dense chip 中文意思是什麼
dense chip
解釋
高密度晶元-
With turning the scale of asic ( appl ication specified integrated circuits ) to s0c ( system on chip ), which conunon1y is composed of mcu, specified function ip cores, memory, periphery interface etc, the ip reuse techno1ogy is very important in s0c design flow, which can realize the constructions of different levels components. the approach of configurable system, method and design f1ow for udsm ( u1tra deep sub micron ) asic, logic system design using hdl 1anguage, coding style, static and dynamic verification strategy are a1so presented in chapter 2. in chapter 3 we study the vlsi - - dsp architecture design, dense computation and high speed high performance digital signal processing unit structure, which includes high speed mac components and distributed arithmetic unit
在工程設計方法及結構化設計和高層次綜合的研究中，介紹了在深亞微米工藝條件使用的方法和asic設計流程，討論了高層次綜合的核心如何從描述推出電路構成的設計思路，針對不同目標的設計技巧討論了採用hdl語言進行邏輯系統設計的方法，給出了用vhdl語言進行代碼設計時的規范和風格，在面向soc的驗證策略討論了動態和靜態的驗證技術，提出了進行單獨模塊驗證、晶元的全功能驗證和系統軟硬體協同驗證的整體策略。 -
Recently, there has been a growing interest in applying the mems ( micro - electro - mechanical systems ) technology to improve the performances and reduce the size, weight, and cost of opto - mechanical switches. more importantly, the mems technology allows the monolithic manufacture of large matrix switches on a single chip. these optical matrix switches are the key missing components for dynamically reconfigurable dwdm ( dense wavelength - division multiplexing ) network
近階段，大家正在把mems （ micro - electro - mechanicalsystems ）技術用在製造光開關上面，因為用mems技術可提高光開關的性能，同時減小器件的體積、成本，最為重要的一點是它可以把光開關做在一塊矽片上，能夠大規模集成光開關陣列，這對于波分復用器dwdm （ densewavelength - divisionmultiplexing ）是很重要的。 -
Sige - on - insulator ( sigeoi ), which appears very recently, integrates both the advantages of soi and that of sige and thus attracts much attention for the potential applications in low voltage, low power consumption, high dense integrated circuits and optoelectronics, system on chip etc. but people are in the very beginning of the sige - oi material fabrication research. this work focuses on these three facets : 1. sige film preparation ; 2
本論文結合以上背景，主要進行了以下幾個方面的研究：一、硅基上sige材料的異質外延生長技術，以及sige薄膜的表徵；二、 sige - oi的simox制備工藝研究；三、 sige - oi材料的smart - cut制備工藝研究，以及sige / si異質結結構中注入h離子的物理效應。
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