absent behavior 中文意思是什麼
absent behavior
解釋
迴避行為-
The al matrix composites by reaction synthesis put up high mechanical behavior, well high - temperature properties and excellent wearing quality but the existent difficulties lie in that homogenizing method is not perfect, fundamental research to growth mechanism is absent and the concomitance compound come from reaction is difficult to eliminate at present
反應合成的鋁基復合材料具有常溫力學性能高、高溫性能好和耐磨性突出的優點，而存在的主要研究難題則是整個材料均質化方法不理想、生長機制等基礎理論研究缺乏、反應伴生的化合物難以控制等。 -
My friend ( the accused ) be late because of misremembering sessional time, be informed by the judge to its behavior will adjudge processing with absent, can sit to listen, but have no right to make a speech, namely litigant right is stripped by the judge
我的一位朋友（被告）因把開庭時間記錯而遲到，被法官告知對其行為將以缺席宣判處理，可以坐下來聽，但無權發言，即訴訟權利被法官剝奪。 -
The strange behavior of the absent - minded professor became the nucleus of all the stories
（ 「心不在焉」教授的奇異舉止成為所有故事的中心內容。 ） -
A reliability experiment of thermal aging was carried out for the two types of joints, scanning electron microscopy, energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints, and kinetics model of imc formation was established. the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature, imc growth is more sensitive to the aging temperature than the aging time, the activation energy of cu - al imc growth is 97. 1kj / mol and the major forming cu - al imc are cual2 and cu9al4, the activation energy of au - al imc growth is 40. 1kj / mol and the main au - al imc are au4al and au5al2, with au2al and aual at the interfacial periphery of joints, the rate of cu - al imc growth is about 1000 times slower than that of au - al imc, and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours
研究結果表明:金屬間化合物厚度與老化時間的關系符合拋物線法則，金屬間化合物的生長對老化溫度比老化時間更加敏感; cu - al金屬間化合物生長的激活能為97 . 1kj / mol ，老化后金屬間化合物呈層狀分佈，主要相為cual2和cu9al4 ; au - al金屬間化合物生長的激活能為40 . 1kj / mol ，主要相為au4al和au5al2 ，同時在界面周邊區域生成了au2al和aual ;老化過程中cu - al金屬間化合物生長速率比au - al金屬間化合物生長速率小103數量級;金絲球鍵合點200老化96小時出現了明顯的kirkendall空洞和裂紋，但銅絲球鍵合點200老化2900小時和250老化169小時都沒有形成空洞和裂紋。 -
In our case, given the overall probabilistic nature of the computation and the imprecise behavior of biomolecular elements, some computations would inevitably end with a positive diagnosis even if several or all of the disease symptoms were absent, and vice versa
在我們的例子中，考慮生物分子組件的隨機與不準確性，在一些計算過程中，難免會發生即使只有幾項或完全沒有疾病特徵時，仍出現陽性診斷結果；或剛好相反，在有疾病癥狀時卻無法診斷出來。
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