銅線0 . 08 - 0 . 3裸銅線鍍錫線。滿足各方面各層次客戶的要求，特別近年開發引進8軟態無氧銅桿，除可用電解板為原料外更可採用進口優質銅米為原料。生產可包高速拉伸0 . 08銅線，該產品具有外表光滑無毛刺柔軟性好拉伸性能好等特點，深受廣大客戶歡迎。
  10. The company has advanced equipment, computer cad system, precise mould processing equipment, high speed punch, various electroplating production line and precise projection equipment, universal tool microscope, 3 coordinates measuring meters, fluorescent x - ray coating thickness thickness inspecting instruments

    公司設備先進，擁有計算機輔助設計系統，精密模具加工設備，高速精密沖床、各種鍍種的電鍍生產線以及精密投影儀、萬能工具顯微鏡、三坐標測量儀、熒光x線鍍層測厚儀等檢測設備。
  11. High speed thick copper plating of cylinders

    圓筒高速電鍍厚銅層
  12. Profiled anode for high speed continuous plating on thin metal strip

    薄金屬帶材連續高速電鍍異型陽極
  13. The company is a sino - foreign joint - venture enterprise, incorporating smelting, electroslog, refining, forging, steel rolling and tool manufacturing. it has production lines for high speed steel, mould steel, hss circular saw blades, face - sides cutters, mould, blocks, pre - hard fine plate, garden knives, alloy special cutters and planer knives, as well as six production lines for heat treating. the nano coating center is production base for tool & mould steel productions in domestic

    公司是一家集冶煉、電渣重熔、鍛造、軋鋼、精整、工具製造於一體的中外合資企業，擁有高速鋼、冷、熱作模具鋼生產線，高速鋼圓鋸片、三面刃銑刀、模具預硬精板、木工刨刀生產線，高溫熱處理、表面鍍層研發加工中心，是國內最專業的工模具鋼製品化生產基地。
  14. The performance and cost of the two methods were contrasted as well as the techniques, also the application area and prospect of thermal spraying technology were indicated

    對比了高速火焰噴塗與電鍍硬鉻的工藝、性能和成本，提出了採用熱噴塗技術替代電鍍硬鉻的應用領域，展望了其應用前景。
  15. Our business includes : design and develop automatic production lines for precision machinery and electronic industries, provide total solutions of assembly 、 inspection and packing, develop advanced automatic assembly equipments, visual inspection equipments, laser inspection equipments, automatic production equipments for precision connector, feeding and collecting systems for high speed stamping and platingdesign and produce precision automation components, produce and assemble stamping and moulding components

    本公司從事專業的精密機械、電子行業全自動化生產線的設計開發，提供裝配、檢測和包裝自動化整體解決方案，開發先進自動化裝配設備、視覺檢測設備、激光檢測設備、精密連接器自動化生產設備、高速沖床收放料機以及電鍍收放料機，專業設計製造精密自動化零部件，並生產裝配沖壓、注塑零部件等工業製成品。
  16. As one of the largest domestic specialized producers in this field, its precision mould - making technology, high - speed precision punching technology and precision electroplating technology have reached the international advanced level

    其精密模具製造技術高速精密沖壓技術和精密電鍍技術均達到國際先進水平。
  17. With the development of thin film science and technology, various thin film preparation techniques developed rapidly, as a result, conventional so - called filming has developed from single vacuum evaporation to many new film preparation techniques, such as ion plating, sputtering, laser deposition, cvd, pecvd, mocvd, mbe, liquid growth, microwave and mtwecr, etc., of which vacuum evaporation is the common technology for thin film preparation, because it has the distinct advantage of high quality of film deposition, good control - ability of deposition rate and high versatility

    隨著薄膜科學與技術的發展，各種薄膜制備方法得到了迅速發展，傳統的所謂鍍膜，已從單一的真空蒸發發展到包括蒸鍍、離子鍍、濺射鍍膜、化學氣相沉積（ cvd ） 、 pecvd 、 mocvd 、分子束外延（ mbe ） 、液相生長、微波法及微波電子共旋（ mwecr ）等在內的成膜技術。其中電子束蒸發技術是一種常用的薄膜制備技術，它具有成膜質量高，速率可控性好，通用性強等優點。
  18. The results show that the improved structure has obviously reduced pressure drop and increased axial speed of the nozzle, as a result the wallop of electroplating solution is improved and the thickness of diffused layer reduced, the electrodeposition process improved, and what is more, the coating structure has been compacted, crystalline particles fined and the performance improved

    結果表明，結構改進后，明顯減小了壓力損失，提高了噴嘴的抽向速度，電鍍液沖擊鍍件的沖擊力得到提高，有效地減少了擴散層的厚度，改善了電沉積過程，而且使鍍層組織緻密，晶粒細化性能得到提高。
  19. The pd membrane prepared by the modified electroless plating has a high h2 permeation rates, meantime exhibits a good h2 selectivity

    由無電子電鍍過程制備的鈀膜對氫滲透速率高，對氫有良好的選擇性。
  20. The super - speed n icety electroplates the line : 28

    高速精密電鍍線: 28條
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