curing mold 中文意思是什麼
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Non - isothermal mold filling and curing simulation for resin transfer molding
樹脂傳遞成型工藝中樹脂流動和凝固過程的非等溫模擬 -
It has shown that the combination with higher magnetic and mechanic properties of the bonded magnet is presented on the basis of proper curing process temperature, 120 cto 150 c, and the curing agent is and proper mold press, 500 - 600mpa, keeping press time is 20 seconds
固化工藝中的固化溫度不宜過低，應以120到150之間為宜。在壓制過程中，模壓壓力為500 600mpa ，保壓時間為20秒時可以使粘結磁體的密度達到最高值，且具有較好的磁性能和力學性能。
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