electronic assembly 中文意思是什麼

electronic assembly 解釋
電子裝聯
  • electronic : adj. 電子的,電子操縱的;用電子設備生產的;用電子設備完成的。adv. -cally
  • assembly : n 1 集合。2 集會。3 會眾。4 〈A 〉立法會議,議院,(特指)下院〈美國州議會通常稱作 General Assemb...
  1. Eca electronic control assembly

    電子控制總成
  2. Hua sheng electronic has the departments of the motorcycle fitting, the electronic warm - up, quartz clock fitting and electronic plug - in units, electronic assembly

    華聲擁有摩托車配件、電子取暖、石英鐘配件=電子插件、電子裝配等部門。
  3. There were high correlations between the amount of electronic assembly productions and assembly scores of the ppmt, but no correlation was found between the amount of electronic assembly productions and the msrt scores within the electronic assembly group

    ( 3 )紙雕及木工組病患之判斷空間關系速度與實際從事工作時之責任感、理解力、技巧、細動作協調、工作行?類總分,在統計上呈顯著相關。
  4. Electronic assembly process planning, especially the pca ( print circuit assembly ) process planning concerns much skill and knowledge. to enhance the efficiency of process planning and to improve the condition of the process management, a knowledge - based capp ( computer aided process planning ) system was established in this paper

    電子裝配工藝設計,尤其是印製電路板組裝( pca )工藝設計是一項知識性、經驗性很強的工作,為提高電子裝配工藝編制效率、改善工藝管理狀況,本文建立了基於知識的電子裝配capp系統。
  5. Attachment materials for electronic assembly - requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用的連接材料.電子焊接設備用的電子分級焊料合金和助熔劑和非助熔劑的要求
  6. Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用連接材料.第1 - 3部分:電子焊接用電子級釬焊合金及有焊劑和無焊劑的固體焊料的要求
  7. Attachment materials for electronic assembly - part 1 - 2 : requirements for solder pastes for high - quality interconnections in electronics assembly

    電子組件用連接材料.第1 - 2部分:電子組件中高質量互連用焊膏的要求
  8. Electronic assembly manufacturers qualification profile

    電子配件生產商資格證明綱要
  9. Attachment materials for electronic assembly - requirements for soldering fluxes for high - quality interconnections in electronics assembly

    電子組件用的連接材料.電子組件中的優質互連接器用軟焊釬助熔劑的要求
  10. Lf305a is designed for widely electronic assembly applications. it is a lead - free, mildly active solder paste

    Lf305a這種材料的設計被廣泛應用於電子零件的裝配.它是一種無鉛,低活性硬質糊狀物
  11. General specification for semiconductor opto - electronic assembly

    半導體光電組件總規范
  12. Developing and producing base of electronic assembly equipment

    電子裝聯設備開發生產項目
  13. Shanxi huayi electronic assembly equipment group co. ltd

    山西華藝電子裝聯設備集團股份有限公司
  14. On the basis of analyzing the knowledge used in the course of electronic assembly process planning, an object model of knowledge and electronic assembly knowledge representation language ( eakrl ) which integrates the object class with generative rules were presented. by means of eakrl, knowledge model of electronic assembly was built

    在對電子裝配工藝設計過程中用到的知識進行分析的基礎上,建立了知識的對象模型,採用對象類與產生式規則相結合的方法表示電子裝配工藝設計知識,並建立的電子裝配工藝知識模型。
  15. Mqp electronic assembly manufacturers qualification profile

    電子組件製造商的資格綱要
  16. Industrial automation systems and integration - product data representation and exchange - application protocol - electronic assembly, interconnection, and packaging design

    工業自動化系統和集成.產品數據表示和信息交流.應用協議.電子組裝互連和包裝設計
  17. Electronic assembly terms

    電子裝聯術語
  18. Our aim is a continuous and intelligent investment in research, and to develop processes, equipment, systems and software to bring electronic assembly to its current pinnacle of sophistication

    我們的目標是持續而明智地投資于工藝、設備、系統及軟體的研發,使電子裝配不斷達到更精高的水平。
  19. Electronic assembly : from our electronic engineering design team in zhuhai to our validated assembly lines gri can provide a complete program from design to production of pcb ' s, molded components and final assembly and testing

    在電子裝配方面:世源科技公司由珠海電子研發中心的協作及其獲得驗證的組裝線,完成從設計、生產、最終裝配以及測試的整個項目過程。
  20. Industrial automation systems and integration - product data representation and exchange - part 210 : application protocol : electronic assembly, interconnection and packaging design

    工業自動化系統和集成.產品數據表示和交換.第210部分:應用協議:電子組件互連和封裝設計
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