cu-al 中文意思是什麼

cu-al 解釋
一種
  • cu : Cu ＝ 【化學】 cuprum.
  • al : 1. Arab League 阿拉伯聯盟。2. American Legion 美國軍團。
  1. Uses : cold welding of nonferrous metals such as cu al ag ni pt sn zn ta and some of their alloys

    產品用途：對銅、鋁、金、銀、鉑、錫。鉭鈮等有色金屬線材及他們部分合金線材的焊接。
  2. Crevice corrosion of the shape memory alloy cu - zn - al

    形狀記憶合金的縫隙腐蝕
  3. Preparation of single crystal cu - al based shape memory alloy

    系形狀記憶合金制備研究
  4. Fabrication technology of al cu impedance match eos measurement target

    阻抗匹配狀態方程測試靶制備工藝研究
  5. The microstructure of as - deposit hypereutectic ai - si - cu - mg alloy is composed of particulate - shaped si particle and equiaxed grain a - al and few interstices

    多層噴射沉積高硅鋁合金的顯微組織由- al基體，初晶硅及孔隙組成。
  6. The containerless rapid solidification of al - 32. 7wt % cu eutectic alloy in drop tube is investigated. the " lamellar eutectic - anomalous eutectic " microstructural morphology transition occurs with the decrease of droplet size

    採用落管無容器處理技術研究了al - 32 . 7wt cu二元共晶合金在深過冷條件下的快速凝固規律。
  7. In experiment, the dsc technique was used to analyze the effect of electric fields on the precipitate kinetic of al - li alloy solutionized with electric fields. the energy spectrum, tem and sem techniques are employed to investigate the elements solution, precipitates, fracture character, conductivity and vickers hardness. also, the solidification of al - cu eutectic alloy was conducted with the influence of electric fields

    在實驗上，利用dsc熱分析技術，分析了電場作用對al - li合金相析出動力學的影響；採用能譜成份檢測，透射電鏡和掃描電鏡等多種微觀檢測手段，對鋁合金的析出相，斷裂特徵、合金電導率和維氏硬度等性能在電場作用下的變化進行了系統的研究，並觀察了al - cu共晶合金在電場作用下的凝固組織。
  8. Intergranular and exfoliation corrosion behavior of sc - containing al - cu - li - zr alloy

    合金的抗晶間腐蝕和剝落腐蝕性能
  9. Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering, tlp bonding of al mmcs with these interlays, the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil. removing the oxidation on the surface before deposition, copper was coated by magnetron sputtering as tlp bonding interlayer

    待連接表面通過磁控濺射法沉積銅膜作為中間層進行瞬間液相連接，得到的接頭強度與銅箔中間層進行瞬間液相連接得到的接頭強度相當，而使用磁控濺射法去除待連接表面氧化膜后沉積銅膜作為中間層進行瞬間液相連接的接頭強度提高7 . 6左右。
  10. Z. zhang, m. wollgarten and k. urban, " analysis of dislocations in icosahedral al - cu - fe alloy by transmission electron microscopy ", phil. mag. lett., 61 ( 1990 ) 125 - 131

    「鋁銅鐵二十面體準晶中位錯的透射電子顯微學分析」 ， ， （英國）
  11. In this paper, metastable cu - al alloy powder with different aluminum content was prepared by mechanical alloying technique. high strength and high conductivity cu - al2c > 3 composites were prepared by a new type vacuum internal oxidation technique

    本文採用機械合金化法制備了不同鋁含量的亞穩態的cu - al合金粉末，採用新型真空內氧化工藝制備了不同成分的高強度高導電cu - al2o3復合材料。
  12. Microanalysis of combine interfaces of the al cu compound plate

    銅爆炸復合板結合界面的微觀觀察
  13. A reliability experiment of thermal aging was carried out for the two types of joints, scanning electron microscopy, energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints, and kinetics model of imc formation was established. the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature, imc growth is more sensitive to the aging temperature than the aging time, the activation energy of cu - al imc growth is 97. 1kj / mol and the major forming cu - al imc are cual2 and cu9al4, the activation energy of au - al imc growth is 40. 1kj / mol and the main au - al imc are au4al and au5al2, with au2al and aual at the interfacial periphery of joints, the rate of cu - al imc growth is about 1000 times slower than that of au - al imc, and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours

    研究結果表明:金屬間化合物厚度與老化時間的關系符合拋物線法則，金屬間化合物的生長對老化溫度比老化時間更加敏感; cu - al金屬間化合物生長的激活能為97 . 1kj / mol ，老化后金屬間化合物呈層狀分佈，主要相為cual2和cu9al4 ; au - al金屬間化合物生長的激活能為40 . 1kj / mol ，主要相為au4al和au5al2 ，同時在界面周邊區域生成了au2al和aual ;老化過程中cu - al金屬間化合物生長速率比au - al金屬間化合物生長速率小103數量級;金絲球鍵合點200老化96小時出現了明顯的kirkendall空洞和裂紋，但銅絲球鍵合點200老化2900小時和250老化169小時都沒有形成空洞和裂紋。
  14. The microstructure, structure, composition, phase of joint region, and the microstructure and composition of fracture have been analyzed using the equipment of metallurgical microscope, sem, eds, xrd and binary eutectic phase diagram for the al - cu system and diffusion theory

    利用金相顯微鏡、掃描電鏡、能譜儀、 x射線衍射分析儀，結合al - cu二元合金相圖及擴散理論，分析了接頭區域的形貌、組織、成分、相組成，以及斷口形貌、成分。
  15. Effects of deep cryogenic treatment electrode on cu al alloying during resistance spot welding aluminum alloy

    電極深冷處理與鋁合金點焊的銅鋁合金化
  16. After the cu - al mixed powder was milled 96h, the lattice constant of cu ( 111 ) plane became 0. 3653nm, and the diffraction peaks of aluminum have disappeared completely, which showed that aluminum atoms have dissolved in crystal lattice of copper

    當cu - al混合粉末球磨時間大於96h時， cu的（ 111 ）面的點陣常數變為0 . 3653nm ， al的衍射峰已完全消失。通過分析可知，經過96h的球磨， al原子已經完全吲溶於cu的晶格中。
  17. Effect of electric currents on static adhesion for cu al contact under ultrahigh vacuum condition

    鋁接觸副靜態粘著的影響
  18. Cu, al, fe foundry waste treatment facility

    銅、鋁、鐵熔爐廢氣處理設備
  19. Two types of internal oxidation techniques were adopted, namely internal oxidation under nitrogen protect and new type vacuum internal oxidation in the present study. both techniques can achieve the oxygen partial pressure that the internal oxidation reaction of cu - al alloy can take place

    本文採用的兩種內氧化工藝，即氮氣保護下的內氧化和新型真空內氧化工藝，都可以滿足cu - al合金發生內氧化的氣氛條件。
  20. Property of cu - al functional gradient material

    梯度功能材料性能研究
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