bismaleimide 中文意思是什麼

bismaleimide 解釋
雙馬來酰亞胺
  1. Research on the curing process of bismaleimide and epoxy resin modified cyanate ester

    雙馬來酰亞胺與環氧改性氰酸酯固化工藝研究
  2. Bismaleimide triazine epoxide woven glass fabric copper - clad lamimates

    雙馬來酰亞胺三嗪環氧玻璃布覆銅箔板
  3. Prepreg for multilayer printed wiring boards - bismaleimide triazine epoxide resin - impregnated glass cloth

    多層印製線路板用半固化片. bismaleimide三氮雜苯環氧樹脂浸漬玻璃布
  4. Bismaleimide specifications - specification no. 19 - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范.製造多層印製板用的規定可燃性能的薄比斯瑪勒米德
  5. Bismaleimide base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的比斯瑪勒米德
  6. Specifications. specification no. 19. thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范:多層印製電路板構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物玻璃纖維編織包銅疊層板材
  7. Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印製電路用基體材料.用於多層印製板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板
  8. Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板
  9. Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板
  10. . 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板
  11. An excellent adhesive was prepared from bismaleimide ( bmi ), epoxy resin ( e - 51 and tde - 85 ), 4, 4 ' - diaminodiphenyl sulfone ( dds ) in this thesis. the influence of liquid rubber and polymer ether imide ( pei ) on the properties ( especially high - temperature strength and the peeling strength ) were discussed, their different toughening characteristics and mechanisms were discussed. last, the process and effection of heat - resisted structural adhesive were studied by adhesive experiment of synchronizer in automobile. the results of investigation made clear : the adhesive, has good properties, especially heat - resisted properity

    根據材料分子設計的原理，研究了二苯甲烷雙馬來酰亞胺（ bmi ） 4 ， 4 』 ?二胺基二苯基碸（ dds ） e ? 51 tde ? 85組成的環氧膠粘劑體系，研究該體系在作為高溫結構膠粘劑使用時的粘接性能；然後研究了用無規羧基液體丁腈橡膠（ ctbn ? x ）和聚醚酰亞胺（ pei ）分別來增韌該體系的增韌效果；最後通過碳纖維耐磨材料與同步器圓錐環的粘接實驗，研究了耐高溫結構膠粘劑的粘接工藝和使用效果。
  12. At the same time, the study shows that adding 30wt cf has little influence on friction coefficient of bismaleimide matrix wearable composite, but it can reduce the wear rating greatly

    研究同時表明， 30份碳纖維的加入，對改性雙馬樹脂基耐磨復合材料的摩擦系數影響不大，卻大大降低了材料的磨損率。
  13. Materials for printed boards and other interconnecting structures - part 2 - 9 : reinforced base materials clad and unclad ; bismaleimide triazine modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    印製板和其它互連結構用材料.第2 - 9部分:包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型玻璃纖維增強層壓板
  14. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - reinforced base materials clad and unclad - bismaleimide triazine, modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    互連結構用材料.包被和非包被增強基材分規范.包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型玻璃纖維增強層壓板
  15. Rheological behavior characterization and modeling of the 4503a bismaleimide resin for rtm processing

    專用雙馬來酰亞胺樹脂體系流變特性及模擬分析研究
  16. Effect of surface modification of kevlar stitch threads on mechanical interfacial properties of carbon fiber bismaleimide stitched composites

    雙馬來酰亞胺樹脂縫合復合材料界面性能的影響
  17. The study of mechanical properties and constitutive equation for bismaleimide modified by o, o - dially phen a

    中高溫和動態力學性能試驗研究及本構方程的建立
  18. The physicochemical characterization was made in depth using various techniques for some resin matrices of advanced composites, such as epoxy resin matrix, phenolic resin matrix and bismaleimide resin. these techniques include infrared spectroscopy ( ir ), nuclear magnetic resonance spectroscopy ( nmr ), mass spectroscopy ( ms ), liquid chromatography ( lc ), thermal analysis ( ta ) and other techniques. the composition, structure, molecular weight, reactivity, reaction temperature and other properties related to performance of resin matrix were studied

    本論文採用紅外光譜、核磁共振波譜、質譜、液相色譜、熱分析等分析技術對實際使用的環氧樹脂、酚醛樹脂以及改性雙馬來酰亞胺樹脂等先進復合材料樹脂基體進行了物理化學表徵，尤其是對與樹脂基體性能密切相關的化學組成與結構、分子量、活性與反應溫度、固化度等進行了表徵；提出了樹脂基體的固化反應機理，獲得了樹脂基體的固化反應動力學參數；對改性雙馬來酰亞胺樹脂的熱分解機理進行了分析，並得到了其熱分解動力學數據。
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